• Journal of Advanced Marine Engineering and Technology
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• 제41권1호
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• pp.118-124
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• 2017

본 연구대상 디젤기관의 연접봉 볼트, 크랭크 핀 베어링 볼트 등의 손상원인을 조사 분석하기 위하여 수행한 현장검사, 파손부에 대한 시험 및 고찰, 참고문헌 및 연구자의 경험 등을 통하여 다음과 같은 결론을 얻었다. 파손된 크랭크 핀 베어링 볼트는 연접봉 볼트보다 늦게 파손된 것으로 추정된다. 파손된 연접봉 볼트는 충격적인 하중에 의해서 취성파괴된 것이 아니고, 비정상적인 반복하중(예를 들어 체결 볼트의 풀림 등)에 의해서 피로파괴가 되었다는 것을 그 파단면의 모습을 통하여 알 수 있다. 파손된 연접봉 볼트용 U 너트는 윤활유(고착방지제)의 부적절한 사용, 각 실린더와 연접봉 별로 구분되어 사용되지 않았던 것 등으로 인하여 표면 상태가 불량하게 되었고, 이것은 연접봉 볼트의 파손사고에 영향을 미쳤을 가능성이 있다고 할 수 있다. 그리고 파손된 국내 제작품인 연접봉 볼트와 크랭크 핀 베어링 볼트의 기계적 성질, 전조공정 등은 해당 볼트의 설계요건에 적합하다고 할 수 있다.

• 전기의세계
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• 제25권6호
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• pp.65-68
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• 1976

For the RIV characteristics test of power apparatus, an indoor measuring system of radio influence voltage was set up and by means of this measuring unit SIV characteristics on the 7$^{1}$2/" pin-type domestic insulators were examined. According to the test data, RIV values of all the test pieces exceeded the maximum permissible level at 10kV applied voltage. The electrical resistivity of domestic semi-conductive glaze as good as importedone but un-uniformity of coating is turned out to be a main cause of failure.lure.

• 대한조선학회논문집
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• 제40권6호
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• pp.49-57
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• 2003

This method surely needs a hole that causes local strength and stiffness deterioration of the structure because of stress intensity. In this work, three dimensional stress analysis of pin-loaded joint for quasi-isotropic composite laminates was performed using commercial finite element software. Stress distribution was calculated near the edge of the pin-leaded hole and effects of the stacking sequence on the delamination were investigated. Also, the delamination strength of the composite laminates was predicted using the Ye-delamination failure criterion and compared with the experimental results. finally, newly modified failure criterion has been suggested owing to the consideration of effects of interlaminar normal stress on the delamination strength.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1352-1358
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• 2004

The mechanical spring is one of widely used machine elements. Among various kinds, flat-type spring loaded by a rotating pin was studied. A flat spring was simplified to a cantilever beam, and numerical analysis was attempted. Since the loading pin rotates about a separate axis from the fixed spring or vice versa, the location, direction, and magnitude of the contact force including normal contact and friction loads vary accordingly. Meanwhile, the spring is deformed substantially as the relative motion progresses. Therefore, this problem needs to be formulated taking the follower loading characteristics and geometrical non-linearity into account. Derived nonlinear differential equation was solved to yield the spring deflection, contact force and the torque to rotate the pin, and the result was compared with a finite element solution. Also, the influences of principal design parameters were studied. The proposed methodology is expected to be useful for the design of pin-loaded flat spring and the prevention of mechanical failures in the form of yielding or fatigue failure of spring or severe wear of the components.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.29-33
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• 2011

솔더와 PCB Cu 패드와 솔더 경계면에서 발생하는 수직응력과 수평응력을 분석하여 PGA 패키지의 신뢰성 향상을 위한 리드핀의 형상설계에 대한 연구를 수행하였다. 이와 같은 연구를 위해 리드핀의 $20^{\circ}$ 각도 굽힘 변형과 50 ${\mu}m$ 인장조건에서 4인자 3수준의 다구찌 최적설계와 유한요소해석을 수행하였다. 해석결과에 의하면 리드핀의 헤드곡면과 PCB Cu 패드가 접촉하는 폭(d2)이 솔더에서 발생하는 응력감소에 가장 큰 영향을 미치는 인자로 계산되었다. 또한, 다 구찌법의 파라메타 설계에 의해 기존 리드핀 형상모델에 비해 약 18.7%의 등가 von Mises 응력이 감소하는 형상을 도출하였다. 한편, 최대 수직응력이 발생하는 위치가 PCB의 Cu 패드와 솔더의 외곽이 접촉하는 위치이고 최대 수평응력이 발생하는 위치가 SR 층과 솔더의 외곽표면이 접촉하는 위치임을 파악하여, PGA 패키지의 박리 불량은 솔더의 외곽부터 발생하여 내부로 진행될 것으로 예측되었다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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• pp.163-167
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• 2001

A two-dimensional progressive failure analysis method is presented for the strength characterization of the composite joints under pin loading. The eight-nodes laminated she]1 element is utilized based on the updated Lagrangian formulation. The criteria by Yamada-Sun, Tsai-Wu, and the maximum stress are used for the failure estimation. The stiffness of failed layer is degraded by the complete unloading method. No factor depending on test is included in the finite element analysis except for the material strength and stiffness. Total 20 plate specimens with and without hole are tested to validate the finite element prediction. The Tsai-Wu failure criterion most conservatively estimates the strength of laminate, and the maximum stress criterion yields the highest strength because it does not consider the coupling of the failure modes. The strength by Yamada-Sun method neglecting the matrix failure effect are located between other two methods and shows best agreement with test result for laminate with hole.

