• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.2
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• pp.157-162
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• 2011

High temperature and stress are encounted in power plants and vehicle engines. Therefore, determination of the creep-fatigue life of a material is necessary prior to fabricating equipments. In this study, life design was determined on the basis of the lethargy coefficient for different temperatures, stress and rupture times. SP-Creep test data was compared with computed data. The SP-Creep test was performed to obtain the rupture time for X20CrMoV121 steel. The integration life equation was considered for three cases with various load, temperature and load-temperature. First, the lethargy coefficient was calculated by using the obtained rupture stress and the rupture time that were determined by carrying out the SP-Creep test. Next, life was predicted on the basis of the temperature condition. Finally, it was observed that life decreases considerably due to the coupling effect that results when fatigue and creep occur simultaneously.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.10a
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• pp.376-378
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• 2021

According to the 2020 Global Climate Report released by the World Meteorological Organization, the average temperature of the Earth in 2019 was measured 1.1℃ higher on average than the temperature measured between 1850 and 1900 before industrialization. The change in average temperature affects the distribution of plants, and according to the vulnerability analysis paper, it can be seen that there is a change in the distribution area of plants when the average temperature rises. In this paper, to cope with these environmental changes, we propose a method of fabricating intermittent flow hydroponic smart farms using Arduino and sensors and controlling them through PCs and applications. The manufactured hydroponic smart farm identifies the farm's temperature and humidity, positive pH concentration, illumination, and water quality to check the amount of pumping, supplement LED control, sensor condition, overall management and cultivation of the farm, and grows in an appropriate environment.

• Journal of Adhesion and Interface
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• v.25 no.2
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• pp.43-49
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• 2024

In recent years, the flexible organic synaptic transistor (FOST) has garnered attention for its flexibility, biocompatibility, ease of processability, and reduced complexity, which arise from using organic semiconductors as channel layers. These transistors can emulate the plasticity of the human brain with a simpler structure and lower fabrication costs compared to conventional inorganic synaptic devices. This makes them suitable for applications in next-generation wearable devices and soft robotics technologies. In FOST, the organic substrate is sensitive to the device preparation temperature; high-temperature treatment processes can cause thermal deformation of the organic substrate. Therefore, low-temperature solution-based processing techniques are essential for fabricating high-performance devices. This review summarizes the current research status of low-temperature solution-based FOST devices and presents the problems and challenges that need to be addressed.

• Journal of the Korean Ceramic Society
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• v.56 no.2
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• pp.178-183
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• 2019

A process of fabricating the foamed glass that has closed pores with 8 ~ 580 ㎛ sizes without a blowing agent by sintering 10 ㎛ boron-free glass powder composed of CaO, MgO, SO₃, Al₂O₃-83 wt% SiO₂ at a molding pressure of 0 ~ 120 MPa and a sintering temperature of 750 ~ 1000℃ was investigated. To analyze the glass transition temperature of glass powder, thermogravimetric analysis-differential thermal analysis (TGA-DTA) method were used. The microstructure and pore size of foamed glass were examined using the optical microscopy and field emission scanning electron microscopy (FE-SEM). For the thermal diffusivity and color of the fabricated samples, a heat flow meter and ultraviolet-visible-near-infrared (UV-VIS-NIR)-colormetry were used, respectively. In the TGA-DTA result, the glass transition temperature of glass powder was confirmed to be 626℃. In the microstructure result, closed pores of 7 ~ 20 ㎛ were formed at 750 ~ 900℃, and they were not affected by the molding pressure and sintering temperature. However, at 1,000℃, when there was 0 MPa molding pressure, closed pores of 580 ㎛ were confirmed, and the pore size decreased as the molding pressure increased. Moreover, at a molding pressure of 30 MPa or higher, closed pores of approximately 400 ㎛ were formed. The porosity showed an increasing trend of smaller molding pressure and larger sintering temperature, and it was controllable in the range of 5.69 ~ 68.45%. In the thermal diffusivity result, there was no change according to the molding pressure, and, by increasing the sintering temperature, up to 0.115 W/m·K could be obtained. The Lab color index (CIE-Lab) results all showed a similar translucent white color regardless of molding pressure and sintering temperature. Therefore, based on the foamed glass without boron and blowing agent, it was confirmed that white foamed glass, which has closed pores of 8 ~ 580 ㎛ and a thermal diffusivity characteristic of 0.115 W/m·K, can be fabricated by changing the molding pressure and sintering temperature.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.3
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• pp.398-402
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• 2008

Recently, the development of superconducting fault current limiters (SFCLs) has been required as power demands increase in the power system. A distribution-level prototype resistive SFCL using coated conductor (CC) has been developed by Hyundai Heavy Industries Co., Ltd. and Yonsei University for the first time in the world. The ratings of the SFCL are 13.2kV/630A at normal operating condition. A novel non-inductive winding method is used in fabricating coils so there is almost zero impedance during normal operation. The distribution SFCL is cooled by sub-cooled liquid nitrogen $(LN_2)$ of 65K and 3 bar to enhance cryo-dielectric performance, critical current density, and thermal conductivity. In order to make reliable operation of an SFCL in real power systems, we monitored and controled its operation conditions by using supervisory control and data acquisition (SCADA) method. Thus, a monitoring system for the SFCL employing information technology (IT) is proposed and developed to be on the lookout for the operation conditions such as inside temperature, inside pressure, $LN_2$ level, voltage and current. Since operation temperature should be kept constant, bang-bang control for temperature feedback with a heater attached to the cold head of cryo-cooler is applied to the system. Short-circuit tests with prospective fault current of 10kA and AC dielectric withstand voltage tests up to 143kV for 1 minute were successfully performed at Korea Electrotechnology Research Institute. This paper deals with the development of a distribution level SFCL and its monitoring system for reliable operation.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.647-650
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• 2006

Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.3
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• pp.211-215
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• 2010

Pulsed laser deposition is a very efficient technique for fabricating thin films of complex compounds. In the present work, $Bi_2O_3$-MgO-ZnO-$Nb_2O_5$ (BMZN) pyrochlore thin films were deposited on platinized Si substrates at various temperatures by using pulsed laser deposition technique. These films have been characterized by X-ray diffractometer (XRD), atomic force microscopy (AFM) to investigate their structural, morphological properties. MIM structure was manufactured to analyze di-electrical properties of BMZN thin films. XRD results reveal the thin films deposited at less than $400^{\circ}C$ show only amorphous phase, the crystallized thin films was observed when the thin films were prepared temperature at above $500^{\circ}C$. From AFM, it was known that the thin film grown at $400^{\circ}C$ is the densest. Dielectric constant increased with increasing temperature up to $400^{\circ}C$ at 100 kHz and dramatically decreased at the higher temperature. A aspect of dissipation factor was the exact opposite of dielectric constant. BMZN thin films grown at $400^{\circ}C$ exhibited a high dielectric constant of 60.9, a low dissipation factor of 0.007 at 100 kHz.

• Current Photovoltaic Research
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• v.6 no.1
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• pp.21-26
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• 2018

Beside several advantages, the PV power generation as a clean energy source, is still below the supply level due to high power generation cost. Therefore, the interest in fabricating low-cost thin film solar cells is increasing continuously. $Cu_2O$, a low cost photovoltaic material, has a wide direct band gap of ~2.1 eV has along with the high theoretical energy conversion efficiency of about 20%. On the other hand, it has other benefits such as earth-abundance, low cost, non-toxic, high carrier mobility ($100cm^2/Vs$). In spite of these various advantages, the efficiency of $Cu_2O$ based solar cells is still significantly lower than the theoretical limit as reported in several literatures. One of the reasons behind the low efficiency of $Cu_2O$ solar cells can be the formation of CuO layer due to atmospheric surface oxidation of $Cu_2O$ absorber layer. In this work, atomic layer deposition method was used to remove the CuO layer that formed on $Cu_2O$ surface. First, $Cu_2O$ absorber layer was deposited by electrodeposition. On top of it buffer (ZnO) and TCO (AZO) layers were deposited by atomic layer deposition and rf-magnetron sputtering respectively. We fabricated the cells with a change in the deposition temperature of buffer layer ranging between $80^{\circ}C$ to $140^{\circ}C$. Finally, we compared the performance of fabricated solar cells, and studied the influence of buffer layer deposition temperature on $Cu_2O$ based solar cells by J-V and XPS measurements.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.589-593
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• 2005

Nanoimprinting lithography (NIL) is known as a suitable technique for fabricating nano and micro structures of high definition. Hot embossing is one of NIL techniques and can imprint on thin films and bulk polymers. Key issues of hot embossing are time and expense needed to produce a stamp withstanding a high temperature and pressure. Fabrication of a metal stamp such as an electroplated nickel is cost intensive and time consuming. A ceramic stamp made by silicon is easy to break when the pressure is applied. In this paper, a plastic stamp using a high temperature epoxy was fabricated and tested. The plastic stamp was relatively inexpensive, rapid to produce and durable enough to withstanding multiple hot embossing cycles. The merits of low viscosity epoxy solutions were a fast degassing and a rapid filling the microstructures. The hot embossing process with plastic stamp was performed on PMMA substrates. The hot embossing was conducted at 12.6 bar, $120^{\circ}C$ and 10 minutes. An imprinted PMMA wafer was almost same value of the plastic stamp after 10 times embossing. Entire fabrication process from silicon master to plastic stamp was completed within 12 hours.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.12
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• pp.983-990
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• 2014

This research focused on designing an appropriate thermocouple sensor for a thermal boundary layer with a large temperature gradient. It was designed to minimize the conduction error from a constant temperature wall in a boundary layer. A $79.9-{\mu}m$ thermocouple was chosen, and a five-axis device jig was developed to fabricate a butt-welded thermocouple, which is different from arc-welded junction thermocouples. This was used to minimize the size of the thermocouple junction. In addition to fabricating butt-welded thermocouples, a thorough calibration was conducted to decrease the internal error of a multimeter to ensure that the data from the butt-welded and regular thermocouples were almost the same. Based on this method, a butt-welded thermocouple with a small junction was found to be suitable for measuring the temperature in a thermal boundary layer with very large thermal gradients. Using this thermal boundary layer probe, the thermal boundary layers in a turbine cascade were measured, and the Nusselt numbers were obtained for the turbine endwall.