• 통합자연과학논문집
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• 제6권3호
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• pp.183-186
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• 2013

Well defined 1-dimentional (1-D) photonic crystals of polystyrene replicas have been successfully obtained by removing the porous silicon from the free-standing rugate porous silicon/phenylmethylpolysiloxane composite film. Rugate porous silicon was prepared by an electrochemical etching of silicon wafer in HF/ethanol mixture solution. Exfoliated rugate porous silicon was obtained by an electropolishing condition. A composite of rugate porous silicon/phenylmethylpolysiloxane composite film was prepared by casting a toluene solution of phenylmethylpolysiloxane onto the top of rugate porous silicon film. After the removal of the template by chemical dissolution, the phenylmethylpolysiloxane castings replicate the photonic features and the nanostructure of the master. The photonic phenylmethylpolysiloxane replicas are robust and flexible in ambient condition and exhibit an excellent reflectivity in their reflective spectra. The photonic band gaps of replicas are narrower than that of typical semiconductor quantum dots.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.574-574
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• 2012

We report a simple way of fabricating high-quality carbon nanoscrolls (CNSs) by taking advantage of strain relief due to large difference in strain at the interface of graphene and underlying layer. This method allows strain-controlled self rolling-up of monolayer graphene during etching process at predefined positions on SiO2/Si substrates by photolithography. The size and the length of the CNSs can be easily controlled by adjusting the thickness of the underlying layer and by pre-patterning. Raman spectroscopy studies show that the CNSs is free of significant defects, and the electronic structure and phonon dispersion are slightly different from those of two-dimensional graphene. The preparation of high-quality CNSs may open up new opportunities for both fundamental and applied research of CNSs.

• ETRI Journal
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• 제31권6호
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• pp.778-783
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• 2009

To fabricate uniform and reliable thin gold stripes that provide low-loss optical waveguides, we developed a novel liftoff process placing an additional $SiN_x$ layer under conventional photoresists. By patterning a photoresist and over-etching the $SiN_x$, the photoresist patterns become free-standing structures on a lower-cladding. This leads to uniform metal stripes with good reproducibility and effectively removes parasitic structures on the edge of the metal stripe in the image reversal photolithography process. By applying the newly developed process to polymer-based gold stripe waveguide fabrication, we improved the propagation losses about two times compared with that incurred by the conventional image-reversal process.

• 한국전기전자재료학회논문지
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• 제11권8호
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• pp.620-627
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• 1998

For chemical microsensors such as humidity and gas sensors, it is essential to obtain a single pore with a large inner surface and straight structure. In this paper, cylindrical macroporous silicon layers have been formed of p-silicon substrate by anodization in HF-ethanol-water solution with an applied current. The pores grew normal to the (100) surface and were uniformly distributed. The pore diameter was approximately $1.5~2{\mu}m$ with a depth of $20~30{\mu}m$ and the pores were not interconnected, which are in sharp contrast to the porous silicon reported previouly for similarly doped p-Si. Porous silicon diaphragms 18 to $200{\mu}m$ thick were formed by anistropic etching in TMAH solution and then anodization. The fabrication of macroporous silicon and free-standing diaphragms is expected to offer applications for microsensors, micromachining, and separators.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.448-452
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• 2004

The micromachined variable optical attenuator(VOA) was presented in the paper. The VOA has two single mode fiber(SMF) aligned with free space and symmetric parallel plate actuator with microshutter, which can control a amount of light by driving the actuator. In the paper, analysis on driving performances of the VOA was performed and can be reduced threshold voltage through the decreasing displacement actuating range. This paper presents a VOA that is fabricated using bosch deep silicon etching process with silicon on insulator(SOD wafer. The VOA consists of driving electrode, ground electrode, actuating microshutter, and mechanical stopper. In this VOA, actuating shutter is driven by electrostatic force and the threshold voltage is close to 28V, 46V come along with the spring width of 5${\mu}{\textrm}{m}$, 7${\mu}{\textrm}{m}$ respectively. Attenuation range is measured from 2.4㏈ to 16.7㏈.

