• 한국기계가공학회지
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• 제15권3호
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• pp.28-35
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• 2016

Forging operations are non-stationary processes occurring because of indirect pressure, generally, under conditions of three-dimensional stress and deformation. Furthermore, due to friction and the constraints of die geometry, deformation is not homogeneous. Material flow and deformation are largely determined by the shape of the tools. It is well known that net-shape forging can improve the mechanical strength of the final product as well as reduce material waste. Oxygen-free copper that is used for electrical and electronic components has excellent electrical and thermal conductivity. Oxygen-free copper parts have a low productivity in cutting process. Thus, the forging process is performed in order to improve the low productivity in cutting process. The forging of oxygen-free copper for electrode body parts was modeled using finite element simulation and forging experiments that were conducted for producing electrode body parts at room temperature. In order to reduce the cost of cutting products, the forging was performed in a closed cavity to obtain near-net or net-shape parts.

• Design & Manufacturing
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• 제6권1호
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• pp.24-28
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• 2012

Friction and wear affect all processes involved in the extraction of materials and their conversion into finished products in the die applications such as drawing, extrusion etc. Originating phenomenon from the contact surface between the tool and workpiece, they are usually a hindrance to materials process operations which usually result in damaging the tools, increasing energy consumption, the contamination of processed material by wear particles and also some problems associated with technologies to control friction and wear. The most well established method to control friction and wear is by the application of lubricant such as fluorocarbon. Besides, a surface technique so-called surface modification can be applied to solve the tribology problems of the die applications for both the economical and ecological reasons. In this article, we applied DLC(diamond-like carbon) thin film on alumina ceramic for HT test using the PIID(plasma ion immersion deposition), 4 groups of test specimens were tested up to $200^{\circ}C$ which is a little higher than the normal working temperature of die application. Pin-on-disc tribo-tester was used to test the friction and surfaces were characterized by SEM and EDS and else, the morphology changes of DLC coatings were studied. The present work indicated that the DLC had a great potential to reduce the friction and wear in the alumina die application without lubricants.

• 폴리머
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• 제24권4호
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• pp.538-544
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• 2000

폴리프로필렌 수지를 연속공정으로 발포시킬 때의 공정 변수에 따른 발포체의 구조와 셀 형성에 관한 특성을 연구하였다. 본 실험에서 고려된 발포 공정 변수들은 발포제 함량, 핵제 함량, 다이 온도, 그리고 다이의 치수였다. 셀이 붕괴없이 성장하는데 있어서 발포제인 이소펜탄의 함량은 약 14.5 wt% 이하이었고, 그 이상의 발포 가스가 주입되었을 때에는 압출물이 팽창하는 가스 압력을 극복하지 못하여 셀이 붕괴되는 현상이 나타나며 불안정한 셀 구조를 형성하였다. 핵제는 1 wt%의 소량만으로도 핵제 없이 발포제만으로 생산된 발포체에 비해 약 1/7로 밀도가 감소하였고 셀 밀도는 핵제의 함량에 따라 4배 이상까지 비례하여 증가하였다. 또한, 본 실험에서 상대적으로 낮은 다이 온도였던 17$0^{\circ}C$에서 안정한 셀 구조를 형성하였다. 그러나, 다이 치수를 변화시켜 유도한 압력 감소 속도의 효과는 본 실험에서 두드러지게 나타나지 않았다.

• 한국유기농업학회지
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• 제10권1호
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• pp.35-47
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• 2002

양돈생산에 있어 영양소의 이용율을 증대시키는 것은 절대적으로 필요하다. 가공기술(예를 들면 분쇄, 펠렛팅, 스팀 프레이킹, 로스팅, 익스투르전 및 익스펜딩)의 발전과 더불어, 사료원료의 영양소 이용성이 크게 향상되어 왔다. 분쇄는 입자도의 감소와 함께 가장 널리 사용되는 가공방법이다. 익스펜더는 익스트루더와 유사한 구조이며 짧은 시간으로 고온고압의 과정을 거쳐 생산되어지는 과정이다. 이러한 가공은 펠렛 질을 향상시키기 위해 사용한다. 또한 사료원료의 익스펜딩은 성장 및 영양소 소화율의 향상을 보여준다. 사료 비용은 양돈 생산에 가장 큰 경제적 비중을 차지하기 때문에 영양소 이용률의 극대는 계속적으로 크게 관심이 되어질 것이다. 결국, 이러한 관심은 가축성장과 영양소 소화율에 있어 일률적인 향상을 주게 될 사료가공기술이 계속적으로 되어질 것이다.

