• Nuclear Engineering and Technology
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• 제53권11호
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• pp.3837-3851
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• 2021

To investigate how the fabrication and repair of socket welded joints could be used to enhance fatigue resistance under vibration condition, experimental test data of installation conditions that potentially influence fatigue strength were analyzed with the S-N curve. It was found that the decreasing fatigue strength of stainless steel socket welded joints was attributed to the effect of high heat input of welding process. The effect of welding method, slip-on gap and radial-gap conditions on fatigue strength was insignificant. The test data of repair technique application, 2 × 1 leg length and of socket weld overlay, clearly showed higher fatigue strength but there was a limitation for higher stress region because of the weld toe crack.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.279-280
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• 2008

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권4호
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• pp.216-231
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• 2001

Several methods for improving device yields and characteristics have been studied by IC manufacturers, as the options for programming components become diversified through the introduction of novel processes. Especially, the sequential repair steps on wafer level and package level are essentially required in DRAMs to improve the yield. Several repair methods for DRAMs are reviewed in this paper. They include the optical methods (laser-fuse, laser-antifuse) and the electrical methods (electrical-fuse, ONO-antifuse). Theses methods can also be categorized into the wafer-level(on wafer) and the package-level(post-package) repair methods. Although the wafer-level laser-fuse repair method is the most widely used up to now, the package-level antifuse repair method is becoming an essential auxiliary technique for its advantage in terms of cost and design efficiency. The advantages of the package-level antifuse method are discussed in this paper with the measured data of manufactured devices. With devices based on several processes, it was verified that the antifuse repair method can improve the net yield by more than 2%~3%. Finally, as an illustration of the usefulness of the package-level antifuse repair method, the repair method was applied to the replica delay circuit of DLL to get the decrease of clock skew from 55ps to 9ps.

• 센서학회지
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• 제9권1호
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• pp.76-82
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• 2000

본 연구에서는 내부전극 접합기술을 이용하여 적층구조의 PTC 서미스터를 제작하였다. 적층구조 PTC 서미스터는 저항, 소형, 대전류 등의 특징을 갖는다. PTC 특성을 조사하기 위하여 첨가제효과, 전압-전류특성, 온도특성, 복합임피던스 특성 등을 측정하였다. 적층구조 PTC서미스터는 저항의 온도특성과 전압-전류특성에서 높은 비선형성을 나타내었다. 적층수가 증가함에 따라 상온저항이 감소되는 특성이 결정립의 효과에 기인됨을 알았다. 전류의 스윗칭 변화는 적층구조가 갖는 열용량의 크기에 비례하였으며, 적층수가 증가할수록 스윗칭 시간이 증가하였다.