• Transactions on Electrical and Electronic Materials
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• v.13 no.4
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• pp.200-203
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• 2012

Epoxy/mica composite was synthesized, in order to use it as an impregnation resin in a vacuum pressure impregnation (VPI) process, for manufacturing a high voltage rotary machine. The average particle size of the mica was 5~7 ${\mu}m$ and its content was 0, 20, 30 and 40 wt%. A plasticizer or a low molecular aliphatic epoxy was also used, to decrease the viscosity of the composite. The AC electrical breakdown strength was estimated in sphere-to-sphere electrodes, and the electrical breakdown data were estimated by Weibull statistical analysis. The electrical breakdown strength became higher with the addition of mica; and that of the system with 20 wt% mica was highest. The electrical breakdown strength of the system with an aliphatic epoxy was higher than that of the system with a, plasticizer.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.317-320
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• 2013

Partial discharge resistance for the epoxy systems with two diluents was investigated in the rod-plane electrodes arrangement, and the effect of electric frequency on the partial discharge resistance was also studied. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and 1,4-butanediol diglycidyl ether (BDGE) or polyglycol (PG) as a reactive diluent was introduced to the DGEBA system, in order to decrease the viscosity of the DGEBA epoxy system. BDGE was acted as a chain extender, and PG acted as a flexibilizer, after the curing reaction. To measure the partial discharge resistance, 5 kV alternating current (ac) with three different frequencies (60, 500 and 1,000 Hz) was applied to the specimen in a rod-plane electrode arrangement, at $30^{\circ}C$. PG had a good effect, while BDGE had a bad effect on the partial discharge resistance of the DGEBA system, regardless of the electric frequency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04c
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• pp.75-79
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• 2008

In this paper, we measured the activation energy of the Bisphenol A type Epoxy resin (DGEBA)-Jeffamine system according to an irradiation. We put the mixed solutions to the silicon mold after mixing both DGEBA(216g) and Jeffamine(93.9g), curing agent of amine system. The mixed solutions were cured in the atmosphere during 24hours after finishing the first curing during 4hours in the vacuum oven under $80^{\circ}C$. The mixed solutions were cured in the atmosphere during 24hours after finishing the second curing during 12hours in the vacuum oven under $60^{\circ}C$ again. Prepared samples were irradiated to the dose rate of 8kGy/hr with 500kGy, 700kGy, 1000kGy, 1500kGy, 2000kGy, 2500kGy. Experimental results indicated activation energy of the samples reduced as the irradiation dose increased because of the peroxides of the Epoxy created by the oxidation and the radiation.

• Proceedings of the Korean Fiber Society Conference
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• 1986.06a
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• pp.35-35
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• 1986

• Transactions on Electrical and Electronic Materials
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• v.16 no.2
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• pp.74-77
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• 2015

The cure kinetics of a neat epoxy system and epoxy/silica composite were investigated by DSC analysis. A cycloaliphatic type epoxy resin was diglycidyl 1,2-cyclohexanedicarboxylate and curing agent was anhydride type. To estimate kinetic parameters, the Kissinger equation was used. The activation energy of the neat epoxy system was 88.9 kJ/mol and pre-exponential factor was 2.64×10¹² min⁻¹, while the activation energy and pre-exponential factor for epoxy/silica composite were 97.4 kJ/mol and 9.21×10¹² min⁻¹, respectively. These values showed that the silica particles have effects on the cure kinetics of the neat epoxy matrix.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.521-531
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• 2021

Vacuum Pressure Impregnation (VPI) is a process that enhances physical properties by coating some types of epoxy resins on windings of stator used in large rotators such as generators and motors. During vacuum and pressurization of the VPI process, resin gas is generated by vaporization of epoxy resin. When the tank is opened for curing after finishing impregnation, resin gas is leaked out of the tank. If the leaked resin gas spreads throughout the workplace, there are safety and environmental problems such as fire, explosion and respiratory problems. So, exhaust system for resin gas is required during the process. In this study, a case study of exhaust efficiency by location of vent was conducted using Computational Fluid Dynamics (CFD) in order to design a system for exhausting resin gas generated by the VPI process. The optimal exhaust system of this study allowed more than 90% of resin gas to be exhausted within 1,800 seconds and reduced the fraction of resin gas below the Low Explosive Limit (LEL).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.38-42
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• 2003

The use of VPI impregnated mica tape as high voltage insulation for large rotating electric machines requires a careful balance of processes and materials to obtain the desired electrical, mechanical and thermal characteristics. The stator insulation systems such as epoxy bonded high voltage mica tape have been produced for many years. One such system employing an epoxy and anhydride impregnating resin developed by Hyundai Heavy Industries, Co. (hereafter, HHI), to satisfy customer requests for an epoxy bonded insulation system. HHI applies the following electrical and thermal evaluations such as dielectric breakdown, voltage endurance, dissipation factor vs. temperature, isothermal weight loss, and so on. A detailed laboratory evaluation can describe specific physical limitations for an insulation system and permit development of long-term operation guidelines that permit full utilization of the proposed system. HHI has found these evaluations very helpful in qualifying insulation system for the repair of both large motors and generators.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.34-37
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• 2000

The effect of novel N-crotyl-N,N-dimethyl-4-methylanilinium hexafluroantimonate (CMH) curing agent on cure behavior and thermal properties of DGEBA epoxy cationic system was investigated. From DSC measurements of DGEBA/CMH system, it was shown that this system exhibits an excellent thermal latent characteristic in a given temperature and reveals complex cure behavior as indicated by multiple exotherms. The conversion and conversion rate of DGEBA/CMH system increased with increasing the concentration of initiator due to high activity of CMH. Viscoelastic properties during gel formation of DGEBA with CMH were investigated by rheological techniques under isothermal condition. The gel time obtained from the modulus crossover. point t(G')=G", was affected by high curing temperature and concentration of CMH, resulting in high degree of network formation in cationic polymerization. The thermal stabilities were discussed in terms of the activation energy for decomposition and thermal factors determined from TGA measurements.ents.

• Journal of Adhesion and Interface
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• v.10 no.3
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• pp.117-126
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• 2009

Epoxy/anhydride systems with silica filler were studied to improve the cure behavior and characteristics. To study the curing process of epoxy/anhydride using DSC and a stress rheometer, it was observed that gelation temperature increased by increasing the thermal rate or in high isothermal conditions, while it was observed that the degree of cure at gelation decreased. Thermal stability of the epoxy/anhydride system showed any increment by increasing silica contents, except slight decrease of weight by containing humidity. The epoxy resin cured with 30% of silica filler decreased coefficient thermal expansion (CTE) about 33% to show $40ppm/^{\circ}C$. Specimens filled with 30 wt% of silica showed 60% increase in storage modulus at $30^{\circ}C$ to show 3909 MPa compared with neat resin to 2,377 MPa. Epoxy/anhydride systems with surface treated silica by silane coupling agent decreased storage modulus.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.207-208
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• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).