• Restorative Dentistry and Endodontics
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• 제24권1호
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• pp.240-250
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• 1999

The purpose of this study was to evaluate the effect of different etching time on the shear bond strength and adaptibility of composite to enamel and dentin when used one-bottle adhesive Prime & Bond$^{TM}$ 2.0. The proximal and occlusal surfaces of 88 extracted human molars were ground to expose enamel(n=44) and dentin (=44) using diamond wheel saw. Teeth were randomly assigned to four test groups(n=11) and received the following treatments : Control group were conditioned with 36% phosphoric acid for 20 sec. according to the manufacturer's directions. Experimental 10 sec. group, 30 sec. group and 60 sec. group were conditioned with 36% phosphoric acid for 10 sec., 30 sec. and 60 sec., respectively. Teeth were rinsed and dried for 2 sec. Prime & Bond$^{TM}$ 2.0 were applied according to the manufacturer's directions and Spectrum$^{TM}$ TPH composite resins were bonded to enamel and dentin surfaces. All specimens were stored in distilled water for 24 hours. Eighty specimens were sheared in a Universal Testing Machine with a crosshead speed of 5mm/minute. One way ANOVA and LSD test were used for statistical analysis of the data. Failure modes of all specimens after shear bond strength test were examined and listed. Also, representive postfracture modes and eight specimens were examined under scanning electron microscope. The results of this study were as follows: 1. The shear bond strength to enamel was the highest value in 30 sec. group (20.68${\pm}$8.54MPa) and the lowest value in 10 sec. group (14.92${\pm}$6.07MPa), so there was significant difference of shear bond strength between two groups (p<0.05). But there was no significant difference among other groups (p>0.05). With longer etching time to enamel from 10 sec. to 30 sec., higher the shear bond strength was obtained, but the shear bond strength was decreased at 60 sec. etching time. 2. The shear bond strength to dentin was the highest value in control group (13.08${\pm}$6.25MPa) and the lowest value in 60 sec. group (9.47${\pm}$3.35MPa), but there was no significant difference among the all groups (p>0.05). The eching time over 20 sec. decreased the shear bond strength to dentin. 3. In SEM observation, the enamel and resin interfaces were showed close adaptation with no relation to etching time of enamel. And the dentin and resin interfaces were showed close adaptation at 20 sec. and 30 sec. etching time, but showed some gaps at 10 sec. and 60 sec. etching time. Accordingly, these results indicated that a appropriate etching time in Prime & Bond$^{TM}$ 2.0 was required to be 30 sec. in enamel and 20 sec. in dentin for the high shear bond strength and good adaptation between the composite resin and tooth substance.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.433-433
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• 2012

As the requirement in patterning geometry continuously shrinks down, the termination of etch process at the exact time became crucial for the success in nano patterning technology. By virtue of real-time optical emission spectroscopy (OES), etch end point detection (EPD) technique continuously develops; however, it also faced with difficulty in low open ratio etching, typically in self aligned contact (SAC) and one cylinder contact (OCS), because of very small amount of optical emission from by-product gas species in the bulk plasma glow discharge. In developing etching process, one may observe that coupon test is being performed. It consumes costs and time for preparing the patterned sample wafers every test in priority, so the coupon wafer test instead of the whole patterned wafer is beneficial for testing and developing etch process condition. We also can observe that etch open area is varied with the number of coupons on a dummy wafer. However, this can be a misleading in OES study. If the coupon wafer test are monitored using OES, we can conjecture the endpoint by experienced method, but considering by data, the materials for residual area by being etched open area are needed to consider. In this research, we compare and analysis the OES data for coupon wafer test results for monitoring about the conditions that the areas except the patterns on the coupon wafers for real-time process monitoring. In this research, we compared two cases, first one is etching the coupon wafers attached on the carrier wafer that is covered by the photoresist, and other case is etching the coupon wafers on the chuck. For comparing the emission intensity, we chose the four chemical species (SiF2, N2, CO, CN), and for comparing the etched profile, measured by scanning electron microscope (SEM). In addition, we adopted the Dynamic Time Warping (DTW) algorithm for analyzing the chose OES data patterns, and analysis the covariance and coefficient for statistical method. After the result, coupon wafers are over-etched for without carrier wafer groups, while with carrier wafer groups are under-etched. And the CN emission intensity has significant difference compare with OES raw data. Based on these results, it necessary to reasonable analysis of the OES data to adopt the pre-data processing and algorithms, and the result will influence the reliability for relation of coupon wafer test and whole wafer test.

• 소성∙가공
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• 제13권3호
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• pp.285-289
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• 2004

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

• 대한소아치과학회지
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• 제31권1호
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• pp.26-33
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• 2004

Bonding Agent는 1세대에서 5세대에 거치기까지 많은 발전을 하였고, 최근에는 임상술식과정의 단축에 있어 비약적인 발전을 보였다. 최근에 개발되어 소개된 self-etching priming/bonding agent는 6세대 bonding agent로 분류되며, 이를 이용하여 법랑질 및 상아질에 대한복합 레진의 충전시 발생하는 미세누출을 methylene blue를 이용하여 관찰한 결과, 상아질에서는 기존의 4세대 5세대 접착제와 유의 한 차이가 없었으나, 법랑질에서는 6세대 bonding agent가 통계학적으로 높은 미세누출 양상을 보였다.

