• Design & Manufacturing
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• v.6 no.1
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• pp.24-28
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• 2012

Friction and wear affect all processes involved in the extraction of materials and their conversion into finished products in the die applications such as drawing, extrusion etc. Originating phenomenon from the contact surface between the tool and workpiece, they are usually a hindrance to materials process operations which usually result in damaging the tools, increasing energy consumption, the contamination of processed material by wear particles and also some problems associated with technologies to control friction and wear. The most well established method to control friction and wear is by the application of lubricant such as fluorocarbon. Besides, a surface technique so-called surface modification can be applied to solve the tribology problems of the die applications for both the economical and ecological reasons. In this article, we applied DLC(diamond-like carbon) thin film on alumina ceramic for HT test using the PIID(plasma ion immersion deposition), 4 groups of test specimens were tested up to $200^{\circ}C$ which is a little higher than the normal working temperature of die application. Pin-on-disc tribo-tester was used to test the friction and surfaces were characterized by SEM and EDS and else, the morphology changes of DLC coatings were studied. The present work indicated that the DLC had a great potential to reduce the friction and wear in the alumina die application without lubricants.

• Polymer(Korea)
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• v.24 no.4
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• pp.538-544
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• 2000

The characteristics of cell growth and foamed cell structures of PP were investigated by a continuous foaming process. The operating parameters were the contents of blowing agent and nucleating agent, nucleating agent contents, die temperatures and die dimensions. The foaming cells grew without collapse at less than 14.5 wt% of blowing agent, isopentane. But the cells were collapsed when the blowing agent content was more than 14.5 wt%. The foam density dramatically decreased when a very small amount of the nucleating agent, 1 wt%, was added. After the nucleating agent was added, the cell's weight plummeted to one-seventh of its previous weight. Stable foam cell structures were formed at the die temperature of 17$0^{\circ}C$. However, the effects of the pressure drop rate on the cell morphology were not serious.

• Korean Journal of Organic Agriculture
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• v.10 no.1
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• pp.35-47
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• 2002

In swine production, efficiency of utilization of nutrients is imperative. By embracing advances in processing techniques(i.e., fine grinding, pelleting, steam flaking, roasting, extrusion and expanding) nutrient utilization of feeds turfs have greatly improved. Grinding is by far the most commonly used process with reduction of particle size, Expander, like extruders, are high-temperature and pressure-short-term processor. The purpose of using an expander is to improve pellet quality. Also, expanding of dietary ingredients indicates improvements in growth performance and nutrient digestibility. Because feed cost are easily the greatest economic input into swine production, maximizing nutrient utilization is an area that will continue to receive much attention. Therefore, much attention will continue to be placed on feed processing techniques that will give consistent improvements in animal performance and nutrient digestibility.

• Journal of Powder Materials
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• v.4 no.4
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• pp.243-251
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• 1997

Engine valve-shaped TiAl-Mn intermetallics containing 43.5 to 47.5at%Al (Mn/Al=0.036) are successively fabricated by reactive sintering the elemental powder mixtures near-net shaped by extrusion and die forging. A duplex structure consisted of lamellar grains and equiaxed $\gamma$ grains is developed for all compositions, and the areal fraction of the lamellar grains(or equiaxed $\gamma$ grains) decreases (or increases) with increasing Al content. As Al content increased, the elongation increases with accompanying decrease in yield strength and ultimate tensile strength at both room temperature and 80$0^{\circ}C$. This indicates that the suitable composition is Ti-45at%Al-1.6at%Mn in considering the balance of ambient and elevated tensile properties. The reactive-sintered Ti-45Al-1.6Mn alloy shows superior oxidation resistance not only to the plasma arc melted one but also to the heat resistance steel STR35(representative exhaust valve head material for automotive engine). The reactive-sintered Ti-45Al-1.6Mn alloy coated with an oxidizing scale exhibits a better wear resistance than induction hardened martensitic steel STR11(representative exhaust valve tip material for automotive engine).

