• Journal of the Korean institute of surface engineering
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• v.36 no.6
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• pp.423-429
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• 2003

It has been investigated corrosion resistance and crystal structure of Zn-Cr coatings fabricated by electroplating method and electron-beam physical vapor deposition method(EB-P VD). The electroplated Zn-Cr alloy consists mainly of η'-Zn phase for the lower Cr content than 7.9 wt% Cr and ${\gamma}$'-ZnCr phase for the higher Cr content. In the Zn-Cr alloy fabricated by EB-PVD the ${\gamma}$'-ZnCr phase appeared clearly at 3 wt% Cr and it became the sole phase at 50 wt%Cr. The amount of η'-Zn phase decreased obviously with increasing Cr content when it exceeded 15 wt% Cr. The electrochemical measurement of the electroplated Zn-Cr film has shown corrosion potential of about -1000 mV. The current density of active region and the amount of dissolved Zn and Cr decreased significantly with increasing Cr content. The electrochemical characteristics of Zn-Cr alloy fabricated by EB-PVD have shown that the alloy of 50 wt% Cr had the highest corrosion potential(-500 mV) and the lowest critical passive current density than that of the electroplated.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• Resources Recycling
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• v.12 no.1
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• pp.25-32
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• 2003

A study on the separation of heavy metals such as iron, copper, zinc and nickel from electroplating waste water has been investigated. The results showed that the PC-88A was more effective extractant for the extraction of zinc and the efficiency of zinc was to be about 100% at pH 2.5. And copper and nickel were extracted about 100% at pH 2 and more than 90% at pH 4～5 with LIX 84, respectively. On the other hand, in the case of solvent extraction of electroplating waste water(Acid-Alkali type) containing heavy metals, the ferric ion was first extracted at pH 2∼2.5 with 20% Naphthenic acid or 10% Versatic acid-10. And then, copper and zinc were extracted at pH 2 with 3% LIX 84 and at pH 2.5∼3 with 20% PC-88A respectively, remaining nickel in the raffinate. In this manner, the heavy metals in electroplating waste water could be effectively separated with solvent extraction method.

• International Journal of Precision Engineering and Manufacturing
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• v.3 no.2
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• pp.72-77
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• 2002

In this paper, a simple method to measure the residual stress in microstructure is presented. In order to find the residual stress in micro-machined beam, the first natural frequency of the beam that has the residual stress inside is analyzed using Rayleigh's energy method. Micro gold electroplated structure is fabricated by surface micro-machining process including electroplating. The made structure is an approximate shape of clamped-clamped beam and its 1 st natural frequency is measured by resonance method. For the better estimation of the residual stress, an equivalent length of micro-fabricated beam to ideal beam is calculated by FEM. The residual stress was estimated from the equivalent length and the measured natural frequency. It was found that a tensile stress was residue in the micro beam structure.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.332-335
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• 2008

PMMA light guiding plate with nano pattern was fabricated by nano imprint lithography method. A silicon mold for electroplating of nickel was fabricated by conventional photolithography process. A nickel stamp for nano imprint lithography was fabricated by electroplating process using silicon mold. The nano imprint lithography was performed on PMMA plate at $140^{\circ}C$ under pressure of 20kN. The nano pattern on PMMA plate was investigated using FE-SEM. It is shown that the patterns were well transferred for several steps and the nano imprint lithography method could be applied for fabricating patterns of light guiding plate.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2530-2532
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• 1998

Micro gold electroplating structure is fabricated by surface micromachining process. The made structure is clamped-clamped beam and its 1st natural frequency is measured by resonance method. In order to find residual stress, first natural frequency of beam which has tensile stress inside is analysed using Rayleigh's method. Elastic modulus and residual stress are estimated from the measured natural frequency.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.69-69
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• 2006

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.11a
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• pp.148-148
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• 2001

• Proceedings of the KWS Conference
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• 2001.10a
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• pp.147-148
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• 2001

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.3
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• pp.182-188
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• 2001

A solenoid-type MEMS inductor with a quality factor over 10 at 2 GHz has been developed using an electroplating technique. The integrated spiral inductor has a low Q factor due to substrate loss and skin effects. It also occupies a large area compared to the solenoid-type inductor. The direction of flux of the solenoid-type inductor is parallel to the substrate, which can lower the substrate loss and other interference with integrated passive components. To estimate the characteristics of the proposed inductor over a high frequency range, the 3D FEM (Finite Element Method) simulation is used by using the HFSS at the Ansoft corporation. The electroplated solenoid-type inductor is fabricated on a glass substrate step by step by using photolithography and copper electroplating. The fabrication process to improve the quality factor of the inductor is also developed. The achieved inductance varies within a range from 0.5 nH to 2.8 nH, and the maximum Q factor is over 10.