• Polymer(Korea)
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• v.25 no.5
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• pp.691-698
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• 2001

Nanocomposites based on epoxy acid nanoclay were prepared employing organically modified mica type silicate (OMTS), diglycidyl ether of bisphenol A (DGEBA) type epoxy. curing agent (dicyandiamide; DICY), and catalyst (benzyl dimethyl amine; BDMA). Both melt mixing and solution mixing were und for the sample preparation and structural developments with curing reaction were analyzed using X-ray diffractometer (XRD) and small angle X-ray scattering (SAXS). Because of the different curing rate between extra-gallery and intra-gallery reactions of epoxy mixtures, only intercalated structure was observed for the sample prepared by melt mixing while fully exfoliated structure was observed for the sample prepared by solution mixing. Mechanical properties of exfoliated epoxy nanocomposite were investigated using a dynamic mechanical analyzer (DMA). The dynamic storage modulus of the nanocomposite in both glass and rubbery plateau regions were increased with increasing OMTS contents, but glass transition temperatures ($T_g$) remained unchanged. Thermal properties of epoxy nanocomposite were investigated using thermogravimetric (TGA) and limit oxygen index (LOI) methods. Thermal decomposition onset points and LOI values were increased with increasing OMTS contents due to barrier effects of OMTS sheets.

• Polymer(Korea)
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• v.25 no.2
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• pp.254-262
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• 2001

Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.

• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.97-101
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• 2009

The use of a filler material in epoxy composite materials is an essential condition for reducing the unit cost of production and reinforcing mechanical strength. However, the dielectric strength of insulators decreases rapidly due to interactions between the epoxy resin and filler particles. In contrast to existing composite materials, nano-composite materials have superior dielectric strength, mechanical strength, and enduring chemical properties due to an increase in the bond strength of the polymer and nano material, It is reported that nano-fillers provide new characteristics different from the properties of the polymer material. This study is to improve the insulation capability of epoxy resins used in the insulation of a power transformer apparatus and many electronic devices mold. To accomplish this, the additional amount of nano-$SiO_2$ to epoxy resin was changed and the epoxy/$SiO_2$ nano composite materials were made, and the fundamental electrical properties were investigated using a physical properties and an analysis breakdown test. Using allowable breakdown probability, the optimum breakdown strength for designing an electrical apparatus was determined. The results found that the electrical characteristics of the nano-$SiO_2$ content specimens were superior to the virgin specimens. The 0.4 wt% specimens showed the highest electrical properties among the specimens examined with an allowable breakdown probability of 20 %, which indicates stable breakdown strength in insulating machinery design.

• Macromolecular Research
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• v.13 no.1
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• pp.8-13
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• 2005

A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.

• Korea-Australia Rheology Journal
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• v.12 no.1
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• pp.77-81
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• 2000

Rheological behavior of thermoset/thermoplastic blends of epoxy/polyethersulphone (PES) was monitored during curing of the epoxy resin. During the isothermal curing of the mixture, a fluctuation in viscosity just before the abrupt viscosity increase was observed. This fluctuation is found to be due to the phase separation of PES from the matrix epoxy resin during the curing. The experimentally observed viscosity fluctuation is simulated with a simple two phase suspension model in terms of the increase in domain size. The viscosity profiles obtained experimentally at different isothermal curing temperatures are in good agreement with the predictions from the simple model taking into account the viscosity change due to the growth of PES domain and the network formation of the epoxy matrix.

