• The Journal of the Korean dental association
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• v.23 no.12 s.199
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• pp.1031-1037
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• 1985

The purpose of this study was to evaluate the marginal sealing ability of 'vivadent.' Using freshly extracted human teeth and 2% aqueous methylene blue, the marginal leakage of dye in restorative materials such as vivadent with acid etching technique, Durafill with acid etching technique, silar with acid etching technique, Adaptic, and Amalgam were investigated at 37℃ and under temperature cycling in range of 4℃-60℃. The results were as follows; 1. All filling materials showed some degree of marginal penetration by 2% methylene blue dye. 2. Vivadent with acid etching technique revealed effective marginal sealing ability, but under temperature cycling it showed increased marginal leakage. 3. All resins showed greater marginal leakage than amalgam restoration. 4. Vivadent had the most effective marginal sealing ability in experimented resins.

• Restorative Dentistry and Endodontics
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• v.31 no.4
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• pp.263-268
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• 2006

Recently, self-etching adhesive system has been introduced to simplify the clinical bonding proce- dures. It is less acidic compared to the phosphoric acid, thus there is doubt whether this system has enough bond strength to enamel. The purpose of this study was to investigate the influence of additional etching on the adhesion of resin composite to enamel. Ninety extracted bovine permanent anterior teeth were used. The labial surfaces of the crown were ground with 600-grit abrasive paper under wet condition. The teeth were randomly divided into six groups of 15 teeth each. Clearfil SE $Bond^{\circledR},\;Adper^{TM}$ Prompt L-Pop and Tyrian $SPE^{TM}$ were used as self-etching primers. Each self-etching primers were applied in both enamel specimens with and without additional etching. For additional etching groups, enamel surface was pretreated with 32% phosphoric acid (UNI-ETCH, Bisco, Inc., Schaumburg, IL. USA). Hybrid resin composite Clearfil AP-X, (Kuraray Co., Ltd., Osaka, Japan) was packed into the mold and light-cured for 40 seconds. Twenty-four hours after storage, the specimens were tested in shear bond strength. The data for each group were subjected to independent t - test at p < 0.01 to make comparisons among the groups. In Clearfil SE $Bond^{\circledR}$, shear bond strength of additional etching group was higher than no additional etching group (p < 0.01). In $Adper^{TM}$ Prompt L-Pop and Tyrian SPE, there were no significant difference between additional etching and non-etching groups (p > 0.01). In conclusion, self-etching adhesive system with weak acid seems to have higher bond strength to enamel with additional etching, while self-etching adhesive system with strong acid seems not.

• Applied Chemistry for Engineering
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• v.20 no.5
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• pp.557-560
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• 2009

In this study, a new wet etching method and the solution for thinning the glass with the thickness below $100{\mu}m$ were investigated. For the preparation of etching solution with low hydrofluoric acid, it was effective to use $NH_4F$ or $NH_4HF_2$ as a main ingredient with the addition of sulfuric acid or nitric acid. Influence of the composition of mixed acid solution and the temperature on the etching rate was investigated. The addition of anionic surfactant provides the function to prevent the adhesion of sludge generated by the etching reaction. A new wet etching pilot device equipped with streaming generation parts was used to test etching of commercial non-alkali glass and soda lime glass. The non-alkali glass with the thickness of 640 ${\mu}m$ and soda lime glass with the thickness of $500{\mu}m$ were etched to $45{\mu}m$ and $100{\mu}m$, respectively, by using the pilot device. After the etching by pilot device, the roughness degree of the glass surface was maintained at $0.01{\sim}0.02{\mu}m$.

• The korean journal of orthodontics
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• v.40 no.2
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• pp.87-94
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• 2010

Objective: Many studies have carried out research on comparisons between laser etching and conventional etching systems to investigate methods of reinforcing shear bond strength. The purposes of this study were to assess the efficiency of bonding with erbium, chromium doped: yttrium-scandium-gallium-garnet (Er,Cr:YSGG) laser etching combined with the conventional etching technique. Methods: Sixty-four sound premolars, extracted for orthodontic purposes, were randomly divided into 4 groups and treated in the following manner. First group, conventional etching of 37% phosphoric acid for 15 seconds (control); second group, 1.5 W laser etching for 10 seconds followed by conventional etching; third group, conventional etching followed by 1.5 W laser etching; fourth group, 1.5 W laser etching for 15 seconds only. We assessed the shear bond strength, the surface characteristics, and the adhesive remnant index scores between all groups. Results: Experimental groups showed higher shear bond strength than the control group. But no statistically significant differences were found between the second and third groups. Adhesive remnant scores were compared with the Kruskal-Wallis test, and no statistically significant differences were found between all groups. Conclusions: To obtain maximum shear bonding strength, a combined technique of Er,Cr:YSGG and 37% phosphoric acid is useful even though it may be inconvenient.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.118-119
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• 2009

This paper presents the feature profile evolution silicon deep trench etching, which is very crucial for the commercial wafer process application. The silicon deep trenches were etched with the SF6 gas & Hbr gas based process recipe. The optimized silicon deep trench process resulted in vertical profiles (87o~90o) with loading effect of < 1%. The process recipes were developed for the silicon deep trench etching applications. This scheme provides vertically profiles without notching of top corner was observed. In this study, the production of SF6 gas based silicon deep trench etch process much more strongly than expected on the basis of Hbr gas trench process that have been investigated by scanning electron microscope (SEM). Based on the test results, it is concluded that the silicon deep trench etching shows the sufficient profile for practical MOS FET silicon deep trench technology process.

