• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.4
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• pp.83-90
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• 2004

In this paper, we proposed a new instruction set(X32Y ISA) with 3 different types of instruction mode. The proposed instruction set organizes 32-bit, 24-bit, 16-bit instruction in order to solves a problem of memory size limitation in an embedded microprocessor. We designed a 32-bit 5 stage pipeline RISC microprocessor based on the X32V ISA. To verify the proposed the X32V ISA and a microprocessor, we estimated a program code size of multimedia application programs using a X32V simulator. In result, we verified that the Light mode and the Ultra Light mode obtains 8%, 27% reduction of a program code size through comparison with the Default mode. The proposed microprocessor was verified all X32V instructions execution at Xilinx FPGA with 33MHz operating frequency,

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.26-36
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• 2001

Smart sensors and actuators have recently been developed. In this study, first, small-diameter fiber Bragg grating (FBG) sensors developed by the author, whose cladding and polyimide coating diameters were 40 and $52{\mu}m$, respectively, were embedded inside a laminate without resin-rich regions around sensors and the deterioration of mechanical properties of the composite laminate. The small-diameter FBG sensor was embedded in $0^{\circ}$ ply of a CFRP laminate for the detection of transverse cracks in $90^{\circ}$ ply of the laminate. The reflection spectra from the FBG sensor were measured at various tensile stresses. The spectrum became broad and had some peaks with an increase of the transverse crack density. Furthermore, the theoretical calculation reproduced the change in the spectrum very well. These results show that the small-diameter FBG sensors have a potential to detect the occurrence of transverse cracks through the change in the form of the spectrum, and to evaluate the transverse crack density quantitatively by the spectrum width. On the other hand, shape memory alloy (SMA) films were used to suppress the initiation and growth of transverse cracks in CFRP laminates. Pre-strained SMA films were embedded between laminas in CFRP laminates and then heated to introduce the recovery stress in SMA films and compressive stresses in the weakest plies ($90^{\circ}$ ply). The effects of recovery stresses are demonstrated in the experiments and well predicted using the shear-lag analysis and the nonlinear constitutive equation of SMA films.

• Composites Research
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• v.28 no.2
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• pp.52-57
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• 2015

Soft morphing robotics making use of smart material and based on biomimetic principles are capable of continuous locomotion in harmony with its environment. Since these robots do not use traditional mechanical components, they can be built to be light weight and capable of a diverse range of locomotion. This paper illustrates a flexible smart phone robot made of smart soft composite (SSC) with inchworm-like locomotion capable of two-way linear motion. Since rigid components are embedded within the robot, bending actuators with embedded rigid segments were investigated in order to obtain the maximum bending curvature. To verify the results, a simple mechanical model of this actuator was built and compared with experimental data. After that, the flexible robot was implemented as part of a smart phone robot where the rigid components of the phone were embedded within the matrix. Then, experiments were conducted to test the smart phone robot actuation force under different deflections to verify its load carrying capability. After that, the communication between the smart phone and robot controller was implemented and a corresponding phone application was developed. The locomotion of the smart phone robot actuated through an independent controller was also tested.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.10C
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• pp.983-991
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• 2009

While H.264/AVC is in wide use for multimedia applications such as DMB and IPTV service, we have limited usage cases for embedded real-time applications due to its high computational demand. The paper provides judicious guide line for optimization method selection, by presenting the detailed experiments data through the development process of a real time H.264 software encoder on embedded DSP. The experimental analysis includes an intensive profiling analysis, fast algorithm application, optimal memory assignment, and intrinsic-based instruction selection. We have realized a real-time software that encodes CIF resolution videos 15 fps on TMS320DM64x processors.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.10
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• pp.797-802
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• 2016

This paper proposes a noble voice recognition method based on an adaptive MFCC and deep learning for embedded systems. To enhance the recognition ratio of the proposed voice recognizer, ambient noise mixed into the voice signal has to be eliminated. However, noise filtering processes, which may damage voice data, diminishes the recognition ratio. In this paper, a filter has been designed for the frequency range within a voice signal, and imposed weights are used to reduce data deterioration. In addition, a deep learning algorithm, which does not require a database in the recognition algorithm, has been adapted for embedded systems, which inherently require small amounts of memory. The experimental results suggest that the proposed deep learning algorithm and HMM voice recognizer, utilizing the proposed adaptive MFCC algorithm, perform better than conventional MFCC algorithms in its recognition ratio within a noisy environment.

• Proceedings of the IEEK Conference
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• summer
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• pp.204-208
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• 2004

Embedded business will be expanded market more and more since customers seek more wearable and ubiquitous systems. Cellular telephones, PDAs, notebooks and portable multimedia devices could bring higher microprocessor revenues and more rewarding improvements in performance and functions. Increasing battery capacity is still creeping along the roadmap. Until a small practical fuel cell becomes available, microprocessor developers must come up with power-reduction methods. According to MPR 2003, the instruction and data caches of ARM920T processor consume $44\%$ of total processor power. The rest of it is split into the power consumptions of the integer core, memory management units, bus interface unit and other essential CPU circuitry. And the relationships among CPU, peripherals and caches may change in the future. The processor working on higher operating frequency will exact larger cache RAM and consume more energy. In this paper, we propose advanced low power trace cache which caches traces of the dynamic instruction stream, and reduces cache access times. And we evaluate the performance of the trace cache and estimate the power of the trace cache, which is compared with conventional cache.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.295-301
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• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

• Journal of Information Processing Systems
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• v.20 no.1
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• pp.116-130
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• 2024

In the Internet-of-Things (IoT) or blockchain-based network systems, secure keys may be stored in individual devices; thus, individual devices should protect data by performing secure operations on the data transmitted and received over networks. Typically, secure functions, such as a physical unclonable function (PUF) and fully homomorphic encryption (FHE), are useful for generating safe keys and distributing data in a network. However, to provide these functions in embedded devices for IoT or blockchain systems, proper inspection is required for designing and implementing embedded system-on-chip (SoC) modules through overhead and performance analysis. In this paper, a virtual platform (SoC VP) was developed that includes a secure key generation module with a PUF and FHE. The SoC VP platform was implemented using SystemC, which enables the execution and verification of various aspects of the secure key generation module at the electronic system level and analyzes the system-level execution time, memory footprint, and performance, such as randomness and uniqueness. We experimentally verified the secure key generation module, and estimated the execution of the PUF key and FHE encryption based on the unit time of each module.

• Journal of Korea Society of Industrial Information Systems
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• v.18 no.5
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• pp.33-37
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• 2013

In this paper, we introduce a SDRAM controller implemented on FPGA. Modern embedded system adopts SDRAM as a memory to meet the high capacity memory demands. Our SDRAM controller is written in Verilog and verified on an FPGA, demonstrating the functionality along with ARM Cortex-M0, supporting AMBA AHB.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.151-154
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• 2001

Shape memory alloy (SMA) has demonstrated its potentials for various smart structure applications. SMA wires undergo a reversible phase transformation from martensite to austenite as temperature increases. This transformation leads to shape recovery and associated recovery strains. If SMA actuators are embedded off the neutral surface and are oriented in arbitrary angles with respect to a beam axis, then the beam bends and twists due to the coupling effects of recovery strains activated. In this study, the bending and twisting of a SMA/Composite beam were controlled by both electric resistive heating and passive elastic tailoring. 3-dimensional finite element formulations were derived and validated to analyze the responses of the SMA/Composite beam. Numerical results show that the shape of the SMA/Composite beam can be controlled by judicious choices of control temperatures, SMA angles, and elastic tailoring.