• Journal of the Korean Society of Food Science and Nutrition
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• v.30 no.1
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• pp.64-69
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• 2001

In order to use onion pomace produced from concentration processing of onion juice, dried onion pamace and dried onion were mixed with corn grits at levels of 10, 20, and 30% and extruded in a twin-screw extruder. The physical properties of the extruded onion snack were investigated. The expansion ratio of the extruded onion pomace snack and onion snack and onion snack decreased with onion content. The water absorption index decreased with the onion content. The lightness and the redness of the onion snack decreased and increased as the incorporation level of onion increased, respectively. Native corn grits showed crystalline peaks at 15.2$^{\circ}$, 17.3$^{\circ}$, 17.9$^{\circ}$ and 23.3$^{\circ}$. However, the onion snack did not show the crystalline peaks as native corn grits and showed small peaks at 12.9$^{\circ}$ and 19.8$^{\circ}$. The onion snack showed lower gelatinization temperature and enthalpy than raw corn grits regardless of the onion contents. The rupture strength of the onion pomace snack and onion snack increased with the onion concentration.

• Bulletin of the Korean Chemical Society
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• v.31 no.9
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• pp.2637-2643
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• 2010

In order to develop a new line injection system for spin draw yarn (FD SDY) fibers, the effect of various parameters in extrusion and melt line conditions on the dispersion and distribution of $TiO_2$ particles within FD PET fibers was investigated. As a result, the dispersibility of $TiO_2$ particles in a PET matrix is found to depend on the particle size and its surface characteristics. Surface modification of $TiO_2$ by dimethyl polysiloxane resulted in the improved dispersibility and affinity of $TiO_2$ particles in the PET matrix. Especially, residence time, mixing temperature, and mixing shear rate in the new line injection system under the SDY spinning process were very important parameters to minimize the agglomeration of $TiO_2$ particles. The FD SDY prepared by the new line injection system was superior to those using the polymerization process and the conventional masterbatch chip dosing process in the color-L and color-b values of the fibers.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Korean Society of Food Science and Nutrition
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• v.30 no.2
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• pp.292-298
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• 2001

This study was conducted to investigate physicochemical properties of extrudates combining 4 levels of squid (0, 3, 5 and 7%) with 3 levels of defatted soy flour (0, 5, and 10%). Blends were adjusted to moisture content of 27% and then extruded in a single-screw laboratory extruder at 170rpm screw speed and 16$0^{\circ}C$ barrel temperature. The extruded materials were dried at 6$0^{\circ}C$ for 8hr to a moisture content of 3~4% and refrigerated at 4$^{\circ}C$ for 12 hour before examination for textural properties, expansion ratio, bulk density, shear force and Hunter color. Expansion ratio of extrudates decreased as squid content increased whereas bulk density and shear force increased. Expansion ratio of extrudates was not significantly different by defatted soyflour level. Bulk density of products decreased as defatted soyflour content increased but shear force of products increased as defatted soyflour content increased. In scores of sensory hedonic evaluation of snacks, appearance, flavor, texture and overall acceptability values had lowered as squid level increased. Therefore, according to materials contents on extrudates increased, nutritional contents of this products increased and also shear force and bulk density in physical properties increased whereas expansion ratio decreased.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.4
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• pp.293-298
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• 2017

In this study, we developed a 3D chocolate printer and studied the conditions needed for chocolate printing. Because chocolate is a mixture of cocoa mass, cocoa butter and sugar particles, its properties vary with temperature, and care is required in melting and extrusion. A chocolate supply unit is composed of a heating block and a syringe pump. It is integrated with a 3-axis linear robot. In order to be more accurate than the existing 3D chocolate printer is, the system was configured so that the printing line width became $430{\mu}m$. Printing performance was studied according to various parameters. The condition needed for printing lines with a stable width was discovered by the experimental design method and has been confirmed by a 2D line test. These 3D printing experiments showed that it was possible to build a 3D shape with an inclination angle of up to $45^{\circ}$ without support. Further, chocolate printing of a 3D shape has been successfully verified with the developed system.