• Journal of Aerospace System Engineering
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• v.15 no.6
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• pp.10-18
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• 2021

A flame deflector prevents a launch system from thermal damage by deflecting the exhaust flame of the launch vehicle. During the deflection of the flame, the flame deflector is subjected to a high-temperature and high-pressure flow, which results in thermal ablation damage at the surface. Predicting this ablation damage is an essential requirement to ensure a reliable design. This paper introduces a numerical method for predicting the ablation damage phenomena based on a one-way fluid-structure interaction (FSI) analysis. In the proposed procedure, the temperature and convective heat transfer coefficient of the exhaust flame are calculated using a fluid dynamics analysis, and then the ablation is calculated using a finite element analysis (FEA) based on the user-subroutine UMESHMOTION and Arbitrary Lagrangian-Eulerian (ALE) adaptive mesh technique in ABAQUS. The result of such an analysis was verified by comparison to the ablation test result for a flame deflector.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.130-135
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• 2018

Currently the automobile market is developing eco-friendly vehicles in order to cope with fuel efficiency regulations. Many studies have been conducted to improve travel performance and fuel economy of the environment-friendly vehicles, and vehicle manufacturers study how to manufacture light-weight vehicles for improving fuel economy for both existing vehicles and environment-friendly vehicles. Exemplary light-weight vehicle technologies include optimal design of vehicle body structure which is a light-weight vehicle method by changing component shapes or layout to optimize the vehicle body structure and the new process technology for using new light-weight and very strong materials Various studies.

• Electrical & Electronic Materials
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• v.11 no.11
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• pp.1-8
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• 1998

This paper presents an arificial neuro-fuzzy technique based prtial discharge (PD) pattern classifier to power system application. This may require a complicated analysis method employ -ing an experts system due to very complex progressing discharge form under exter-nal stress. After referring briefly to the developments of artificical neural network based PD measurements, the paper outlines how the introduction of new emerging technology has resulted in the design of a number of PD diagnostic systems for practical applicaton of residual lifetime prediction. The appropriate PD data base structure and selection of learning data size of PD pattern based on fractal dimentsional and 3-D PD-normalization, extraction of relevant characteristic fea-ture of PD recognition are discussed. Some practical aspects encountered with unknown stress in the neuro-fuzzy techniques based real time PD recognition are also addressed.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.56-63
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• 2023

This paper presents a method using finite element analysis and topology optimization to address the issue of overdesign in pressure-explosion proof enclosure doors for semiconductor manufacturing processes. The design conducted in this paper focuses on the pattern design of the enclosure door and its fixation components. The process consists of a solid-filled model, a topology optimization model, and a post-processing model. By applying environmental conditions to each model and comparing the maximum displacement, maximum equivalent stress, and weight values, it was confirmed that a reduction of about 13% in weight is achievable.

• Geomechanics and Engineering
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• v.23 no.3
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• pp.289-300
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• 2020

With the rapid development of the distributed strain sensing (DSS) technology, the strain becomes an alternative monitoring parameter to analyze slope stability conditions. Previous studies reveal that the horizontal strain measurements can be used to evaluate the deformation pattern and failure mechanism of soil slopes, but they fail to consider various influential factors. Regarding the horizontal strain as a key parameter, this study aims to investigate the stability condition of a locally loaded slope by adopting the variable-controlling method and conducting a strength reduction finite element analysis. The strain distributions and factors of safety in different conditions, such as slope ratio, soil strength parameters and loading locations, are investigated. The results demonstrate that the soil strain distribution is closely related to the slope stability condition. As the slope ratio increases, more tensile strains accumulate in the slope mass under surcharge loading. The cohesion and the friction angle of soil have exponential relationships with the strain parameters. They also display close relationships with the factors of safety. With an increasing distance from the slope edge to the loading position, the transition from slope instability to ultimate bearing capacity failure can be illustrated from the strain perspective.

• Journal of Korean Society of Steel Construction
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• v.30 no.1
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• pp.25-35
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• 2018

Resisting strength of ring-stiffened cylindrical steel shell under uniform external pressure was evaluated by geometrically and materially nonlinear finite element method. The effects of shape and amplitude of geometric initial imperfection, radius to thickness ratio, and spacing of ring stiffeners on the resisting strength of ring-stiffened shell were analyzed. The resisting strength of ring-stiffened cylindrical shells made of SM490 obtained by FEA were compared with design strengths specified in Eurocode 3 and DNV-RP-C202. The shell buckling modes obtained from a linear elastic bifurcation FE analysis were introduced in the nonlinear FE analysis as initial geometric imperfections. The radius to thickness ratios of cylindrical shell in the range of 250 to 500 were considered.

• Composites Research
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• v.16 no.4
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• pp.1-9
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• 2003

2 ply laminated composite is regarded to simulate the interply behavior of the belt layer of the tire. It was cone with 3 dimensional FE(Finite Element) analysis to determine interply shear stress and strain. Widthwise, the shear strain was measured by the pin method. These results are compared with those of CLT(classical lamination theory) in center region and those of Kassapoglou's and Kelsey's theory in edge region. In the FE analysis. rubber is assumed as linear elastic material. and rubber/cord laminate as the orthotropic material composed of cord and rubber In the FE result, interlaminar shear stress causing the interlaminar delamination has the largest value in the edge region of the inner rubber layer. Numerical results obtained coincides with CLT well in the center region, and agrees with other theoretical result little in the edge region.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.2
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• pp.153-161
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• 2009

Three-dimensional finite-element methods(FEM) have been used to analyze the thermal stress of an exhaust gas recirculation(EGR) cooler due to thermal and pressure load. Since efficiency and capability of the heat exchanger are mainly dependent on net heat transferring area of the EGR cooler system, the tube inside the system has a numerous dimples on the surface. Thus for finite element analysis, firstly the dimple-typed tube is modeled as a plain element without the dimple, and then the equivalent thermal conductivities and elastic modulus are calculated. This work describes the numerical homogenization procedure of the dimple-typed tube and verifies the equivalent material properties by comparison of a single unit and the actual full model. Finally, the homogenization scheme presented in this study can be efficiently applied to finite element analyses for the thermal stress and deformation behavior of the EGR cooler system with the dimple-typed tube.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.225-231
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• 2012

Drop simulations of the board level in the flip chips with solder joints have been highlighted for years, recently. Also, through the study on the life prediction of thermal fatigue in the flip chips considering underfill, its importance has been issued greatly. In this paper, dynamic analysis using the implicit method in the Finite Element Analysis (FEA) is carried out to assess the factors effecting on flip chips considering underfill. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard is modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. Modal analysis is simulated to find out the relation between drop impact and vibration of the board system.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.