• The Journal of Advanced Prosthodontics
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• v.9 no.4
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• pp.257-264
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• 2017

PURPOSE. To evaluate the adhesion to CAD/CAM feldspathic blocks by failure analysis and shear bond strength test (SBSt) of different restorative systems and different surface treatments, for purpose of moderate chipping repair. MATERIALS AND METHODS. A self-adhering flowable composite (Vertise Flow, Kerr) containing bi-functional phosphate monomers and a conventional flowable resin composite (Premise Flow, Kerr) applied with and without adhesive system (Optibond Solo Plus, Kerr) were combined with three different surface treatments (Hydrofluoric Acid Etching, Sandblasting, combination of both) for repairing feldspathic ceramics. Two commercial systems for ceramic repairing were tested as controls (Porcelain Repair Kit, Ultradent, and CoJet System, 3M). SBSt was performed and failure mode was evaluated using a digital microscope. A One-Way ANOVA (Tukey test for post hoc) was applied to the SBSt data and the Fisher's Exact Test was applied to the failure analysis data. RESULTS. The use of resin systems containing bi-functional phosphate monomers combined with hydrofluoric acid etching of the ceramic surface gave the highest values in terms of bond strength and of more favorable failure modalities. CONCLUSION. The simplified repairing method based on self-adhering flowable resin combined with the use of hydrofluoric acid etching showed high bond strength values and a favorable failure mode. Repairing of ceramic chipping with a self-adhering flowable resin associated with hydrofluoric acid etching showed high bond strength with a less time consuming and technique-sensitive procedure compared to standard procedure.

• Restorative Dentistry and Endodontics
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• v.37 no.1
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• pp.9-15
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• 2012

Objectives: This study evaluated the effect of 2% chlorhexidine digluconate (CHX) with different application times on microtensile bonds strength (MTBS) to dentin in class I cavities and intended to search for ideal application time for a simplified bonding protocol. Materials and Methods: Flat dentinal surfaces with class I cavities ($4mm{\times}4mm{\times}2mm$) in 40 molar teeth were bonded with etch-and-rinse adhesive system, Adper Single Bond 2 (3M ESPE) after: (1) etching only as a control group; (2) etching + CHX 5 sec + rinsing; (3) etching + CHX 15 sec + rinsing; (4) etching + CHX 30 sec + rinsing; and (5) etching + CHX 60 sec + rinsing. Resin composite was builtup with Z-250 (3M ESPE) using a bulk method and polymerized for 40 sec. For each condition, half of the specimens were immediately submitted to MTBS test and the rest of them were assigned to thermocycling of 10,000 cycles between $5^{\circ}C$ and $55^{\circ}C$ before testing. The data were analyzed using two-way ANOVA, at a significance level of 95%. Results: There was no significant difference in bond strength between CHX pretreated group and control group at the immediate testing period. After thermocycling, all groups showed reduced bond strength irrespective of the CHX use. However, groups treated with CHX maintained significantly higher MTBS than control group (p < 0.05). In addition, CHX application time did not have any significant influence on the bond strength among groups treated with CHX. Conclusion: Application of 2% CHX for a short time period (5 sec) after etching with 37% phosphoric acid may be sufficient to preserve dentin bond strength.

• Journal of Welding and Joining
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• v.31 no.2
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• pp.49-56
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• 2013

We have investigated traits of clad metals in hot-rolled clad steel plates, sensitization and mechanical properties of STS 316 steel plate and carbon steel(A516). Clad steel plates were butt-weld by SAW+SMAW, and with the time of heat treatment as the variable, heat treatment was conducted at $625^{\circ}C$, for 80, 160, 320, 640, 1280 minutes. As a way to evaluate it, sectioned weldments and external surfaces were investigated to reveal the degree of sensitization by mechanical property, etching and those of EPR test, results were compared with it. In short, the purpose of this study is suggesting some considerations in developing on-site techniques to evaluate the sensitization of stainless steels.

• Restorative Dentistry and Endodontics
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• v.36 no.5
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• pp.385-396
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• 2011

Objectives: This study evaluated the effects of adhesion variables such as the priming concepts of canal wall and the curing modes of adhesives on the sealing ability of a resin-based root canal filling system. Materials and Methods: Apical microleakage of the Resilon-RealSeal systems filled with 3 different combinations of adhesion variables was compared with the conventional gutta-percha filling using a dye penetration method. Experimental groups were SEDC, Resilon (Resilon Research LLC) filling with self-etch RealSeal (SybronEndo) primer and dual-cure RealSeal sealer; NELC, Resilon filling with no etching, Scotchbond Multi-Purpose (3M ESPE) primer application and light-curing adhesive; and TELC, Resilon filling with Scotchbond Multi-Purpose primer and adhesive used under total etch / wet bonding and lightcure protocols. GPCS, gutta-percha filling with conventional AH26 plus sealer, was the control group. Results: The median longitudinal dye penetration length of TELC was significantly shorter than those of GPCS and SEDC (Kruskal-Wallis test, p < 0.05). In the cross-sectional microleakage scores, TELC showed significant differences from other groups at 2 to 5 mm from the apical foramen (Kruskal-Wallis test, p < 0.05). Conclusions: When a resin-based root canal filling material was used, compared to the self-etching primer and the dual-cure sealer, the total etch/wet-bonding with primer and light-curing of adhesive showed improved apical sealing and was highly recommended.

• Journal of the Korean institute of surface engineering
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• v.31 no.1
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• pp.45-53
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• 1998

Sharp tips are commonly used for applications in fields as diverse as nanolithography, lowvoltage field emitters, emitters, nanoelectroniecs, electrochemisty, cell biology, field-ion and electron microscopy. tungsten wire, mater만 used in this experiment, which test the chip of wafer has been used to the needle of probe card. Tungsten wire was sharpened by electrochemical etching methode to get a typical tip shape.