• Elastomers and Composites
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• v.50 no.1
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• pp.49-54
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• 2015

Dynamically vulcanized PMMA/ACM (80 wt%/20 wt%) blend using DCP as a curing agent was prepared using internal mixer. The morphology, mechanical properties, optical properties, melt viscosity and die swell were characterized by using FE-SEM, tensile test, Izod impact test, dynamic mechanical analysis, ARES and capillary rheometer, respectively. The blends show a phase-separated morphology in which ACM are dispersed in PMMA matrix. Dynamically vulcanized blend exhibits higher mechanical properties, higher melt viscosity, and die swell as compared to simple blend. And, the dynamically vulcanized blend showed total transmittance of more than 75% and haze of higher than 90%, which enable it to find potential applications to fabricate an optical diffuser by extrusion process.

• Transactions of Materials Processing
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• v.19 no.5
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• pp.273-276
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• 2010

In this paper, back pressure forging processes of which back pressures are exerted by mechanical forces including spring reaction are simulated by three-dimensional finite element method. The basic three-dimensional approach extended from two-dimensional approach is accounted for. An axisymmetric backward and forward extrusion process having a back pressing die, which is exposed to oscillation of forming load due to variation of reduction ratios with stroke and its related frequent variation of major deforming region, is simulated by both two and three dimensional approaches to justify the presented approach by their comparison. A three-dimensional forging process having a back pressing die attached to the punch by a mechanical spring is simulated and the results are investigated to reveal accuracy of the presented approach.

• Proceedings of the KWS Conference
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• 1995.04a
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• pp.155-159
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• 1995

A16061 alloy reinforced with 10 vol% $\delta$-A1$_2$O$_3$ short fiber have been fabricated by Rheo-compocasting and squeeze casting and extruded at high temperature using conical shape die and curved shape die with various extrusion ratios.. Tensile and hardness tests were carried out to examine mechanical properties of extruded materials and SEM observation of fractured surface was capable of accounting for fracture mechanism and bonding state of fiber and matrix.

• Transactions of Materials Processing
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• v.10 no.1
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• pp.67-74
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• 2001

The cold forging process to produce a long-neck flange is investigated by using model material test. The two stage process with optimum design condition is examined using plasticine, which is suitable to model steel at room temperature. The similarity theory is employed to estimate the forging load of each sequence by strict application of similarity condition between steel(AISI 1015) and plasticine material The model test results are compared with the simulation results and shows good agreement. The proper forging process with least forming energy can be resulted in $25^{\circ}$ of extrusion semi-die angle.

• Proceedings of the Korean Society of Rheology Conference
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• 2001.09a
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• pp.164.2-164
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• 2001

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.283-284
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• 2014

알루미늄 압출은 오랜 기간 산업화가 이루어져 왔으나, 최근 자동차 및 항공기의 경량화 관련하여 고력 알루미늄 압출의 필요성이 높아지고 있다. 이에 따라 고력 알루미늄의 압출을 위한 압출 공정기술과 금형 표면처리기술이 매우 필요하게 되었다. 본 연구에서는 기존의 염욕 질화 샘플과 본 연구에서 개발한 스퍼터링 증착 기술이 적용된 샘플간의 마모시험을 통한 마찰 계수를 비교하였다.

• Polymer(Korea)
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• v.24 no.4
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• pp.538-544
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• 2000

The characteristics of cell growth and foamed cell structures of PP were investigated by a continuous foaming process. The operating parameters were the contents of blowing agent and nucleating agent, nucleating agent contents, die temperatures and die dimensions. The foaming cells grew without collapse at less than 14.5 wt% of blowing agent, isopentane. But the cells were collapsed when the blowing agent content was more than 14.5 wt%. The foam density dramatically decreased when a very small amount of the nucleating agent, 1 wt%, was added. After the nucleating agent was added, the cell's weight plummeted to one-seventh of its previous weight. Stable foam cell structures were formed at the die temperature of 17$0^{\circ}C$. However, the effects of the pressure drop rate on the cell morphology were not serious.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1340-1347
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• 2002

Finite element simulations are being widely used to increase the efficiency and effectiveness of design of bulk metal forming processes. In such simulations, proper consideration of friction condition is crucial in obtaining reliable results. For this purpose, tip test based on backward extrusion was proposed recently. In this lest, a cylindrical billet is positioned in a shallow groove of a counter punch for centering purpose and formation of a radial tip is induced on the extruded end of the workpiece. In this study, the effect of centering groove on tip test was investigated. The quantitative ratio of the shear friction factors between the punch and die was numerically determined depending on the shape of centering groove. Also, surface expansion and pressure distribution along the punch and die were considered in order to better understand the reason that friction condition at the punch compared to the one of die was more severe.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.