• Journal of Radiation Industry
• /
• v.11 no.3
• /
• pp.173-179
• /
• 2017

The small-scale electroplating device was designed and fabricated for Ni-63 sealed source (foil type) with a high specific activity needed for production of betavoltaic battery. The condition of Ni electroplating was optimized by using fabricated electroplating device to establish a Ni-63 electroplating condition on the Ni foil. The results showed that the optimum surface morphology and thickness of Ni deposit was obtained for 1,758 seconds at a current density of $15mA{\cdot}cm^{-2}$ with 0.5% tween 20. Radioisotope Ni-63 electroplating was implemented under established condition. The radioactivity of Ni-63 sealed source was calculated to $28mCi{\cdot}cm^{-2}$, and the thickness of Ni-63 deposit was about $2.4{\mu}m$.

• Journal of the Korean institute of surface engineering
• /
• v.8 no.1
• /
• pp.11-14
• /
• 1975

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.3
• /
• pp.1-7
• /
• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• Journal of the Semiconductor & Display Technology
• /
• v.14 no.1
• /
• pp.67-71
• /
• 2015

Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.25 no.1
• /
• pp.89-94
• /
• 2015

Objectives: The objective of this study was to determine characteristics of workers' exposures to airborne total and hexavalent chromium by job title in electroplating processes. Methods: Total Cr was determined through a modified method based on NIOSH Method 7024. Airborne hexavalent Cr, Cr(VI), was sampled and extracted according to NIOSH Method 7600 and analyzed at 520 nm using an ion chromatograph/visible detector. Results: The geometric mean(GM) of total Cr concentrations from all factories was $11.2{\mu}g/m^3$(GSD=4.9). The GM of Cr(VI) concentrations from all factories was $2.84{\mu}g/m$ (GSD=5.2), and the concentrations among factories were significantly different (p<0.05). The Cr(VI) levels were lower than total Cr levels. Total Cr exposure levels were highest among buffing workers ($21.6{\mu}g/m^3$), but Cr(VI) levels were highest among plating workers($4.15{\mu}g/m^3$). The concentrations of Cr(VI) and total Cr from plating tasks was highly correlated(r=0.91). Conclusions: In the electroplating industry, plating workers were mainly exposed to Cr(VI), but others were not. Oxidation-reduction states of Cr and job titles should be considered in the exposure or risk assessments of chrome electroplating factories.

• Resources Recycling
• /
• v.22 no.3
• /
• pp.91-99
• /
• 2013

Steel industry which has been accomplishes the base of our country economy, automobile and electronic industry are taking charge of the role, whose electroplating is important. Large amount of wastewater and various metal salts, including hazardous materials was generated from the electroplating pre-treatment, plating, washing and post-plating. Currently, the general wastewater follows in the environmental law and neutralization after controlling, sludge where the various metal is mixed reclaims below multiple regulative and trust it is controlling. The sludge which includes the gas price metal reclaims in the field and trust it controls. a reclamation price of land it is insufficient but and the control expense holds plentifully and it loses the gas price metal which is valuable. Consequently, The research regarding to recover a gas price metal actively from this waste water, it is advanced. A new method to recover valuable metals from electroplating wastewater synthesis of metal sulfides using topical methods utilizing iron oxidizing bacteria, reagent of sulfides and solvent extraction using an organic solvent, such as the development of the law to recover these metals and metal sulfides of wastewater using selective recovery have been studied. By using these wastewater treatment method under frequency above 95%, it has been obtained the valuable metal from the wastewater, where the metal ion of Fe, Cu, Zn and Ni complexes was mixed. As we discuss the wastewater, which has been discharged from electroplating process, it is important and will be applied to the resources of metal in the urban mine.

• Transactions on Electrical and Electronic Materials
• /
• v.10 no.3
• /
• pp.71-74
• /
• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• Resources Recycling
• /
• v.30 no.3
• /
• pp.55-62
• /
• 2021

In Korea, a good recycled product (GR) certification system was introduced in 1997 to improve resource and energy use efficiency. However, in industry and society, recycled products are not used well because of the lack of awareness of recycled materials. In this study, the status of domestic and international quality standards for nickel materials was investigated, and the purity and electrochemical properties of nickel sulfate prepared from ore and nickel sulfate recovered from waste lithium-ion batteries were evaluated during the electroplating process. As a result of the test, it was found that there is no quality difference between recycled nickel sulfate and high-purity nickel sulfate reagents when used in the electroplating industry.

• Transactions of the Korean hydrogen and new energy society
• /
• v.31 no.1
• /
• pp.23-32
• /
• 2020

The intermittent characteristics of renewable energy complicates the process of balancing supply with demand. Electrolysis technology can provide flexibility to grid management by converting electricity to hydrogen. Alkaline electrolysis has been recognized as established technology and utilized in industry for over 100 years. However, high overpotential of oxygen evolution reaction in alkaline water electrolysis reduces the overall efficiency and therefore requires the development of anode catalyst. In this study, Raney Ni-Zn-Fe electrode was prepared by electroplating and the electrode characteristics was studied by varying electroplating parameters like electrodeposition time, current density and substrate. The prepared Raney Ni-Zn-Fe electrode was electrochemically evaluated using linear sweep voltammetry. Physical and chemical analysis were conducted by scanning electron microscope, energy dispersive spectrometer, and X-ray diffraction. The plating time did not changed the morphology and composition of the electrode surface and showed a little effect on overpotential reduction. As the plating current density increased, Fe content on the surface increased and cauliflower-like structure appeared on the electrode surface. In particular, the overpotential of the electrode, which was prepared at the plating current density of 320 mA/㎠, has showed the lowest value of 268 mV at 50 mA/㎠. There was no distinguishable overpotential difference between the type of substrate for the electrodes prepared at 80 mA/㎠.

• Journal of Radiation Industry
• /
• v.9 no.4
• /
• pp.167-170
• /
• 2015

Radioisotope (Nuclear) battery using $^{63}Ni$ was prepared as beta cell. The electroplated $^{63}Ni$ on Ni foil is fabricated, and beta cell and photovoltaic hybrid battery was designed to use at both day and night in space project. A Ni-plating solution is prepared by dissolving metal particles including $^{62}Ni$ and $^{63}Ni$ from neutron irradiation of ($n,{\gamma}$). Electroplating solution of a chloride bath consists on nickel ions in HCl, $H_3BO_3$, and KOH. The deposition was carried out at current density of $10mA\;cm^{-2}$. The prepared beta source was attached on a PN junction and measured I-V properties. The power output at activity of 0.07 mCi and 0.45 mCi were 0.55 pW and 2.69 nW, respectively.