• Title/Summary/Keyword: FLATNESS

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Study of Stress Distribution of Cold Rolled Steel Sheets in Tension Leveling Process (냉연 형상 교정시 Stress 천이 현상 연구)

  • Choi H. T.;Hwang S. M.;Koo J. M.;Park K. C.
    • Transactions of Materials Processing
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    • v.13 no.6 s.70
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    • pp.497-502
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    • 2004
  • The shape of cold rolled steel sheets is defined as the degree of flatness, and the flatter, the better. Because undesirable strip shapes of cold rolled steel sheets can affect not only visible problem but also automatic working process in customer's lines, the requirement of the customers is more and more stringent. So we usually used the tension leveler to make high quality of strip flatness. For the improvement of the quality of strip flatness, this report developed three- dimensional FEM (Finite Element Method) simulation model, and analysis about the strain and stress distribution of strip in the tension leveling process. The numerical study can be summarized as follows. (1) If we pass the edge wave material (steepness: $1.0\%$) that the stress-difference between the strip center and the edge is 5.2kgf through tension leveler. the stress-difference is decreased 0.45kgf and the steepness is improved to $0.29\%$. (2) If the Intermesh is increased from 6mm to 7mm, the steepness is improved from $0.294\%$ to $0.268\%$. (3) If the initial steepness is decreased form $1.0\%$ to $0.75\%$, the final steepness is improved from $0.294\%$ to $0.263\%$. We know that more increased intermesh and lower initial steepness make the final steepness improved.

A Study on the utilization of electronic micrometer for flatness measurement of precision surface plate (전기마이크로미터를 이용한 정밀측정용 정반의 평면도 측정에 관한 연구)

  • Kim, Gu-Yeong;Woo, In-Hun;Im, Jae-Seon;Jeong, Myeong-Se;Kim, Jong-Eok
    • Journal of the Korean Society for Precision Engineering
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    • v.4 no.3
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    • pp.52-59
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    • 1987
  • The flatness of a precision surface plate is generally measured by using precision angular measuring instruments such as laser interferometers, autocollimators and electronic levels. Since these instruments are expensive and measurement procedures are complex, such methods are not widely used in industries. In this study, an electronic micrometer that is easy to use and inexpensive to produce was developed in order to solve this problem. The flatness of a black granite surface plate, measured using this device was compared with the values obtained by using the conventional three methods. The results were consistent within ${\pm}1{\mu}m$. It proves that the flatness measuring method using electronic micrometers can be utilized for quantitative measurement. An accessory device that can improve the precision of measurement by attaching to the electronic micrometer was also designed and fabricated.

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Control Technique of Modem Output Level to improve Frequency Response Equalization of Satellite TX Terminals (위성 단말 송신부의 주파수 응답 평탄도를 향상시키기 위한 모뎀 출력 조절 방법)

  • Cho, Tae-Chong
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.19 no.5
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    • pp.129-133
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    • 2019
  • Frequency resource efficiency is important in satellite communication systems. One of the causes of a waste of frequency resource is bad flatness. In the case, flatness of satellite Tx terminals would be worse by ACI and guard band. In order to overcome this problem, this paper proposes a technique for frequency response equalization in satellite Tx terminals. First of all, a general linear polynomial expression which meets least squares of representative measurement data is calculated to interpolate unmeasured data. And then flatness can be adjusted using the polynomial expression. Simulation results illustrate adjusted data have lower peak to peak and standard deviation than original data, and these show that flatness be improved.

Prediction Technology of Reverse Setting Block Shape with Inherent Strain Method and Re-meshing Technology (고유 변형도법과 리메슁 기술을 접목한 블록의 역세팅 형상 예측기술)

  • Hyun, Chung-Min;Choi, Han-Suk;Park, Chang-Woo;Kim, Sung-Hoon
    • Journal of Ocean Engineering and Technology
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    • v.31 no.6
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    • pp.425-430
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    • 2017
  • In order to reduce the cost of corrections and time needed for the block assembly process, the reverse setting method is applied for a back-heated block to neutralize deck deformation. The proper reverse setting shape for a back-heated block to correct deformation improved the deck flatness, but an excessive amount of reverse setting could inversely affect the flatness of the block. A prediction method was developed for the proper reverse setting shape using a back-heated block, considering the complex geometry of blocks, thickness of the deck plate, and thermal loading conditions such as welding and back-heating. The prediction method was developed by combining the re-meshing technique and inherent strain-based deformation analysis using the finite element method. Because the flatness deviation was decreased until the lower critical point and thereafter it tended to increase again, the optimum value for which the flatness was the best case was selected by repeatedly calculating the predefined reverse setting values. Based on this analysis and the study of the back-heating deformation of large assembly blocks, including the reverse setting shape, the mechanism for selecting the optimum reverse setting value was identified. The developed method was applied to the actual blocks of a ship, and it was confirmed that the flatness of the block was improved. It is concluded that the developed prediction method can be used to predict the optimum reverse setting shape value of a ship's block, which will reduce the cost of corrections in the construction stage.

