• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.4
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• pp.486-493
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• 1997

Experimental investigations on the comparison of developments between transient jets and evolving jet diffusion flames have been made in initial injection period. To achieve this experiment, an ignition technique using a residual flame as the ignition source is devised. High speed Schlieren visualizations, and measurements including jet tip penetration velocities and jet widths of the primary vortex are employed to examine the developing processes for several flow conditions. It is seen that the developing behaviors in the presence of flame are greatly different from those in transient jet, and thus the flow characteristics in the transient part are also modified. The discernible differences are shown to consist of the delay of the rollup of the primary vortex, the faster spreading after the rollup due to exothermic expansion, and the survival of only a primary vortex. The growth of primary vortex in the transient jet is properly explained through an impulsively started laminar vortex prior to the interaction. It is also found that the jet tip penetration velocity varies with elapsed time and an increase in Res gives rise to a higher tip penetration velocity.

• Journal of Powder Materials
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• v.14 no.5
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• pp.287-291
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• 2007

Oxidation behavior and microstructural characteristics of nano-sized Sn powder were studied. DTA-TG analysis showed that the Sn powder exhibited an endothermic peak at $227^{\circ}C$ and exothermic peak at $560^{\circ}C$ with an increase in weight. Based on the phase diagram consideration of Sn-O system and XRD analysis, it was interpreted that the first peak was for the melting of Sn powder and the second peak resulted from the formation of $SnO_2$ phase. Microstructural observation revealed that the $SnO_2$ powder, heated to $1000^{\circ}C$ under air atmosphere, consisted of agglomerates with large particle size due to the melting of Sn powder during heat treatment. Finally, fine $SnO_2$ powders with an average size of 50nm can be fabricated by controlled heat treatment and ultrasonic milling process.

• Macromolecular Research
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• v.12 no.5
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• pp.478-483
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• 2004

Two different diene monomers [dicyclopentadiene (DCPD) and 5-ethylidene-2-norbornene (ENB)] as self-healing agents for polymeric composites were microencapsuled by in situ polymerization of urea and formaldehyde. We obtained plots of the storage modulus (G') and tan $\delta$ as a function of cure time by using dynamic mechanical analysis to investigate the cure behavior of the unreacted self-healing agent mixture in the presence of a catalyst. Glass transition temperatures (T$\_$g/) and exothermic reactions of samples cured for 5 and 120 min in the presence of different amounts of the catalyst were analyzed by differential scanning calorimetry. Of the two dienes, ENB may have advantages as a self-healing agent because, when cured under same conditions as DCPD, it reacts much faster in the presence of a much lower amount of catalyst, has no melting point, and produces a resin that has a higher value of T$\_$g/. Microcapsules containing the healing agent were successfully formed from both of the diene monomers and were characterized by thermogravimetric analysis. Optical microscopy and a particle size analyzer were employed to observe the morphology and size distribution, respectively, of the microcapsules. The microcapsules exhibited similar thermal properties as well as particle shapes and sizes.

• Journal of the Korean Society of Safety
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• v.24 no.4
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• pp.40-46
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• 2009

The early identification of thermal hazards associated with a process such as the heats of reaction, exothermic decompositions, and the understanding of thermodynamics before any large scale operations are undertaken. The evaluation of reaction factors and thermal behavior on esterification process in manufacture of concrete mixture agents are described in the present paper. The experiments were performed in the differential scanning calorimetry(DSC), C 80 calorimeter, and thermal screening unit($TS^u$). The aim of the study was to evaluate the thermal stability of single material and mixture in esterification process. We provided the thermal data of chemical materials to present safe operating conditions through this study.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.110.1-110.1
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• 2010

A bench scale slurry bubble column reactor (SBCR) with active-Fe based catalyst was developed for the Fischer-Tropsch synthesis (FTS) reaction. Considering the highly exothermic reaction heat generated in the bench scale SBCR, an effective cooling system was devised consisting of a U-type dip tube submerged in the reactor. Also, the physical and chemical properties of the catalyst were controlled so as to achieve high activity for the CO conversion and liquid oil ($C_{5+}$) production. Firstly, the FTS performance of the FeCuK/$SiO_2$ catalyst in the SBCR under reaction conditions of $265^{\circ}C$, 2.5 MPa, and $H_2/CO=1$ was investigated. The CO conversion and liquid oil ($C_{5+}$) productivity in the reaction were 88.6% and 0.226 $g/g_{cat}-h$, respectively, corresponding to a liquid oil ($C_{5+}$) production rate of 0.03 bbl/day. To investigate the FTS reaction behavior in the bench scale SBCR, the effects of the space velocity and superficial velocity of the synthesis gas and reaction temperature were also studied. The liquid oil production rate increased upto 0.057 bbl/day with increasing space velocity from 2.61 to 3.92 $SL/h-g_{Fe}$ and it was confirmed that the SBCR bench system developed in this research precisely simulated the FTS reaction behavior reported in the small scale slurry reactor.

