• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2012년도 춘계 학술논문 발표대회
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• pp.279-282
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• 2012

This study attempted to the effect on the physical performance of silane coupling agent on solventless epoxy-based concrete surface finishing material for parking floor. Tests were carried out in accordance with KS F 4041 and KS F 4937. The results of compressive strength, flexural compressive are 95.6N/㎟, 25.4N/㎟ and after wheel moving load testing, average abrasive depth is 0.96mm, these results satisfied the quality standard of KS F 4041, KS F 4937. As conclusion, this study confirmed that the silane coupling agent greatly effected on the physical performance of solventless epoxy resin.

• Macromolecular Research
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• 제11권3호
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• pp.202-205
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• 2003

The reactive precursors, vinyl ethers, and epoxy-silicones, were synthesized. The vinyl ether monomers were prepared from primary alcohol and ethyl vinyl ether with mercury (II) acetate. The epoxy-functionalized silicones have been achieved by the controlled, rhodium-catalyzed, chemoselective hydrosilation of vinyl ether with siloxanes or silane. It was shown that the hydrosilation proceeds exclusively at the vinyl ether group of alkenyl vinyl ether without participation at the alkenyl group. The photoinduced cationic polymerization of these monomers was studied and found to be all highly reactive.

• 한국산학기술학회논문지
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• 제12권3호
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• pp.1479-1487
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• 2011

모바일 IT기기 등의 전자부품 분야에서 다기능, 고용량 메모리를 가능하게 하는 패키지의 중요성이 점차 증대되고 있다. 이러한 목적으로 여러개의 칩을 하나의 패키지에 실장하여 다기능, 고용량을 구현하는 Multi Chip Package(MCP)가 활용되고 있다. 이러한 MCP에서 칩과 칩간 접합 혹은 칩과 지지부재(substrate)간 접합을 구현하기위해 에폭시계 필름형 접착제가 사용되고 있다. 에폭시, 아민, 머캡탄, 아이소시아네이트 등의 유기 반응기를 가진 실란커플링제를 적용하여 에폭시계 필름형 접착제에 대한 점착성과 신뢰성을 확인하였다. 결과로부터 에폭시계 반응기를 가진 실란커플링제를 적용한 시료의 점착성과 필특성이 가장 뛰어났으며, 내습 테스트에서 계면파괴가 억제되어 가장 좋은 신뢰성을 나타내었다.

• Nano
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• 제13권11호
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• pp.1850133.1-1850133.9
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• 2018

The hexagonal boron nitride nanosheets (BN) were firstly treated by silane coupling agents 3-aminopropyltriethoxysilane (KH550) and 3-glycidoxypropyl-trimethoxysilane (KH560) to introduce some amino and epoxy (EP) groups on the BN surface. These modified BN nanosheets were incorporated into an EP matrix to prepare BN@KH560/EP composites with excellent thermal conductivity and electrical insulation properties. Results showed that the thermal conductivity of BN@KH560/EP composite with 20 vol% BN dosage was found to be 0.442 W/($m{\cdot}K$), which was 81% higher than that of pure EP resin. Both BN/EP composites treated by KH550 and KH560 showed rather good electrical insulation properties, although the dielectric constant of BN@KH550/EP composites were slightly higher than BN@KH560/EP composites. Moreover, BN@KH560/EP composites also showed better thermal and mechanical properties than that of BN@KH550/EP composites.