• 센서학회지
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• 제14권5호
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• pp.357-361
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• 2005

Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.

• 한국진공학회지
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• 제4권S1호
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• pp.130-137
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• 1995

Deopsition of thermal quality SiO2 using a high density plasma ECR CVD process has been demonstrated to give void and seam free gap fill of high aspect ratio metallization structures with a simple oxygen-silane chemistry. This is achieved by continuous sputter etching of the film during the deposition process. A two-step process is utilized to deposit a composite layer for higher manufacturing efficiency. The first step, which has a deposition rate of approximately 0.5 $\mu$m/min., is used to provide complete gap fill between the metal lines. The second step, which has a deposition rate of up to 1.5 $\mu$m/min., is used to deposit a total thickness of 2.0$\mu$m for the intermetal dielectric film. The topography of this composite film is very compatible with subsequent chemicl mechanical polishing(CMP) planarization processing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.976-979
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• 2002

A focusing grating coupler (FGC) was not fabricated by the 'Continuous Path Control' writing strategy but by an electron-beam lithography system of more general exposure mode, which matches not only the address grid with the grating period but also an integer multiple of the address grid resolution (5 nm), To more simplify the fabrication, we are able to reduce a process step without large decrease of pattern quality by excluding a conducting material or layer such as metal (Al, Cr, Au), which are deposited on top or bottom of an e-beam resist to prevent charge build-up during e-beam exposure. A grating pitch period and an aperture feature size of the FGC designed and fabricated by e-beam lithography and reactive ion etching were ranged over 384.3 nm to 448.2 nm, and $0.5{\times}0.5mm^2$ area, respectively, This fabrication method presented will reduce processing time and improve the grating quality by means of a consideration of the address grid resolpution, grating direction, pitch size and shapes when exposing. Here our investigations concentrate on the design and efficient fabrication results of the FGC for coupling from slab waveguide to a spot in free space.

• 대한전자공학회논문지SD
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• 제37권4호
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• pp.1-6
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• 2000

최근에 빠른 쓰기/읽기 속도, 적은 소비 전력과 비휘발성을 가지는 메모리 캐패시터의 유전 재료로서 SrBi/sub 2/Ta/sub 2/O/sub 9/(SBT)에 대한 관심이 집중되고 있다. 강유전체 물질을 이용한 고밀도 FeRAM을 생산하기 위하여서는 식각에 의한 패턴이 형성되어야 한다. 강유전체 물질의 성장과 그 전기적 특성에 관한 연구와 발표는 많이 발표 되고 있다. 그러나, 강유전체 물질의 식각의 어려움 때문에 SBT 박막 식각에 관한 연구는 거의 전무하다고 할 수 있다. 그러므로, SBT 박막의 식각의 특성을 알아보기 위하여, SBT 박막은 CF/sub 4/Ar 가스 플라즈마를 이용하여 MEICP로 식각 되어졌다. XPS를 이용하여 식각 된 SBT 박막의 표면에서의 화학 반응을 분석하였고, XPS 분석을 검증하기 위하여 SIMS 분석을 하여 비교하였다.

• 한국광학회지
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• 제16권2호
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• pp.113-120
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• 2005

LCD-BLU(liquid crystal device-back light unit)에 사용되는 도광판의 미세 산란패턴을 만드는 새로운 방법으로서, 실리콘 웨이퍼의 비등방 식각에 의해 자연적으로 형성되는 3차원 결정면 구조를 이용하는 방법을 제안하였다. 실리콘 3차원 결정면을 갖는 도광판과 프리즘 시트의 원판을 설계 및 제작하였고, casting 공정을 통해 PDMS 재질로 복제된 도광판을 제작하여 특성을 분석하였다. 측정 결과, 기존 인쇄형 도광판에 비해 실리콘피라미드 패턴의 도광판이 $10\%$ 증가된 정면 휘도 효율을 가질 수 있음을 실험적으로 검증하였다.