• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.20.2-20.2
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• 2011

III-nitrides have attracted much attention for optoelectronic device applications whose emission wavelengths ranging from green to ultraviolet due to their wide band gap. However, due to the strong polarization properties of conventional c-plane III-nitrides, the built-in polarization-induced electric field limits the performance of optical devices. Therefore, there has been a renewed interest in the growth of nonpolar III-nitride semiconductors for polarization free heterostructure optoelectronic and electronic devices. However, the crystal and the optical quality of nonpolar/semipolar GaN have been poorer than those of conventional c-plane GaN, resulting in the relative poor optical and electrical properties of light emitting diodes (LEDs). In this presentation, I will discuss the growth and characterization of high quality nonpolar a-plane and semipolar (11-22) GaN and InGaN multiple quantum wells (MQWs) grown on r- and m-plane sapphire substrates, respectively, by using metalorganic chemical vapor deposition (MOCVD) without a low temperature GaN buffer layer. Especially, the epitaxial lateral overgrowth (ELO) technique will be also discussed to reduce the dislocation density and enhance the performance of nonpolar and semipolar GaN-based LEDs.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Journal of the Korean Vacuum Society
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• v.4 no.2
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• pp.177-182
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• 1995

저잡음 HEMT소자 제작을 위한 에피택셜 기판을 MBE방법을 이용하여 $In_{0.53}Ga_{0.47}As/In_{0.52}AI_{0.48}$As/InP 물질계로 성장하였다. 기판온도의 변화, 채널층과 격리층 사이의 성장 일시 멈춤 등의 성장 조건 변화에 따른 Hall 이동도의 변화를 연구하였다. 전자 공급층을 Si으로 델타도핑한 결과 같은 조건에서 성장기판의 온도를 $520^{\circ}C$에서$ 540^{\circ}C$로 증가시키면 실온의 전자이동도는 7,850$\textrm{cm}^2$/Vsec으로 증가하였으며, 격리층과 채널층 사이에서 약 50초간 성장중 채널층의 표면 adatom의 surface migration 시간을 충분히 제공하여 결정결함의 감소로 계면의 급격성이 향상된 결과로 사료된다. 본 실험을 통하여 얻은 최고 이동도 값은 격리층의 두께가 $100\AA$인 경유에 상온 측정결과 $11,400\textrm{cm}^2$/vsec 및 77K 측정결과 $50,300\textrm{cm}^2$/Vsec이었다.

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.213-219
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• 1992

The microstructure, dopant distribution and electrical properties of the $As^{+}$ ion-implanted surface layer differ significantly depending on the methods of subsequent heat treatments, furnace annealing(FA) and rapid thermal annealing(RTA). The amorphous layer created by ion implantation was recrystallized during the thermal annealing through solid phase epitaxial (SPE) growth. The dopant distribution and electrical properties are discussed with respect to the TEM cross-sectional microstructure observed. The microstructure, dopant distribution and electrical properties depended upon especially the annealing time of the heat treatment.

• Electronics and Telecommunications Trends
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• v.5 no.1
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• pp.55-70
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• 1990

SIMOX SOI is known to be one of the most useful technologies for fabrications of new generation ULSI devices. This paper describes the current status of SIMOX SOI technology for ULSI applications. The SIMOX wafer is vertically composed of buried oxide layer and silicon epitaxial layer on top of the silicon substrate. The buried oxide layer is used for the vertical isolation of devices The oxide layer is formed by high energy ion implantation of high dose oxygen into the silicon wafer, followed by high temperature annealing. SIMOX-based CMOS fabrication is transparent to the conventional IC processing steps without well formation. Furthermore, thin film CMOX/SIMOX can overcome the technological limitations which encountered in submicron bulk-based CMOS devices, i.e., soft-error rate, subthreshold slope, threshold voltage roll-off, and hot electron degradation can be improved. SIMOX-based bipolar devices are expected to have high density which comparable to the CMOX circuits. Radiation hardness properties of SIMOX SOI extend its application fields to space and military devices, since military ICs should be operational in radiation-hardened and harsh environments. The cost of SIMOX wafer preparation is high at present, but it is expected to reduce as volume increases. Recent studies about SIMOX SOI technology have demonstrated that the performance of the SIMOX-based submicron devices is superior to the circuits using the bulk silicon.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.2
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• pp.197-206
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• 1997

