• 대한기계학회논문집B
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• 제21권4호
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• pp.486-493
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• 1997

Experimental investigations on the comparison of developments between transient jets and evolving jet diffusion flames have been made in initial injection period. To achieve this experiment, an ignition technique using a residual flame as the ignition source is devised. High speed Schlieren visualizations, and measurements including jet tip penetration velocities and jet widths of the primary vortex are employed to examine the developing processes for several flow conditions. It is seen that the developing behaviors in the presence of flame are greatly different from those in transient jet, and thus the flow characteristics in the transient part are also modified. The discernible differences are shown to consist of the delay of the rollup of the primary vortex, the faster spreading after the rollup due to exothermic expansion, and the survival of only a primary vortex. The growth of primary vortex in the transient jet is properly explained through an impulsively started laminar vortex prior to the interaction. It is also found that the jet tip penetration velocity varies with elapsed time and an increase in Res gives rise to a higher tip penetration velocity.

• 한국분말재료학회지
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• 제14권5호
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• pp.287-291
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• 2007

Oxidation behavior and microstructural characteristics of nano-sized Sn powder were studied. DTA-TG analysis showed that the Sn powder exhibited an endothermic peak at $227^{\circ}C$ and exothermic peak at $560^{\circ}C$ with an increase in weight. Based on the phase diagram consideration of Sn-O system and XRD analysis, it was interpreted that the first peak was for the melting of Sn powder and the second peak resulted from the formation of $SnO_2$ phase. Microstructural observation revealed that the $SnO_2$ powder, heated to $1000^{\circ}C$ under air atmosphere, consisted of agglomerates with large particle size due to the melting of Sn powder during heat treatment. Finally, fine $SnO_2$ powders with an average size of 50nm can be fabricated by controlled heat treatment and ultrasonic milling process.

• Macromolecular Research
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• 제12권5호
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• pp.478-483
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• 2004

Two different diene monomers [dicyclopentadiene (DCPD) and 5-ethylidene-2-norbornene (ENB)] as self-healing agents for polymeric composites were microencapsuled by in situ polymerization of urea and formaldehyde. We obtained plots of the storage modulus (G') and tan $\delta$ as a function of cure time by using dynamic mechanical analysis to investigate the cure behavior of the unreacted self-healing agent mixture in the presence of a catalyst. Glass transition temperatures (T$\_$g/) and exothermic reactions of samples cured for 5 and 120 min in the presence of different amounts of the catalyst were analyzed by differential scanning calorimetry. Of the two dienes, ENB may have advantages as a self-healing agent because, when cured under same conditions as DCPD, it reacts much faster in the presence of a much lower amount of catalyst, has no melting point, and produces a resin that has a higher value of T$\_$g/. Microcapsules containing the healing agent were successfully formed from both of the diene monomers and were characterized by thermogravimetric analysis. Optical microscopy and a particle size analyzer were employed to observe the morphology and size distribution, respectively, of the microcapsules. The microcapsules exhibited similar thermal properties as well as particle shapes and sizes.

• 한국안전학회지
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• 제24권4호
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• pp.40-46
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• 2009

The early identification of thermal hazards associated with a process such as the heats of reaction, exothermic decompositions, and the understanding of thermodynamics before any large scale operations are undertaken. The evaluation of reaction factors and thermal behavior on esterification process in manufacture of concrete mixture agents are described in the present paper. The experiments were performed in the differential scanning calorimetry(DSC), C 80 calorimeter, and thermal screening unit($TS^u$). The aim of the study was to evaluate the thermal stability of single material and mixture in esterification process. We provided the thermal data of chemical materials to present safe operating conditions through this study.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.110.1-110.1
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• 2010

A bench scale slurry bubble column reactor (SBCR) with active-Fe based catalyst was developed for the Fischer-Tropsch synthesis (FTS) reaction. Considering the highly exothermic reaction heat generated in the bench scale SBCR, an effective cooling system was devised consisting of a U-type dip tube submerged in the reactor. Also, the physical and chemical properties of the catalyst were controlled so as to achieve high activity for the CO conversion and liquid oil ($C_{5+}$) production. Firstly, the FTS performance of the FeCuK/$SiO_2$ catalyst in the SBCR under reaction conditions of $265^{\circ}C$, 2.5 MPa, and $H_2/CO=1$ was investigated. The CO conversion and liquid oil ($C_{5+}$) productivity in the reaction were 88.6% and 0.226 $g/g_{cat}-h$, respectively, corresponding to a liquid oil ($C_{5+}$) production rate of 0.03 bbl/day. To investigate the FTS reaction behavior in the bench scale SBCR, the effects of the space velocity and superficial velocity of the synthesis gas and reaction temperature were also studied. The liquid oil production rate increased upto 0.057 bbl/day with increasing space velocity from 2.61 to 3.92 $SL/h-g_{Fe}$ and it was confirmed that the SBCR bench system developed in this research precisely simulated the FTS reaction behavior reported in the small scale slurry reactor.

