• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.320-323
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• 1995

In this paper, in order to improve withstand voltage properties of epoxy resin, IPN(interpenetrating polymer network) method was introduced and the influence was investigated. The sing1e network structure specimen(E series), simultaneous interpenetrating polymer network specimen(EMF series) and pseudo interpenetrating polymer network(EMP series) specimen were manufactured. In order to understand the internal structure properties, scanning electron microscopy method was utilized, rind glass transition temperature was measured. Also, AC voltage dielectric strength, tensile strength and impact strength were measured to investigate influence upon electrical and mechanical properties. As a result, it was confirmed that simultaneous interpenetrating polymer network specimen was the most execellent.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.787-790
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• 2001

Polymer bushing used for overhead line switch was designed and investigated. Requirements of electrical ratings such as partial discharge, ac withstand voltage, impulse voltage and material properties were proposed in accordance with IEEE 386 and pre-standard (PS) 151-146∼147, 170∼180 of KEPCO. The polymer bushing consists of an internal epoxy bushing and external housing made of EPDM rubber. The rubber housing was molded with mold cone. Therefore, the polymer bushing offers several advantages like light weight, good sealing properties, easy installation and excellent performance in contamination. Electric field analysis was also introduced in order to verify the reliability of the design.

• 한국표면공학회지
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• 제36권4호
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• pp.347-355
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• 2003

Roughening of metal surfaces frequently enhances the adhesion strength of metals to polymers by mechanical interlocking. When a failure occurs at a roughened metal/polymer interface, the failure prone to be cohesive. In a previous work, an adhesion study on a roughened metal (oxidized copper-based leadframe)/polymer (Epoxy Molding Compound, EMC) interface was carried out, and the correlation between adhesion strength and failure path was investigated. In the present work, an attempt to interpret the failure path was made under the assumption that microvoids are formed in the EMC as well as near the roots of the CuO needles during compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior of the oxidized copper-based leadframe/EMC interface and failure path. It is believed that this adhesion model can be used to explain the adhesion behavior of other similarly roughened metal/polymer interfaces.

• 한국섬유공학회:학술대회논문집
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• 한국섬유공학회 2001년도 학술발표회 논문집(Proceedings of the Korean Textile Conference) 상
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• pp.47-50
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• 2001

• 공업화학
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• 제9권1호
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• pp.71-75
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• 1998

LCD용의 재료로 사용하기 위하여 새로이 합성된 저분자 액정 중간체들을 이용하여 epoxy resin 구조를 근간으로 하는 측쇄형 선형액정 고분자 및 가교된 측쇄형 액정 고분자를 만들고 이 들의 액정특성에 대하여 조사하였다. Alkyl spacer의 길이가 다른 방향족 amine 말단의 방향족 저분자 액정(ALC(n))과 ethylene glycol diglycidylether로부터 합성된 선형 측쇄형 고분자액정은 DSC 및 편광현미경 관찰로부터 mesogen으로 쓰인 저분자 액정과 같이 네마틱 액정상을 보였으며 spacer $-(CH_2){_n}-$의 길이에 따라 액정상-등방상 전이온도($T_{NI}$)는 even-odd현상을 나타내었다. 선형 및 가교형 측쇄 액정고분자의 $T_{NI}$는 저분자 액정의 그것에 비해 더 낮은 온도에서 나타났으며 또한 가교형 측쇄 액정고분자의 경우에는 가교제인 1,10-diaminodecane 사용량에 따른 $T_g$및 $T_{NI}$의 변화폭이 그렇게 크지 않은 것이 관찰되었다.

• 폴리머
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• 제31권1호
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• pp.68-73
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• 2007

도로 포장용 아스팔트의 성능을 개선하기 위하여 유화중합법으로 반응성 고분자 개질제들을 합성하였다. Styrene, methyl methacrylate (MMA) 및 isoprene과 아스팔트의 아스팔텐 성분의 carboxyl group과 반응시키기 위하여 epoxy ring을 가진 glycidyl methacrylate(GMA)를 단량체로 사용하였다. 단량체의 조성을 다양하게 변화시켜 개질제들을 중합하고, 중합된 개질제와 아스팔트의 상용성을 검토하였다. 혼합이 잘 되는 개질제들에 대하여 시차주사열량계 (DSC)로 $T_g$를 측정하였다. 합성 후 epoxy ring의 존재 여부와 아스팔텐과의 반응성을 알아보기 위해 푸리에 변환 적외선 분광기(FTIR)를 이용하였고, 핵자기공명법(NMR)으로 개질제 분자 구조의 해석을 행하였다. 아스팔트와 혼합이 잘 이루어지는 개질제들은 $T_g$가 $37.5{\sim}56.5^{\circ}C$ 사이이며, isoprene의 비율이 30 wt%이었다.

