• Title/Summary/Keyword: Electronics cooling

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Effect of cooling patches on performance of photovoltaic-thermoelectric hybrid energy devices (쿨링패치 부착에 따른 태양광-열전 융합소자의 성능 연구)

  • Lee, Jaehwan;Cho, Kyoungah;Park, Yoonbeom;Kim, Sangsig
    • Journal of IKEEE
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    • v.25 no.4
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    • pp.716-720
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    • 2021
  • In this study, we examine the availability of a cooling patch to enhance the output power of a hybrid energy device (HED) comprising a photovoltaic cell (PVC) and a thermoelectric generator (TEG). The cooling patch attached on the back of the TEG drops the temperature of the PVC via the TEG and makes a large thermal gradient across the TEG under irradiances in a range of 200 to 1000 W/m2. The cooling patch is more effective for the output power of the HED as the irradiance increases, and it enhances the maximum output power of the HED to 42.1 mW at an irradiance of 1000 W/m2. The increment in the maximum output power reaches 27% owing to the attachment of the cooling patch that does not consume any power.

Monitoring of Silicon Wafer Temperature by IR Laser Interfermetry (적외선 레이저의 간섭현상을 이용한 실리콘 웨이퍼의 온도 측정)

  • 김재성;이석현;황기웅
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.2
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    • pp.81-87
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    • 1994
  • We used IR laser inteferometric technique for measuring the temperature of wafer during cryogenic ECR etching. Using this technique, the effect of RF bias power and microwave power on the wafer temperature during etching period is investigated. As the RF bias power and microwave power was increased, the temperature of the wafer considerably increased and we concluded that to prevent the increase of substrate temperature during etching period, an adequate wafer cooling is needed.

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Water Cooling Pipe Optimal design for Heat-Dissipation of wind power converter system (풍력발전용 전력변환기의 방열을 위한 수냉식 배관 최적 설계)

  • Choi, Jin-Ho;Oh, Seung-Yeol;Choi, Jung-Sik;Yang, Seung-Hak;Kim, Dae-Kyong
    • Proceedings of the KIPE Conference
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    • 2011.07a
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    • pp.485-486
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    • 2011
  • 대용량 전력변환기에서 대부분의 열은 IGBT 소자에서 발생한다. 따라서 소자의 방열을 위한 방열시스템은 전력변환기의 구동 뿐 아니라 각 장치들에 대한 소형, 경량화의 추세에 있어서도 중요한 부분을 차지한다. 본 논문에서는 소자의 냉각을 위해 수냉식 방법을 선정하였으며, 배관 구조에 따른 방열판의 방열특성을 비교하여 최적의 배관 구조를 가진 수냉식 방열판을 제안하였다.

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Fin Patterns For Heat Sinks in Water Cooling Loops of Power Converter System (휜유로 구조를 갖는 전력변환 시스템 방열판 설계)

  • Song, Sung-Geun;Choi, Jin-Ho;Kim, Do-Hyoung;Jang, Mi-Geum;Kim, Dae-Kyong
    • Proceedings of the KIPE Conference
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    • 2011.07a
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    • pp.487-488
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    • 2011
  • 본 논문에서는 풍력발전용 전력변환기 내부 소자의 방열에 사용되는 수냉식 방열판의 관 형상을 제안한다. 최근 대용량 전력변환기는 소형화 및 효율성이 중요시 되고 있으며, 이에 따라 기구의 안정적이고 장기적인 운영을 위한 수냉식 방열설계가 필수적이라 할 수 있다. 수냉식 방열판는 다수의 원형관으로 구성되며, 이 원형관의 형상은 방열판의 열전달 성능에 직접적인 영향을 주게 된다. 따라서 본 논문에서는 열전달 촉진을 위한 방열판의 관 형상들을 모델링하고 열해석 시뮬레이션을 진행하여 모델링된 방열판들의 방열특성을 비교/분석하였다.

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A Study on Pump Selecting for Oil Direct Cooling Type Power Transformer (강제송유 냉각방식 변압기 펌프선정 기준 정립에 관한 연구)

  • Kim, Seong Eon
    • Proceedings of the KIPE Conference
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    • 2014.11a
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    • pp.62-63
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    • 2014
  • 전력용 변압기에서 강제송유 냉각방식을 채택할 경우 절연유 강제 순환을 위한 펌프가 필요한데, 매 설계 시 마다 유동해석 혹은 설계 프로그램을 통해 펌프를 선정하게 되면 상당한 시간이 소요된다. 이러한 시간적 손실을 줄이고자 유동해석 및 유체 이론에 근거하여 간단하게 엑셀 시트로 프로그램화 하였다.