Reliability Evaluation System of Hot Plate for Photoresist Baking (Hot Plate 신뢰성 시험.평가시스템 개발)

  • Song, Jun-Yeop;Song, Chang-Gyu;No, Seung-Guk;Park, Hwa-Yeong
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.8
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    • pp.180-186
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    • 2002
  • Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8")\;to\;\Phi300mm$ (wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

Design of Wide-Band Dipole Antennas with Plate for Improving Gain Flatness (이득 평탄도 개선을 위한 광대역 반사판 부 다이폴 안테나 설계)

  • Choi, Hwan-Gi;Choi, Hak-Keun;Kim, Do-Kyung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.7
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    • pp.800-806
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    • 2008
  • In this paper, a wide-band dipole antenna suitable for use in PCS/WCDMA/WiBro($1.750{\sim}2.39\;GHz$) base station array antenna is presented. The presented antenna is a dipole antenna with pate which has the reflector element and improves the gain flatness. To confirm the wide-band characteristics and the gain flatness of the presented antenna, the experimental antenna is fabricated and its radiation characteristics are measured, compared with calculated results. It is shown that the designed antenna has VSWR less than 1.5, gain over 5 dBi, and gain flatness 0.74 dB in $1.75{\sim}2.39\;GHz$. The measured results show good agreement with the calculated results. From these results, we confirm that the designed antenna can be used as a array element of the wide-band base station array antenna for PCS/WCDMA/WiBro.

A comparison and analysis of laser sensors for measuring the flatness and thickness of flat display glass (평판 디스플레이용 유리의 평탄도 및 두께 측정을 위한 레이저 센서의 비교 분석)

  • Kim, Soon-Chul;Han, Chang-Ho;Oh, Choon-Suk
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.8 no.3
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    • pp.71-79
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    • 2008
  • In this paper the glass inspection system for the thickness and flatness is implemented. Laser sensors and robot arms required for glass measurements is tested on the performance assesment. Three kinds of laser sensors are used and analysed, and 3-axis robot arm with the ball-screwed type is implemented. Thus the methods of glass measurement is discussed and the difficulties are solved to propose the solutions. To minimize the errors of glass measurement the system is improved as considered device errors.

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Fabrication of Micro Mirror Array for Small Form Factor Optical Pick-up by Micro UV-Molding (마이크로 UV성형을 통한 초소형 광픽업용 마이크로 미러 어레이 제작)

  • Choi Yong;Lim Jiseok;Kim Seokmin;Sohn Jin-Seung;Kim Hae-Sung;Kang Shinill
    • Transactions of Materials Processing
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    • v.14 no.5 s.77
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    • pp.477-481
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    • 2005
  • Wafer scale micro mirror array with high surface quality for small form factor (SFF) optical pick-up was fabricated by micro UV-molding. To replicate micro mirror array for SFF optical pick-up, a high- precision mold was fabricated using micro-machining technology. Wafer scale micro mirror array was UV-molded using the mold and then the process was optimized experimentally. The surface flatness and roughness of UV-molded micro mirror array were measured by white light scanning interferomety system and analyzed the transcribing characteristics. Finally, the measured flatness of UV-molded micro mirror away for SFF optical pick-up, which was fabricated in the optimum processing condition, was less than 70nm.

Selective Etching of Silicon in TMAH:IPA:Pyrazine Solutions (TMAH:IPA:Pyrazine 용액에서 실리콘의 선택식각)

  • Chung, Gwiy-Sang;Lee, Chae-Bong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.04b
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    • pp.112-116
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    • 2000
  • This paper presents anisotropic ethcing characteristics of single-crystal silicon in tetramethylammonium hydroxide(TMAH):isopropyl alcohol(IPA) solutions containing pyrazine. With the addition of IPA to TMAH solutions, etching characteristics are exhibited that indicate an improvement in flatness on the etching front and a reduction in undercutting, but the etch rate on (100) silicon is decreased. The (100) silicon etch rate is improved by the addition of pyrazine. An etch rate on (100) silicon of $0.8\;{\mu}m/min$, which is faster by 13 % than a 20 wt.% solution of pure TMAH, is obtained using 20 wt.% TMAH:0.5 g/100 ml pyrazine solutions, but the etch rate on (100) silicon is decreased if more pyrazine is added. With the addition of pyrazine to a 25 wt.% TMAH solution, variations in flatness on the etching front were not observed and the undercutting ratio was reduced by 30 ~ 50 %.

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CLASSIFYING MONOIDS BY QUASI-ANNIHILATOR (HOMO)FLATNESS OF THEIR RIGHT REES FACTORS

  • Aminizadeh, Reza;Rasouli, Hamid;Tehranian, Abolfazl
    • Communications of the Korean Mathematical Society
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    • v.35 no.3
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    • pp.697-709
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    • 2020
  • In this paper, the class of quasi-annihilator (homo)flat acts based on the notion of quasi-annihilator ideal is introduced. This class lies strictly between the classes of weakly (homo)flat and principally weakly (homo)flat acts. Some properties of such kinds of flatness are studied. We present some homological classifications for monoids by means of quasiannihilator (homo)flatness of their right Rees factor acts.