• Macromolecular Research
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• v.10 no.6
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• pp.332-338
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• 2002

The effect of an electron beam and ${\gamma}$-ray irradiation on the curing of epoxy resins was investigated. Diglycidyl ether of bisphenol A (DGEBA) and diglycidyl ether of bisphenol F (DGEBF) as epoxy resin were used. The epoxy resins containing 1.0-3.() wt% of triarylsulphonium hexafluoroantimonate(TASHFA) and triarylsulphonium hexafluorophosphate(TASHFP) as initiator were irradiated under nitrogen at room temperature with different dosage of EB and ${\gamma}$-rays from a Co$^{60}$ u source. The chemical and mechanical characteristics of irradiated epoxy resins were compared after curing of EB and ${\gamma}$-ray irradiation. The thermal properties of cured epoxy were investigated using dynamic mechanical thermal analysis. The chemical structures of cured epoxy were characterized using near infrared spectroscopy. Mechanical properties such as flexural strength, modulus were measured. The gel fraction of DGEBA with ${\gamma}$-ray was higher than that of the epoxy with EB at the same dose. Young's modulus of the sample irradiated by ${\gamma}$-ray is higher than that of sample cured by EB. From the result of strain at yield, it was found that the epoxy cured by ${\gamma}$-ray had a higher stiff property compared with the irradiated by EB.

• Proceedings of the Korea Concrete Institute Conference
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• 1998.10a
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• pp.330-335
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• 1998

This research was conducted to evaluate the adhesion in tension of the polymer mortars for cement concrete repair. Various polymer types, binder ratios, and wet/dry conditions of the surface were considered in this study. Styrene-butadiene rubber (SBR) and ethylen vinyl acetate (EVA) used for polymer cement mortars. Epoxy resin (EP), and unsaturated polyester resin (UP) were used for polymer mertars. Adhesion in tension for the dry condition of the substrate surface was higher than that for the wet condition of the substrate surface under the same binder ratio. Therefore, in repairing concrete, the dry surface condition was effective on adhesion.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.6
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• pp.495-500
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• 2009

The ceramic($BaTiO_3$)-polymer(epoxy) composites have been widely investigated as dielectric materials for embedded capacitors in printed circuit boards (PCBs). The dielectric properties of $BaTiO_3$/epoxy composites prepared using the agglomerated $BaTiO_3$ particles were investigated in the present study. The dielectric constants of the composites prepared using the agglomerated $BaTiO_3$ particles were about 2 times higher than those of the composites with the dispersed $BaTiO_3$ particles. The insulation resistance of the composites prepared using the agglomerated $BaTiO_3$ particles were lower than those of the composites with dispersed $BaTiO_3$ particles. As a result, there is tradeoff between high dielectric constant and insulation resistance in the $BaTiO_3$/epoxy composites. So it is important to select proper agglomerated or dispersed $BaTiO_3$ particles in accordance with needs.

• Polymer(Korea)
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• v.35 no.1
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• pp.87-93
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• 2011

We developed a fluorene-containing multifunctional binder polymer for LCD color filter resist, and employing the binder polymer, carbon black based black photoresist (CBR) was prepared in order to apply it to the black matrix (BM). To obtain the multifunction of the binder polymer, we synthesized bisphenol fluorene epoxy acrylate-containing unsaturated polyester and identified the binder polymer structure with $^1H$ NMR, GPC and FTIR. The corresponding BFEA-polyester binder polymer was compared with the commercially available acryl binder toward the application to the CBR. From the BM lithography test, we found that the synthesized BFEA-polyester binder had better photocrosslinking capability and alkali solubility. In addition, the newly developed binder gave a good process margin, good resolution and adhesion property on a glass substrate.

• Polymer(Korea)
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• v.39 no.1
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• pp.46-55
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• 2015

There is a limit for deforestation in order to keep the environmental cycle undisturbed. The heart of the paper is to replace the wood to a maximum extent to obtain a sustainable environment. This research aims at new natural composites in which treated hemp fiber used as reinforcement, synthetic cellulose used as particulate to improve the adhesion between matrix - fiber interface and Epoxy LY556 acted as matrix fabricated by hand layup technique. The density, water absorption, tensile properties, impact strength, hardness, flexural properties and compressive properties have been evaluated under ASTM standards and compare the results with existing materials such as wood, aluminium, etc., The composite hemp fiber reinforced polymer (HFRP) could be exploited as an effective replacement for wood and it would be suitable for automotive applications by comparing results.