• 한국정밀공학회지
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• 제18권2호
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• pp.111-118
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• 2001

Tungsten probe is the most important part of a probe card, which is widely used for the performance test of wafer chips. Electro chemical etching becomes an exclusive choice for mass production of the tungsten probes. In the mass production, not only the shape of the probe but also the shape distribution of machined probes is important. A new method is proposed for the mass production of the tungsten probes. Tungsten wires are separated by a distance, and dipped into electrolyte. The dipping rate is controlled to shape the probes. Several experimental tests are performed to study the machining characteristics. From the test results, machining parameters including electrical conditions and anode position showed significant influences on the shape, repeatability, precision and quality of sharp tips.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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• pp.130-136
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• 2002

Device makers want to make higher density chips as devices shrink, especially WSix poly stack down is one of the key issues. However, EPD (End Point Detection) time delay was happened in DPS+ poly chamber which is a barrier to achieve device shrink because EPD time delay killed test pattern and next generation device. To investigate the EPD time delay, a test was done with patterned wafers. This experimental was carried out combined with OES(Optical Emission Spectroscopy) and SEM (Scanning Electron Microscopy). OES was used to find corrected wavelength in WSix stack down gate etching. SEM was used to confirm WSix gate profile and gate oxide damage. Through the experiment, a new wavelength (252nm) line of plasma is selected for DPS+ chamber to call correct EPD in WSix stack down gate etching for current device and next generation device.

• 대한치과기공학회지
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• 제29권2호
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• pp.141-150
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• 2007

The purpose of this study was to ascertain the bonding durability of self-etching dentin bonding agents to dentin by means of shear bonding strength. Several acid-etching dentin bonding system (ESPE Z100) and self-etching dentin bonding systems (DEN-FIL, GRADIA DIRET) were used. The occlusion surface of human molars were ground flat to expose dentin and treated with the etch bonding system according to manufactures instruction and followed by composite resin application. After 24hours of storage at 37$^{\circ}C$, the shear bonding strength of the specimens was measured in a universal testing machine with a 1mm/min crosshead speed. An one-way analysis of variance and the scheffe test were performed to identify significant differences (p<0.05). The bonded interfacial surfaces and treated dentin surfaces were examined using a SEM. Through the analysis of shear bond strength data and micro-structures of dentin-resin interfaces, following results are obtained. In dentin group, the shear bond strength of DEN-FIL showed statistical superiority in comparison to the other groups and followed by ESPE Z100 and GRADIA DIRECT (p<0.05).

• 대한기계학회논문집A
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• 제25권7호
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• pp.1064-1072
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• 2001

It is very important to evaluate material degradation like temper and carbide embrittlements to secure the reliable and efficient operational conditions and to prevent brittle failure in service. The extent of material deterioration can be accurately evaluated by mechanical test such as impact test or creep test. But it is almost impossible to sample a large specimen from in-service plants. Thus, the material degradation evaluation by a non-destructive method is earnestly required. Recently the non-destructive test technique which uses the grain boundary etching characteristics owing to the variation of material structures has been proposed. However the program for material degradation evaluation using the grain boundary etching method(GEM) in Windows 98 domain doesnt be developed now. The aims of this paper are to develop the program and to complete the new master curve equations for the evaluation of material degradation on in-serviced high temperature components.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.721-725
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• 1996

The microfabricated test structures were used in order to evaluate the stress characteristics in films. The test structures were fabricated using surface micromachining technique, including HF vapor phase etching as an effective release method. The fabricated structures were micro strain gauge, cantilever-type vernier gauge and bridge for stress measurement, and cantilever for stress gradient measurement. The strain was measures by observing the deformation of the structures occurred after release etching and the amount of deformation can be detected by micro vernier gauge, which has gauge resolution of 0.2${\mu}{\textrm}{m}$. The detection principles and the degree of precision for the measured strain were also discussed. The characteristics of residual stress in LPCVD polysilicon films were studied using these test structures. The stress gradient due to the stress variation through the film thickness was calculated by measuring the deflection at the cantilever free end.

• The Journal of Advanced Prosthodontics
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• 제5권4호
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• pp.479-484
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• 2013

PURPOSE. The aim of this study was to evaluate the effects of additional acid etching and curing mechanism (light-curing or self-curing) of a composite resin on the dentin bond strength and compatibility of one-step self-etching adhesives. MATERIALS AND METHODS. Sixteen human permanent molars were randomly divided into eight groups according to the adhesives used (All-Bond Universal: ABU, Clearfil S3 Bond: CS3), additional acid etching (additional acid etching performed: EO, no additional acid etching performed: EX), and composite resins (Filtek Z-250: Z250, Clearfil FII New Bond: CFNB). Group 1: ABU-EO-Z250, Group 2: ABU-EO-CFNB, Group 3: ABU-EX-Z250, Group 4: ABU-EX-CFNB, Group 5: CS3-EO-Z250, Group 6: CS3-EO-CFNB, Group 7: CS3-EX-Z250, Group 8: CS3-EX-CFNB. After bonding procedures, composite resins were built up on dentin surfaces. After 24-hour water storage, the teeth were sectioned to make 10 specimens for each group. The microtensile bond strength test was performed using a microtensile testing machine. The failure mode of the fractured specimens was examined by means of an optical microscope at ${\times}20$ magnification. The data was analyzed using a one-way ANOVA and Scheffe's post-hoc test (${\alpha}$=.05). RESULTS. Additional etching groups showed significantly higher values than the no additional etching group when using All-Bond Universal. The light-cured composite resin groups showed significantly higher values than the self-cured composite resin groups in the Clearfil S3 Bond. CONCLUSION. The additional acid etching is beneficial for the dentin bond strength when using low acidic one-step self-etch adhesives, and low acidic one-step self-etch adhesives are compatible with self-cured composite resin. The acidity of the one-step self-etch adhesives is an influencing factor in terms of the dentin bonding strength and incompatibility with a self-cured composite resin.