• Transactions of Materials Processing
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• v.33 no.4
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• pp.285-290
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• 2024

Electropulsing treatment (EPT) has been developed as an alternative to furnace heat treatment (FHT) to exploit its engineering advantages in rapidly annealing metallic materials. Conventionally, the separation of thermal and athermal effects of EPT has been attempted by comparing EPT and FHT specimens processed under identical temperature and duration. However, this method inherently introduces experimental and measurement errors. This study proposes a novel approach to distinguish the thermal and athermal effects of EPT-processed metals using T-shaped specimen with two observation points, namely 'C' and 'D'. For verification, the thermal gradient of T-shaped Mg alloys was examined under various EPT conditions. The points C exhibited higher temperatures compared to those at points D at a given electric current density, because only the former received both thermal and athermal effects. It was confirmed from twelve specimens that the point C at an electric current density of 65 A·mm^-2 and point D at 70 A·mm^-2 exhibited similar temperatures. This developed method is expected to reduce measurement errors in distinguishing thermal and athermal effects, thus providing a deeper understanding of their quantitative contributions in future studies.

• Transactions of Materials Processing
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• v.31 no.6
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• pp.337-343
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• 2022

Electrically assisted pressure joining (EAPJ) utilizes electric current-induced kinetic enhancement to achieve solid state diffusion bonding within a short time. In this study, aluminum alloy specimens, which are known as a hard-to-weld metal, were successfully solid-state joined through EAPJ. The bonding process was performed in two ways: continuous direct current (CDC), which applies relatively low current density, and pulsed direct current (PDC), which applies high current density. It was observed that the bonding strength was higher in PDC than in CDC. The microstructure of the joint was characterized using 3D X-ray microscopy (XRM) and electron backscatter diffraction (EBSD).