• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.25-29
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• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.149-153
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• 2000

Substituting composite structures for conventional metallic structures has many advantages because of higher specific stiffness and specific strength of composite materials. In this work, one-piece propeller shafts composed of carbonfepoxy and glass/epoxy composites were designed and manufactured for a rear wheel drive automobile satisfying three design specifications, such as static torque transmission capability, torsional buckling and the fundamental natural bending frequency. Single lap adhesively bonded joint was employed to join the composite shaft and the aluminum yoke. For the optimal adhesive joining of the composite propeller shaft to the aluminum yoke, the torque transmission capability of the adhesively bonded composite shaft was calculated with respect to bonding length and yoke thickness by finite element method and compared with the experimental result. Then an optimal design method was proposed based on the failure model which incorporated the nonlinear mechanical behavior of aluminum yoke and epoxy adhesive. From the experiments and FEM analyses, it was found that the static torque transmission capability of composite propeller shaft was maximum at the critical yoke thickness, and it saturated beyond the critical length. Also, it was found that the one-piece composite propeller shaft had 40% weight saving effect compared with a two-piece steel propeller shaft.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.38-43
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• 2001

The interfacial adhesive joining characteristics of the foams are very important for the structural integrity of sandwich structures. Peel strength is one of the best criteria for the interfacial characteristics of the sandwich structures and peel energy is most commonly used for the interfacial characteristics. The peel strength is the first peak force per unit width of bond line required to produce progressive separation by the wedge or other crack opening type action of two adherends where one or both undergo significant bending and the peel energy is the surface active energy per unit width of bond line. In this work, to investigate the strengthening effect of resin treatment on the interfacial surface of foam material, peel strength and peel energy of epoxy resin treated polyurethane foam core sandwich structures were obtained by the cleavage peel tests and compared with those of non surface treated polyurethane foam core sandwich structures.

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.139-143
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• 2017

Finite element analysis was performed for a split-type CFRP bicycle frame, which was designed to apply a compression molding process with carbon fiber prepreg for a conventional bicycle. An epoxy adhesive material for joining the frames was selected by the extent of stress at joint interfaces. The split-type bicycle frame was then formed and its weak parts examined by the boundary conditions according to reliability tests. The results verified the reliability of the bicycle frame after modification of these weak parts. The finished product was manufactured by using this developed split-type bicycle frame.

• Composites Research
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• v.24 no.5
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• pp.23-28
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• 2011

In this paper, the bonding strengths of co-cured T800 carbon/epoxy composite-aluminum single lap joints with and without additional pressures were investigated using the pressure information induced by the fiber tension during a filament winding process. The specimens of all the tests were fabricated by an autoclave vacuum bag de-gassing molding being controlled forming pressures (absolute pressures of 0.1MPa, 0.3MPa and 0.7MPa including vacuum). A special device which can act uniform additional pressures on the joining part of the single lap joint specimen was designed to measure the bonding strengths of composite-aluminum liners of type III hydrogen pressure vessel fabricated by a filament winding process. After the three different additional pressures (absolute pressures of 0.1MPa, 0.3MPa and 0.7MPa) were applied to the specimens the effect of the additional pressures on the bonding strengths of the co-cured single-lap joints were evaluated.

• Journal of Conservation Science
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• v.9 no.1
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• pp.33-39
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• 2000

A well-bucket excavated from Seobu-dong, Kyungju was characterized and conserved. The bucket was heavily degraded by a diverse set of microorganisms during its long-term storage in the burial site. The distribution of maximum saturated moisture content was in the range of 614-1050%. The identification of species using optical microscope showed that the species was Pinus densiflora. The dimensional stability of the bucket was examined using sucrose as a dimension-stabilizing agent. The concentration of sucrose was started at 10% level and raised to 30, 50, 70% for 8 weeks. The changes of weight increase were varied with concentration. When the concentration of sucrose reached to 30%, 50%, the bucket showed the significant increase of weight, especially. Epoxy adhesives was used for the joining and restoring. Dimensional change and crack were not observed afterward.

• Journal of Adhesion and Interface
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• v.7 no.2
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• pp.12-18
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• 2006

Recently, as industries and technologies are increased, superior adhesives having more and more developed functions and properties have been demanded. In this article, to use the merits and viscoelastic properties of poly(ethylene/butylene) rubber resin and to supplement the demerits, semi-structure pressure sensitive adhesives (PSAs) are developed. Aslo, it can be said environmentally friendly PSAs because of not use the organic solvent and not emit volatile organic compounds (VOCs).

• Journal of Conservation Science
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• v.7 no.2
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• pp.45-53
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• 1998

The Kong-Chung Jung's relics made of wooden materials were pre-examined for conservation. Kong-Chung Jung was a General of the Chosun Dynasty and his weapons were made of wood. The pre-examining method was focused on the quality and species of the wooden weapons. X-ray radiation was used for the observation of wood structure, and the condition of the relics was relatively good although they contained some cracks. The examination of species using optical microscope showed that the species of each relics were Pinus densiflora of hanging scroll pole, Lozoste lancifolia of a top of flagnole, Fraxinus sp. of a flagpole, Phyllostachys sp. of arrow shafts. For the conservation of the relics, celyl alcohol as dimensional stability chemicals was used and poly(vinyl acetate) and epoxy adhesives were also used for the joining and restoring of the relics.