• Journal of Korean Institute of Industrial Engineers
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• v.40 no.2
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• pp.240-249
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• 2014

This study aims to identify an assessment system based on multiple patent indices that can predict the likelihood of success in the commercialization of a patented technology in advance. In addition, we examine the effectiveness of our predictive model in identifying valuable technologies early on. We analyzed 3,063 secondary battery technologies patented in the US over the past 10 years. Our analysis identified 22 of the 25 most promising patented technologies, corresponding with the top 50% of industry-patented technologies that directly and indirectly succeeded in commercialization. These results support our claim that it is possible to identify attributes for the assessment of patent commercial potential to a significant degree. Our system presents a useful assessment index in the forecasting and determination of potential commercial success of patented technologies.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• Electronics and Telecommunications Trends
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• v.39 no.1
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• pp.83-94
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• 2024

There have been continuous requirements for developing more reliable energy storage systems that could address unsolved problems in conventional lithium-ion batteries (LIBs) and thus be a proper option for large-scale applications like energy storage system (ESS). As a promising solution, aqueous metal-ion batteries (AMIBs) where water is used as a primary electrolyte solvent, have been emerging owing to excellent safety, cost-effectiveness, and eco-friendly feature. Particularly, AMIBs adopting mutivalence metal ions (Ca²⁺, Mg²⁺, Zn²⁺, and Al³⁺) as mobile charge carriers has been paid much attention because of their abundance on globe and high volumetric capacity. In this research trend review, one of the most popular AMIBs, zinc-ion batteries (ZIBs), will be discussed. Since it is well-known that ZIBs suffer from various (electro) chemical/physical side reactions, we introduce the challenges and recent advances in the study of ZIBs mainly focusing on widening the electrochemical window of aqueous electrolytes as well as improving electrochemical properties of cathode, and anode materials.