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SiC Mosfet's Application

  • Kim, Simon
    • Proceedings of the KIPE Conference
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    • 2018.07a
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    • pp.519-521
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    • 2018
  • For most of application, total system cost is first priority to Engineer. Approach for making system cost down can be to reduce cooling cost by selecting low loss item or reducing filter cost by increasing frequency. SiC Mosfet ($CoolSiC^{TM}$) can approach both of case. This paper shows market-needs and reviews each application with SiC.

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Development of Nitrogen Cooling Equipment for Personalized Local Area (개인 맞춤형 국소부위 질소 냉각 장비 개발)

  • Lee, Young-Ji;Lee, Joo-Hyun;Lee, Seung-Ho
    • Journal of IKEEE
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    • v.24 no.3
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    • pp.913-916
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    • 2020
  • In this paper, we propose the development of nitrogen cooling equipment for personalized local area. The proposed equipment consists of a cold air supply module, a body, and nitrogen injection with the following characteristics. First, it automatically controls the amount and time of cold air supply by utilizing information measuring skin temperature with volumetric temperature sensors, so it can have a competitive edge in function by ensuring complete safety. Second, if the distance measuring sensor is applied to the skin for more than a certain distance, it can block the cold air or control the discharge of nitrogen in conjunction with the control GUI to improve the efficiency of higher cooling therapy while providing safe management. Third, by installing a control module that can control the supply of nitrogen, the cost of maintenance can be minimized by minimizing the loss of nitrogen. Experiments at an external testing agency to evaluate the performance of the proposed equipment showed that the accuracy of the temperature sensor was measured in the range of ±3.8%, which is lower than the world's highest level(±5%), with a range of 110℃ to -160℃ similar to the world's highest level. Distance accuracy was measured in the range of ±3.0%, lower than the world's highest level(±5%), and weight accuracy in the range of ±0.1%, lower than the world's highest level(±5%). In addition, emission control was measured in four stages, higher than the world's highest level(stage 1) and nitrogen use was measured at 0.8L/min below the world's highest(6L/min). Therefore, the effectiveness of the methods proposed in this paper was demonstrated because they produced the same results as the world's highest levels.

Circuit Modeling and Simulation for Thermoelectric Cooling System using Condensed Water (응축수를 활용한 열전 냉각장치의 회로 모델링 및 시뮬레이션)

  • Lee, Sang-Yun;Jang, Sukyoon;Park, Mignon;Yoon, Changyong
    • Journal of the Korean Institute of Intelligent Systems
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    • v.25 no.2
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    • pp.161-167
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    • 2015
  • In this paper, a novel thermoelectric cooling system utilizing condensed water is introduced and its electrical equivalent circuit model is proposed. The introduced system can deals with the condensed water and improves efficiency by spraying the condensed water on heat sink. The electrical equivalent circuit model is derived by combining the circuit model of the classical thermoelectric cooling system with equation of heat exchange. Because the parameters of the model can be defined from not other experimental data but just the data sheet of the thermoelement, the model can be useful to design and develop the controller of the proposed system. We verify that the proposed model is valid and the introduced system is more efficient than the previous thermoelectric cooling system through simulations.

A Study on the Characteristics of Plastic Injection Molding Using Core in Core Cooling Technology (Core in Core 냉각기술을 적용한 플라스틱 사출성형 특성에 관한 연구)

  • Choi, Yun-Seo;Park, In-Seung;Yang, Dong-Ho;Ha, Byeong-Cheol;Heo, Man-Woo;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.3
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    • pp.82-87
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    • 2019
  • Recently, plastic materials have become more diversified, and the development of materials with excellent mechanical properties and plasticity has enabled wider application, miniaturization, and refinement of injection molded products. As a result, the utilization of these products in household goods, electronics, automotive parts, and aircraft parts is increasing in almost all industries. Injection molded parts are often used externally on finished commercial products. This means that the injection mold industry is very important to the value of these products. For this reason, the industry is performing research on the precision and efficiency of the injection molding process. In this study, we investigated the applicability of the core in core cooling method to the problem of product deformation due to temperature variation in existing injection mold designs. We also characterized the cooling performance of an injection mold when using this cooling method.