• 공업화학
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• 제10권7호
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• pp.1046-1051
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• 1999

잠재성 양이온 개시제인 N-benzylpyrazinium hexafluoroantimonate (BPH)가 1 wt % 첨가된 diglycidylether of bisphenol A(DGEBA)/trimethylolpropane triglycidylether(TMP) 에폭시 블렌드의 혼합 조성비에 따른 경화거동과 열안정성에 대해 각각 DSC와 TGA를 통해 조사하였다. 블렌드계의 잠재 특성은 동적 DSC를 이용하여 온도의 증가에 따른 전환율을 구하여 측정하였다. 동적 DSC에 의한 경화 반응의 열분석 결과 경화 반응 초기에는 DGEBA 수지내의 수산기와 BPH, 그리고 에폭사이드와 BPH 사이의 반응에 의해 저온쪽에 약한 피크를 나타내며 고온쪽에는 3차원 가교 구조를 이루는 성장 과정에서의 발열 피크를 나타냄을 알 수 있었다. 경화 반응 기구의 등온 열분석 결과 경화 반응 속도는 TMP 단일 조성에서보다 DGEBA의 함량에 따라 증가하였다. 경화된 에폭시 수지의 열안정성은 DGEBA 함량이 증가할수록 증가하였는데 이는 DGEBA의 안정한 방향족 구조, 수산기의 존재 그리고 높은 분자량의 영향 등으로 설명할 수 있다.

• 한국잠사곤충학회지
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• 제27권2호
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• pp.40-46
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• 1985

구핵부가형 반응성 염료인 C.I. Reactivo Blue 19와 산성 염료인 C.I. Acid Blue 138로 각각 견을 평형염착시켜 온도 및 pH에 따른 염착량 및 고착량을 구하여 각 조건에서의 염착거동을 비교 검토하였다. 1) 염착은 pH 및 온도가 낮을수록 양염료 모두 증가하였고, 반응성 염료인 경우, pH 8.5, 7$0^{\circ}C$에서 최대 고착량을 나타내었다. 2) 산성인 경우 반응성 염료는 산성 염료와 같은 거동을 나타내었다. 3) 산성 및 반응성 염료인 KL은 pH의 감소에 따라 증가하였고, Kp는 전자인 경우 증가, 후자인 경우 감소하였다. 4) 온도가 상승할수록 양염료 모두 KL은 감소하였고, 표준친화력은 증가하였다. 5) 산성 및 반응성 염료의 염착반응은 발열반응이고 표준엔트로피는 정의 값을 나타내었다. 6) 강산성측에서는 산성 반응성 염료 모두 Langmuir형 미착과 Nernst형 미착의 합으로 나타낼 수 있다.

• 열처리공학회지
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• 제10권4호
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• pp.255-265
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• 1997

Precipitation and strengthening mechanisms in squeeze cast Mg-8.5wt%Li-4.5wt%Al have been investigated by differential scanning calorimetry(DSC), scanning electron microscopy(SEM), in-situ and ex-situ X-ray diffraction analysis and hardness measurement. Special emphasis was placed on the investigation of the precipitation behavior by the DSC technique. Microstructural and calorimetric analysis showed that ${\theta}$ and ${\delta}$ precipitates in the b.c.c. ${\beta}$ phase matrix, forming two exothermic peaks at the temperature ranges of $130^{\circ}C{\sim}180^{\circ}C$ and $236^{\circ}C{\sim}280^{\circ}C$. ${\theta}$ and ${\delta}$ dissolve into the matrix forming an endothermic peak at the temperature range of $280^{\circ}C{\sim}352^{\circ}C$. The as-cast microstructure consists of ${\alpha}$, ${\beta}$ and ${\delta}$. Peak strength was obtained after aging for 1 hour at $50^{\circ}C$. The aging time required for the peak strength decreased as the aging temperature increases. The hardness decrease during overaging was due to the coarsening of ${\theta}$ precipitates. Microhardness measurement showed that variation of the hardness of ${\beta}$ matrix was more pronounced than that of the ${\alpha}$ phase, indicating that the ${\beta}$ phase is more responsible for the strengthening of the Mg-8.5wt%Li-4.5wt%Al alloy.