• Journal of electromagnetic engineering and science
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• v.5 no.3
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• pp.140-145
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• 2005

In this paper, an experimental investigation for return loss and a software-based prediction for interference level of single-packaged filtering antenna composed of dielectric waveguide filter and PCB(Printed Circuit Board) slot antenna in transceiver module have been carried out with several different feeding structures in millimeter-wave regime. The implementation and embedding method of the existing air-filled waveguide filters working at millimeter-wave frequency on general PCB substrate have been described. In a view of the implementation of each components, the dielectric waveguide embedded in PCB and LTCC(Low Temparature Co-fired Ceramic) substrates has employed the via fences as a replacement with side walls and common ground plane to prevent energy leakage. The characteristics of several prototypes of filtering antenna embedded in PCB substrate are considered by comparing the wideband and transmission characteristics as a function of bent angle of transmission line connecting two components. In addition, as an essential to the packaging of transceiver module working at millimeter-wave, miniaturization technology maintaining the performances of independent components and the important problems caused by integrating and connecting the different components in different layers are described in this paper.

• The Optical Journal
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• s.117
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• pp.23-25
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• 2008

RF embedded 기판의 기술은 Module과 Package라는 응용 제품을 거치면서 최종적으로는 기존의 여러 가지 제품의 Mother Board(특히 휴대폰)에 접목 시키기 위한 노력이 계속 진행되고 있다. 업계 및 Research 기관의 조사 결과에 따르면 PCB 시장의 성장세와 맞물려 Embedded 시장규모는 큰 폭의 상승이 예상된다. 본 고에서는 높은 유전율을 가지는 강유전체 물질의 Embedded capacitor 적용을 위해 레이저 기술을 전자부품 제조현장에 적용하는 연구의 진행상황을 소개하고자 한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.29-35
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• 2001

Combline 구조를 가진 마이크로 스트립 라인 또는 스트립 라인 필터를 내장한 기능형 PCB를 제작하였다. 저 비용 구현 및 이동성과 휴대성을 강조하기 위해 기존의 세라믹 대신 FR4와 에폭시를 유전체로 사용하는 저가형 다층 회로 기판의 도체 층에 집적화 하였다. Combline의 각 끝단에 커패시터를 부하함으로써 전기적 길이를 확장하였고 전체적인 크기를 감소시킴으로서 적당한 필터 특성을 얻을 수 있었다. 구현된 Embedded PCB는 마이크로파 대역에서 사용 가능하며 특히 Bluetooth 나 Wireless LAN과 같은 ISM 대역을 사용하는 무선통신소자로서 사용 가능하다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.45-45
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• 2007

Capacitors among the embedded passive components are most widely studied because they are the major components in terms of size and number and hard to embed compared with resistors and inductors due to the more complicated structure. To fabricate a capacitor-embedded PCB for in-line process, it is essential to adopt a low temperature process (<$200^{\circ}C$). However, high dielectric materials such as ferroelectrics show a low permittivity and a high dielectric loss when they are processed at low temperatures. To solve these contradicting problems, we studied BMN materials as a candidate for dielectric capacitors. processed at PCB-compatible temperatures. The morphologies of BMN thin films were investigated by AFM and SEM equipment. The electric properties (C-F, I-V) of Pt/BMN/Cu/polymer were evaluated using an impedance analysis (HP 4194A) and semiconductor parameter analyzer (HP4156A). $Bi_2Mg_{2/3}Nb_{4/3}O_7$(BMN) thin films deposited on copper clad laminate substrates by sputtering system as a function of Ar/$O_2$ flow rate at room temperature showed smooth surface morphologies having root mean square roughness of approximately 5.0 nm. 200-nm-thick films deposited at RT exhibit a dielectric constant of 40, a capacitance density of approximately $150\;nF/cm^2$, and breakdown voltage above 6 V. The crystallinity of the BMN thin films was studied by TEM and XRD. BMN thin film capacitors are expected to be promising candidates as embedded capacitors for printed circuit board (PCB).

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.113-118
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• 2011

This paper proposes computer visual inspection algorithms for PCB defects which are found in a manufacturing process. The proposed method can detect open circuit and short circuit on bare PCB without using any reference images. It performs adaptive threshold processing for the ROI (Region of Interest) of a target image, median filtering to remove noises, and then analyzes connected components of the binary image. In this paper, the connected components of circuit pattern are defined as 6 types. The proposed method classifies the connected components of the target image into 6 types, and determines an unclassified component as a defect of the circuit. The analysis of the original target image detects open circuits, while the analysis of the complement image finds short circuits. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.03b
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• pp.23-33
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• 2002

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.1-7
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• 2021

In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (P_in) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P_1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.

• Journal of Electrical Engineering and Technology
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• v.13 no.4
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• Journal of electromagnetic engineering and science
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• v.14 no.1
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• pp.43-45
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• 2014

We propose a printed circuit board (PCB)-embedded antenna for millimeter-wave chip-to-chip communication. The antenna is 0.18 mm in height which is 1/20 wavelength at 80 GHz. In order to realize such a low profile, a zeroth-order resonator antenna with a periodic array of four unit cells is employed, and its geometry is optimized to cover an 8-GHz bandwidth from 76 to 84 GHz. With this;the antenna is capable of radiating in a direction parallel to the board length despite the short distance between the ground and the radiator. Simulation and measurement results show that the optimized design has low reflection coefficients and consistent radiation patterns throughout the target bandwidth.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.02a
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• pp.119-138
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• 2006

1. 모바일 제품 고기능/소형화를 위해 3차원 실장 [3차원 부품 Stack, Embedded PCB] 필요성 증대 2. 고밀도 실장을 위해 기존 부품업체 [능동, 수동, 기타부품], PCB 업체, Set 업체간의 명확한 기술구분이 사라짐 $\rightarrow$ 기존 부품의 조합에 의한 조립이라는 패러다임 변화 요구된 [의식 개혁 필요] 3. 신 실장기술 도입의 가장 큰 장애물 중 하나는 신뢰성 확보임 신규 기술 연구/개발과 동시에 충분한 신뢰성 확보가 필수