• Proceedings of the KIPE Conference
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• 2003.07a
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• pp.10-14
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• 2003

This paper deals with the design of heat dissipation system using the forced air cooling method. It suggests the method of appropriately dividing the whole thermodynamic system into analytical subsystems and also presents the correspondent analytic or experimental equations to subsystems. The experimental results on the designed thermodynamic system for 400kw 1GBT inverter show the validity of the proposed design method in the steady state.

• Proceedings of the KIPE Conference
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• 2014.11a
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• pp.161-162
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• 2014

본 연구의 목적은 HVDC Valve module 및 valve tower에 유입되는 냉각 유체의 유동장 동적 해석과 동시에 냉각 유체의 동적 특성을 측정 비교함으로써 유동 해석의 적합성을 판단하고, HVDC valve module과 valve tower의 냉각 유로 및 관련 기구 설계의 기초 자료로 활용하는데 그 목적이 있다.

• Proceedings of the KIPE Conference
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• 1999.07a
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• pp.97-100
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• 1999

AC to DC single phase PWM converter for traction application requires rated high power and voltage. Therefor, series or parallel operation converters are necessary with considering the limitation of the power device specification. This paper compares the characteristic between two parallel operation of conventional PWM converter and Single phase three level converter about comparison of power circuit, cooling system control method and harmonic current by computer simulation.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2006.05a
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• pp.311-316
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• 2006

• 한국초전도학회:학술대회논문집
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• 2009.07a
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• pp.67-67
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• 2009

• Proceedings of the SAREK Conference
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• 2005.06a
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• pp.127-127
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• 2005

• Proceedings of the SAREK Conference
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• 2005.06a
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• pp.172-172
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• 2005

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.147-163
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• 2003

European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

• Proceedings of the KIPE Conference
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• 2001.07a
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• pp.94-96
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• 2001

As a batch Type device, this machine is contrive to seal glass plates for plasma BLU (Back Light Unit) by indirect heating from electric heaters. In order to maintain the heating / cooling Chambers clean, this machine uses a muffle formation. The components of the machine are listed bellow.

• Proceedings of the KIPE Conference
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• 2015.07a
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• pp.197-198
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• 2015

본 논문에서는 전력 변환기의 방열 능력 극대화를 위한 선택적 스위칭 기법을 제안한다. 제안하는 선택적 스위칭 기법은 전력 변환기의 온도에 따라 IGBT의 스위칭 기법을 달리함으로써 스위칭 손실을 줄일 수 있었으며, 온도가 높아지면 출력 전력을 감소시키던 기존 기법과 달리 출력을 유지하면서도 방열판의 온도를 효과적으로 낮출 수 있다. 제안된 선택적 스위칭기법은 시뮬레이션 및 실험 결과를 통해 타당성이 검증되었다.