• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.471-475
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• 2000

P-type (100) Si wafer patterned with 1000$\AA$ SiO$_2$island was used as substrate and the Si films were deposited under low pressure using Si$_2$H$_{6}$-H$_2$gas mixture where the total gas flow rate and deposition pressure were 16.6sccm and 3.5mtorr, respectively. In this condition, we selectively obtained high-quality epitaxial Si layer of the 350~1050$\AA$ thickness. In order to extend the incubation period, we kept high pressure H$_2$ environment without Si$_2$H$_{6}$ gas for few minutes after first incubation period and then we conformed the existence of second incubation period.iod.

• Journal of the Korean institute of surface engineering
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• v.28 no.3
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• pp.174-181
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• 1995

Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin film processes and epitaxial layer growth and silicon wet etching techniques. We investigated silicon etch rate in 1-3-10 etchant as functions of doping concentration, surface mechanical stress and crystal defects. The experimental results indicate that silicon etch rate in 1-3-10 etchant is strong functions of doping concentration and crystal defect density rather than surface mechanical stress. We suggested the new fabrication processes of multilayered silicon cantilever beams.

• Journal of the Korean Vacuum Society
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• v.9 no.1
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• pp.16-23
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• 2000

The epitaxial growth of $CeO_2$ films has been investigated on three different substrates-Si(111), $SrTiO_3$(001), and MgO(001)-over wide range of growth parameters using oxygen-plasma-assisted molecular beam epitaxy. Pure-phase, single-crystalline epitaxial films of $CeO_2$ (001) have been grown only on $SrTiO_3$(001). We discuss the growth conditions in conjunction with the choice of substrates required to synthe-size this oxide, as well as the associated characterization by menas of x-ray diffraction, reflection high-energy electron diffraction, low-energy electron diffraction, and x-ray photoelectron spectroscopy and diffraction. Successful growth of single crystalline $CeO_2$ depends critically on the choice of substrate and is rather insensitive to the growth conditions studied in this investigation. $CeO_2$(001) films on $SrTiO_3$exhibit the sturcture of bulk $CeO_2$ without surface reconstructions. Ti outdiffusion is observed on the films grown temperatures above $650^{\circ}C$.

• Journal of Korean Vacuum Science & Technology
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• v.4 no.3
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• pp.63-67
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• 2000

We have studied the photoluminescence properties of undoped epitaxial layers of GaN on sapphire substrate grown by horizontal low pressure metal organic chemical vapor deposition method in the temperature range of 9-300 K. At 9 K the spectra are dominated by the well resolved interband free excitons A and B as well as bound excitons. Temperature dependence of free exciton transitions was studied and Varshni's coefficients for the temperature variation of bandgap were determined.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.6
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• pp.801-806
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• 1986

The effect of SiH2Cl2 -HCl gas on the growth rate of epitaxial layer is studied. The temperature, pressure and gas mixing ratio of SiH2Cl2 and HCl are varied to study the growth rate dependence and selective Si epitaxy. The P-n junction diode is fabricated on the epitaxial layer and electrical characteristics are examined. Also, using selective Si epitaxy, a possibility of thin dielectric isolation process, that gives an independent isolation width on the mask dimension, is examined.

• Journal of the Korean Vacuum Society
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• v.8 no.4B
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• pp.519-523
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• 1999

Epitaxial thickness $t_e(T_s)$ of Si films grown at the substrate temperature $T_s$=80~30$0^{\circ}C$ by ultra-high vacuum ion-beam sputter deposition onto nominally-singular, [100]-miscut Si(001) was measured. $t_e(T_s)$ values of films grown on vicinal Si(001) substrates were decreases compared to those of films grown on nominally-singular Si(001). Evolution of surface roughness measured by atomic force microscopy of films grown at $300^{\circ}C$ showed that the increases step density in vicinal substrates increases the tendency toward unstable growth resulting in larger surface roughness, which in turn decreases te.

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.182.2-182.2
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.135-135
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.63-63
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• 2002

• 한국전자현미경학회:학술대회논문집
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• 2005.11a
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• pp.189-193
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• 2005