• 한국분말재료학회지
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• 제4권4호
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• pp.243-251
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• 1997

Engine valve-shaped TiAl-Mn intermetallics containing 43.5 to 47.5at%Al (Mn/Al=0.036) are successively fabricated by reactive sintering the elemental powder mixtures near-net shaped by extrusion and die forging. A duplex structure consisted of lamellar grains and equiaxed $\gamma$ grains is developed for all compositions, and the areal fraction of the lamellar grains(or equiaxed $\gamma$ grains) decreases (or increases) with increasing Al content. As Al content increased, the elongation increases with accompanying decrease in yield strength and ultimate tensile strength at both room temperature and 80$0^{\circ}C$. This indicates that the suitable composition is Ti-45at%Al-1.6at%Mn in considering the balance of ambient and elevated tensile properties. The reactive-sintered Ti-45Al-1.6Mn alloy shows superior oxidation resistance not only to the plasma arc melted one but also to the heat resistance steel STR35(representative exhaust valve head material for automotive engine). The reactive-sintered Ti-45Al-1.6Mn alloy coated with an oxidizing scale exhibits a better wear resistance than induction hardened martensitic steel STR11(representative exhaust valve tip material for automotive engine).

• 한국식품영양과학회지
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• 제30권1호
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• pp.64-69
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• 2001

In order to use onion pomace produced from concentration processing of onion juice, dried onion pamace and dried onion were mixed with corn grits at levels of 10, 20, and 30% and extruded in a twin-screw extruder. The physical properties of the extruded onion snack were investigated. The expansion ratio of the extruded onion pomace snack and onion snack and onion snack decreased with onion content. The water absorption index decreased with the onion content. The lightness and the redness of the onion snack decreased and increased as the incorporation level of onion increased, respectively. Native corn grits showed crystalline peaks at 15.2$^{\circ}$, 17.3$^{\circ}$, 17.9$^{\circ}$ and 23.3$^{\circ}$. However, the onion snack did not show the crystalline peaks as native corn grits and showed small peaks at 12.9$^{\circ}$ and 19.8$^{\circ}$. The onion snack showed lower gelatinization temperature and enthalpy than raw corn grits regardless of the onion contents. The rupture strength of the onion pomace snack and onion snack increased with the onion concentration.

• Bulletin of the Korean Chemical Society
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• 제31권9호
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• pp.2637-2643
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• 2010

In order to develop a new line injection system for spin draw yarn (FD SDY) fibers, the effect of various parameters in extrusion and melt line conditions on the dispersion and distribution of $TiO_2$ particles within FD PET fibers was investigated. As a result, the dispersibility of $TiO_2$ particles in a PET matrix is found to depend on the particle size and its surface characteristics. Surface modification of $TiO_2$ by dimethyl polysiloxane resulted in the improved dispersibility and affinity of $TiO_2$ particles in the PET matrix. Especially, residence time, mixing temperature, and mixing shear rate in the new line injection system under the SDY spinning process were very important parameters to minimize the agglomeration of $TiO_2$ particles. The FD SDY prepared by the new line injection system was superior to those using the polymerization process and the conventional masterbatch chip dosing process in the color-L and color-b values of the fibers.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 한국식품영양과학회지
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• 제30권2호
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• pp.292-298
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• 2001

This study was conducted to investigate physicochemical properties of extrudates combining 4 levels of squid (0, 3, 5 and 7%) with 3 levels of defatted soy flour (0, 5, and 10%). Blends were adjusted to moisture content of 27% and then extruded in a single-screw laboratory extruder at 170rpm screw speed and 16$0^{\circ}C$ barrel temperature. The extruded materials were dried at 6$0^{\circ}C$ for 8hr to a moisture content of 3~4% and refrigerated at 4$^{\circ}C$ for 12 hour before examination for textural properties, expansion ratio, bulk density, shear force and Hunter color. Expansion ratio of extrudates decreased as squid content increased whereas bulk density and shear force increased. Expansion ratio of extrudates was not significantly different by defatted soyflour level. Bulk density of products decreased as defatted soyflour content increased but shear force of products increased as defatted soyflour content increased. In scores of sensory hedonic evaluation of snacks, appearance, flavor, texture and overall acceptability values had lowered as squid level increased. Therefore, according to materials contents on extrudates increased, nutritional contents of this products increased and also shear force and bulk density in physical properties increased whereas expansion ratio decreased.