• 폴리머
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• 제33권6호
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• pp.530-536
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• 2009

고리지방족 에폭시와 산무수물 경화제계에 탄소단섬유(SCF)와 유리단섬유(SGF)를 첨가하여 복합재를 제조한 다음 이들의 열적/기계적 특성을 조사하였다. 열기계분석법으로 측정된 열팽창계수(CTE)의 감소 효과를 보면 낮은 단섬유 함량에서는 두 섬유가 거의 비슷하나, 함량이 증가하면 SCF가 SGF에 비해 훨씬 효과적이었다. SCF 강화 복합재에 대한 CTE 실험값을 이론식에 적용해 본 결과 함량이 낮을 때는 혼합법칙(mixture rule)에 잘 맞으며, 함량이 높아지면 Craft-Christensen 식에 근접하였다. 또한, 유리상($30^{\circ}C$과 고무상($180^{\circ}C$)에서의 저장탄성률은 단섬유를 첨가하였을 때 크게 증가하였다. 전자주사현미경(SEM)으로 파단면을 관찰하여본 결과 이와 같은 결과는 단섬유와 에폭시 매트릭스간의 계면접착력과 밀접한 관계가 있음을 알 수 있었다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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• pp.109-113
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• 2002

Interfacial and electrical properties for the carbon fiber reinforced epoxy-amine terminated (AT) PEI composites were performed using microdroplet test and electrical resistance measurements. As AT PEI content increased, the fracture toughness of epoxy-AT PEI matrix increased, and IFSS was improved due to the improved toughness and energy absorption mechanisms of AT PEI. The microdroplet in the carbon fiber/neat epoxy composite showed brittle microfailure mode. At 15 wt% AT PEI content, ductile microfailure mode appeared because of improved fracture toughness. After curing, the changes of electrical resistance (ΔR) with increasing AT PEI content increased gradually because of thermal shrinkage. The matrix fracture toughness was correlated to IFSS, TEC and electrical resistance. In cyclic strain test, the maximum stress and their slope of the neat epoxy case were higher than those of 15 wt% AT PEI. The results obtained from electrical resistance measurements under curing process and reversible stress and strain were consistent well with matrix toughness properties.

• Macromolecular Research
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• 제10권1호
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• pp.34-39
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• 2002

Cure behavior of an epoxy resin was investigated at different cure temperatures (110, 120, 130, 140, and 150 $^{\circ}C$) and cure times in the presence of 2 wt% of an N-benzylpyrazinium hexafluoroantimonate (BPH) cationic catalyst by means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA). The glass transition temperature ( $T_{g}$) and chemical conversion (x) at the different temperatures were determined from DSC thermograms. The $T_{g}$ and x vs. In time data were superposed up to $T_{g}$ = 10$0^{\circ}C$ and x = 0.70 by shifting horizontally at a reference temperature of $T_{g}$ = 13$0^{\circ}C$. It is interesting that the $T_{g}$ and x of the superposed data increase rather slowly in the early stage of cure and rapidly thereafter. Therefore, the increase of the $T_{g}$ and x can be divided into two regions; $R_{I}$= -18.4(= $T_{go}$ ) ~5$^{\circ}C$ and $R_{II}$ = 5 ~ 10$0^{\circ}C$ in $T_{g}$, and $R_{I}$ : 0~0.24 and $R_{II}$ : 0.24~0.70 in x. The $R_{I}$ is closely related to the initiation reactions between BPH and epoxy and between hydroxy group and epoxy in this epoxy/catalyst system. From the kinetic analysis of the $T_{g}$-shift, activation energy was 12.5 kcal/mol. The relationship between $T_{g}$ and x was also considered. The gelation and vitrification times for different cure temperatures were obtained from DMA curves.urves. DMA curves.urves.

• International Journal of Concrete Structures and Materials
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• 제10권4호
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• pp.539-553
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• 2016

Polymer concrete (PC) has been favoured over Portland cement concrete when low permeability, high adhesion, and/or high durability against aggressive environments are required. In this research, a new class of PC incorporating Multi-Walled Carbon Nanotubes (MWCNTs) is introduced. Four PC mixes with different MWCNTs contents were examined. MWCNTs were carefully dispersed in epoxy resin and then mixed with the hardener and aggregate to produce PC. The impact strength of the new PC was investigated by performing low-velocity impact tests. Other mechanical properties of the new PC including compressive, flexural, and shear strengths were also characterized. Moreover, microstructural characterization using scanning electron microscope and Fourier transform infrared spectroscopy of PC incorporating MWCNTs was performed. Impact test results showed that energy absorption of PC with 1.0 wt% MWCNTs by weight of epoxy resin was significantly improved by 36 % compared with conventional PC. Microstructural analysis demonstrated evidence that MWCNTs significantly altered the chemical structure of epoxy matrix. The changes in the microstructure lead to improvements in the impact resistance of PC, which would benefit the design of various PC structural elements.