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.1046-1051
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• 1999

Cure behavior and thermal stability of the different ratio of diglycidylether of bisphenol A(DGEBA)/trimethylolpropane triglycidylether(TMP) epoxy blends initiated by 1 wt % N-benzylpyrazinium hexafluoroantimonate (BPH) as a cationic latent catalyst were studied using DSC and TGA, respectively. Latent properties were performed by measurement of the conversion as a function of temperature using dynamic DSC. Dynamic DSC thermograms of DGEBA/TMP blends revealed that the weak peak was formed by complex formation between the hydroxyl groups in DGEBA and BPH, and between epoxides and BPH in low temperature ranges. The strong peak was considered as an exothermic reaction by the formation of three-dimensional network in high temperature ranges. Isothermal DSC revealed that the reaction rate of the blends was found to be higher than that of the neat TMP. The thermal stabilities in the cured resins were increased with increasing the DGEBA content. These results could be interpreted in terms of the stable aromatic structure, existence of hydroxyl group and high molecular weight of DGEBA.

• Journal of Sericultural and Entomological Science
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• v.27 no.2
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• pp.40-46
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• 1985

The equilibrium sorptions of C.I. Reactive Blue 19 and C.I. Reactive Blue 19 and C.I. Acid Blue 138 on Silk fibroin were investigated in the range of 50$^{\circ}C$, 70$^{\circ}C$, 90$^{\circ}C$ and to the pH range from 2.0 to 10.5. The results obtained are summarized as follows: 1) The amount of sorption of reactive dye was increased with the decrease of pH in dyeing solution and temperature. The amount of fixation showed the maximum value to pH 8.5 and 70$^{\circ}C$. 2) In acidic region, the sorption behavior of acid dye was similar to that of reactive dye, and Langmuir adsorption constant was increased with the decrease of pH. 3) Langmuir constant of both dyes was decreased with the increase of temperature, while standard affinity was increased. 4) The reaction of both dyes was exothermic and the values of $\Delta$S$^{\circ}$ were positive. 5) It was found that the sorption behavior of dyes against Silk fibroin could be described as Langmuir adsorption and Nernst distribution in lower pH region.

• Journal of the Korean Society for Heat Treatment
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• v.10 no.4
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• pp.255-265
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• 1997

Precipitation and strengthening mechanisms in squeeze cast Mg-8.5wt%Li-4.5wt%Al have been investigated by differential scanning calorimetry(DSC), scanning electron microscopy(SEM), in-situ and ex-situ X-ray diffraction analysis and hardness measurement. Special emphasis was placed on the investigation of the precipitation behavior by the DSC technique. Microstructural and calorimetric analysis showed that ${\theta}$ and ${\delta}$ precipitates in the b.c.c. ${\beta}$ phase matrix, forming two exothermic peaks at the temperature ranges of $130^{\circ}C{\sim}180^{\circ}C$ and $236^{\circ}C{\sim}280^{\circ}C$. ${\theta}$ and ${\delta}$ dissolve into the matrix forming an endothermic peak at the temperature range of $280^{\circ}C{\sim}352^{\circ}C$. The as-cast microstructure consists of ${\alpha}$, ${\beta}$ and ${\delta}$. Peak strength was obtained after aging for 1 hour at $50^{\circ}C$. The aging time required for the peak strength decreased as the aging temperature increases. The hardness decrease during overaging was due to the coarsening of ${\theta}$ precipitates. Microhardness measurement showed that variation of the hardness of ${\beta}$ matrix was more pronounced than that of the ${\alpha}$ phase, indicating that the ${\beta}$ phase is more responsible for the strengthening of the Mg-8.5wt%Li-4.5wt%Al alloy.