• Nuclear Engineering and Technology
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• 제56권3호
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• pp.973-979
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• 2024

In the framework of the Generation IV research and development project, in which the French Commission of Alternative and Atomic Energies (CEA) is involved, a main objective for the design of Sodium-cooled Fast Reactor (SFR) is to meet the safety goals for severe accidents. Among the severe ones, the Unprotected Transient OverPower (UTOP) accidents can lead very quickly to a global melting of the core. UTOP accidents can be considered either as slow during a Control Rod Withdrawal (CRW) or as fast. The paper focuses on fast UTOP accidents, which occur in a few milliseconds, and three different scenarios are considered: rupture of the core support plate, uncontrolled passage of a gas bubble inside the core and core mechanical distortion such as a core flowering/compaction during an earthquake. Several levels and rates of reactivity insertions are also considered and the thermal-mechanical behavior of an ASTRID fuel pin from the ASTRID CFV core is simulated with the GERMINAL code. Two types of fuel pins are simulated, inner and outer core pins, and three different burn-up are considered. Moreover, the feedback from the CABRI programs on these type of transients is used in order to evaluate the failure mechanism in terms of kinetics of energy injection and fuel melting. The CABRI experiments complete the analysis made with GERMINAL calculations and have shown that three dominant mechanisms can be considered as responsible for pin failure or onset of pin degradation during ULOF/UTOP accident: molten cavity pressure loading, fuel-cladding mechanical interaction (FCMI) and fuel break-up. The study is one of the first step in fast UTOP accidents modelling with GERMINAL and it has shown that the code can already succeed in modelling these type of scenarios up to the sodium boiling point. The modeling of the radial propagation of the melting front, validated by comparison with CABRI tests, is already very efficient.

• 한국해양공학회지
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• 제18권5호
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• pp.36-42
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• 2004

Orthotropic laminates, such as [$0^{\circ}6$/$90^{\circ}6$]s and [$90^{\circ}6$/$0^{\circ}6$]s, were performed, using a commercial nonlinear finite element method. Interlaminar stress distributions, around the hole curve free-edge, were calculated. The delamination bearing strengths of pin joints were predicted, using the modified delamination failure criterion. These stress distributions were presented along the radial lines and around the free-edge of the hole. Further, three-dimensional non-linear contact analysis of orthotropic laminates was conducted to investigate the effect of friction. In this paper, laminates with a circular hole were taken to study interlaminar stresses the curved edge. This study may assist in the design of a thick composite laminate with mechanically pin joints.

• 한국공간구조학회논문집
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• 제19권3호
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• pp.61-68
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• 2019

A tensegrity module structure is suitable type for spatial structures. Because the tensegrity is composed of set of discontinuous compressive elements (struts) floating within a net of continuous tensile elements (cables), the system can provide the basis for lightweight and strong. However, despite the advantages of tensegrities, design and fabrication of the systems have difficulty because of form-finding methods, pin-connection and the control of prestress. In this paper, the new pin-connection method was invented to make the tensegrity module. The production process and practical implementation of uniformly compressed the tensegrity structures by using a UTM are described. Experiments showed the mechanical response and failure aspects of the tensegrity system.

• Journal of Welding and Joining
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• 제27권4호
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• pp.73-78
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• 2009

Characterization of the microweld CCFL electrode for the TFT-LCD backlight unit was carried out in terms of the glass beading heat treatment conditions. We evaluate the weld zone and parent metal of the microweld CCFL electrodes that were exposed to simulated glass beading heat treatment. The CCFL electrode was composed of the cup made with pure Ni, the pin made with pure Mo and the lead wire made with Ni-Mn alloy. Each part of the electrode was assembled together by micro spot welding process and then the assembled electrodes were exposed to simulated glass beading temperatures of $700^{\circ}C,\;750^{\circ}C$ and $800^{\circ}C$. The microstructures of the microweld CCFL electrode were observed by using optical microscope, scanning electron microscope and EDS. Micro-tensile and microhardness test were also carried out. The results indicated that the grain coarsening in the HAZs(heat affected zones) for both the cup-pin weld and pin-lead wire were exhibited and the grain coarsening of the HAZ for the cup and the lead wire was more obvious than the HAZ of the pin. The micro-tensile test revealed that the fracture occurred at the cup-pin weld zone for all test conditions. The fracture surface could be classified into two parts such as pin portion and cup portion including weld nugget. The failure was seemed to be initiated from the boundary between nugget and pin through the weld joint. The result of the microhardness measurement exhibited that the relatively low hardness value, about 105HV was recorded at the HAZ of the cup. This value was about 50% less than that of the original value of the cup. The reduction of the microhardness was considered as the cause of the grain coarsening due to welding process. It was also appeared that there was no change in electric resistance for the standard electrodes and heat treated electrodes.