A SiC epilayer on the 6H-SiC crystal substrate was grown by chemical vapor deposition (CVD). The crystal structure of the SiC epilayer was investigated by using the X-ray diffraction patterns and the Roman scattering spectroscopy. The SiC epilayer on the 6H-SiC substrate was grown to be homoepilayer by CVD. In order to distinguish a certain SiC polytype mixed in the SiC crystal grown by the modified Lely method, we have calculated the X-ray diffraction intensities and Brags angles of the typical SiC crystal powders. By comparing the measured X-ray diffraction pattern with the calculated ones, it was identified that the SiC crystal grown by the modified Lely method was the 6H-SiC crystal mixed some 15R-SiC.

• Journal of the Korean Magnetics Society
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• v.3 no.3
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• pp.215-220
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• 1993

Microstructural dependence of magnetic property of RF/DC sputtered $Co_{69.0}Ni_{18.5}Cr_{12.5}/Cr$ double layer thin film was studied. Grain size was found to be decreased with substrate temperature in the range of $100-200^{\circ}C$ and Cr underlayer thickness(from $500\;{\AA}-2000\;{\AA}$). The peaks (200) and (1120) of X-ray diffraction patterns were evidently grown with the substrate temperature for the Cr underlayer and magnetic layer, respectively. The CoNiCr magnetic layer was found to be well epitaxialy grown on Cr underlayer, and subsequently the coercivity was enhanced.

• Bulletin of the Korean Chemical Society
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• v.35 no.3
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• pp.705-708
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• 2014

We demonstrate the blue InGaN/GaN multiple quantum wells light-emitting diodes (LEDs) with an embedded air-gap photonic crystal (PC) which was fabricated by the lateral epitaxial overgrowth of GaN layer on the tungsten (W) nano-masks. The periodic air-gap PC was formed by the chemical reaction of hydrogen with GaN on the W nano-mask. The optical output power of LEDs with an air-gap PC was increased by 26% compared to LEDs without an air-gap PC. The enhanced optical output power was attributed to the improvement in internal quantum efficiency and light extraction efficiency by the air-gap PC embedded in GaN layer.

• Korean Journal of Materials Research
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• v.7 no.8
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• pp.694-700
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• 1997

TiC(001) 면위에 Mg 금속을 단원자층으로 증착시킨 후 산화 및 열처리 과정을 거쳐서 MgO 초박막을 성장시키고, 성장된 MgO 막의 전자상태 및 표면포논을 UPS, XPS 및 HREELS를 사용하여 측정하였다. 전도성 기판위에 epitaxial 산화물막을 성장시킨 후 성장된 막의 전자구조 및 표면포논을 측정함으로써 벌크에서 분리된 2차원적 특성을 갖는 '표면 모델'의 물성을 연구하고자 하였는데, 이러한 '표면모델'은 잘 배열된 원자구조를 얻을 수 있고 두께가 충분히 얇아서 전하축적을 피할 수 있기 때문이다. 기판으로는 MgO와 같은 암염형 결정구조를 갖고 있고, 격자상수 차이가 2.6% 로서 매우 작으며, 비저항이 매우 낮은 전이 금속 탄화물 중의 하나인 TiC(001) 면을 사용하였다. TiC(001)면에 증착된 MgO층의 UPS He-l 스펙트럼을 측정한 결과 O2p및 XPS스펙트럼은 열처리를 전후로 하여 변하지 않았으며, 이로부터 상온에서 산소의 확산만으로 MgO 상이 형성됨을 알 수 있었다. MgO초박막의 표면 포논을 HREELS를 사용하여 검출하였다. 거시적 포논중에서 F-K 파 및 Rayleigh 모드가 관찰되었는데, F-k파는 MgO막의 2차원성으로 인하여 벌크의 경우보다 높은 진동 에너지를 갖고 있었고 Rayleigh모드는 벌크 MgO와 유사한 분산관계를 보였다. 미시적 포논중에서 Wallis(S/sub 2/)모드가 측정되었는데, 그 진동에너지는 벌크에서와 같고 off-specular방향에서도 소멸되지 않았다.