• Journal of the Korean Ceramic Society
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• v.42 no.2 s.273
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• pp.81-87
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• 2005

The compositions for LTCC embedded capacitors based on $BaTiO_3$ ceramics with $5\~15\;wt\%$ of lithium-borosilicate glass frits were studied. After the glass frits, which is chemically stable and has acceptable ability of low-temperature sintering, were added to the host dielectric materials, the sintering behavior and dielectric properties were evaluated. As for $BaTiO_3$, relative density of >$95\%$, permittivity 990, and dielectric loss $3.1\%$ were obtained when sintered at $925^{\circ}C$ with 5 wt$\%$ of glass frits. As for $(Ba,Ca)(Ti,Zr)O_3$ ceramics, relative density of >$95\%$, open porosity <$0.5\%$, permittivity 700, and dielectric loss $2\%$ were obtained when sintered at $875^{\circ}C$ with 10 wt$\%$ of glass frits.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.154-161
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• 2011

This paper presents a compact integrated transceiver module for 2.4 GHz band applications using Low Temperature Co-fired Ceramic(LTCC) technology. The implemented transceiver module is divided into an RF Front-End Module (FEM) part and a transceiver IC chip part. The RF FEM part except an SPDT switch and DC block capacitors is fully embedded in the LTCC substrate. The fabricated RF FEM has 8 pattern layers and it occupies less than $3.3\;mm{\times}5.2\;mm{\times}0.4\;mm$. The measured results of the implemented RF FEM are in good agreement with the simulated results. The transceiver IC chip part consists of signal line, power line and transceiver IC for 2.4 GHz band communication system. The fabricated transceiver module has 9 layers including three inner grounds and it occupies less than $12\;mm{\times}8.0\;mm{\times}1.1\;mm$. The implemented transceiver module provides an output power of 18.1 dBm and a sensitivity of -85 dBm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.357-358
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• 2005

Compact power amplifier modules (PAM) for WCDMA/KPCS and GSM/WCDMA dual-band applications based on multilayer low temperature co-fired ceramic (LTCC) substrates are presented in this paper. The proposed modules are composed of an InGaP/GaAs HBT PAs on top of the LTCC substrates and passive components such as RF chokes and capacitors which are embedded in the substrates. The overall size of the modules is less than 6mm $\times$ 6mm $\times$ 0.8mm. The measured result shows that the PAM delivers a power of 28 dBm with a power added efficiency (PAE) of more than 30 % at KPCS band. The adjacent-channel power ratio (ACPR) at 1.25-MHz and 2.25-MHz offset is -44dBc/30kHz and -60dBc/30kHz, respectively, at 28-dBm output power. Also, the PAM for WCDMA band exhibits an output power of 27 dBm and 32-dB gain at 1.95 GHz with a 3.4-V supply. The adjacent-channel leakage ratio (ACLR) at 5-MHz and 10-MHz offset is -37.5dBc/3.84MHz and -48dBc/3.84MHz, respectively. The measured result of the GSM PAM shows an output power of 33.4 dBm and a power gain of 30.4 dB at 900MHz with a 3.5V supply. The corresponding power added efficiency (PAE) is more than 52.6 %.