• Journal of Korean Society of Industrial and Systems Engineering
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• v.39 no.1
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• pp.153-161
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• 2016

Semiconductor manufacturing has suffered from the complex process behavior of the technology oriented control in the production line. While the technological processes are in charge of the quality and the yield of the product, the operational management is also critical for the productivity of the manufacturing line. The fabrication line in the semiconductor manufacturing is considered as the most complex part because of various kinds of the equipment, re-entrant process routing and various product devices. The efficiency and the productivity of the fabrication line may give a significant impact on the subsequent processes such as the probe line, the assembly line and final test line. In the management of the re-entrant process such as semiconductor fabrication, it is important to keep balanced fabrication line. The Performance measures in the fabrication line are throughput, cycle time, inventory, shortage, etc. In the fabrication, throughput and cycle time are the conflicting performance measures. It is very difficult to achieve two conflicting goal simultaneously in the manufacturing line. The capacity of equipment is important factor in the production planning and scheduling. The production planning consideration of capacity can make the scheduling more realistic. In this paper, an input and scheduling rule are to achieve the balanced operation in semiconductor fabrication line through equipment capacity and workload are proposed and evaluated. New backward projection and scheduling rule consideration of facility capacity are suggested. Scheduling wafers on the appropriate facilities are controlled by available capacity, which are determined by the workload in terms of the meet the production target.

• Journal of international Conference on Electrical Machines and Systems
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• v.2 no.3
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• pp.275-282
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• 2013

Applications such as vibration isolation, gravity compensation, pick-and-place machines, etc., would benefit from (long-stroke) cylindrical/tubular permanent magnet (PM) actuators with integrated passive gravity compensation to minimize the power consumption. As an example, in component placing (pick-and-place) machines on printed circuit boards, passive devices allow the powerless counteraction of translator including nozzles or tooling bits. In these applications, an increasing demand is arising for high-speed actuation with high precision and bandwidth capability mainly due to the placement head being at the foundation of the motion chain, hence, a large mass of this device will result in high force/power requirements for the driving mechanism (i.e. an H-bridge with three linear permanent magnet motors placed in an H-configuration). This paper investigates a tubular actuator topology combined with passive gravity compensation. These two functionalities are separately introduced, where the combination is verified using comprehensive three dimensional (3D) finite element analyses.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.1-5
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• 2024

In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.

• Journal of IKEEE
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• v.21 no.4
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• pp.338-347
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• 2017

This paper describes the design and fabrication of a high power amplifier which is a component of TDL(Tactical Data Link) aircraft terminal. We applied high-speed frequency hopping technology, cognitive radio technology, and receive filter bank technology to efficiently use limited frequency resources with radar and other communication equipment using the same frequency band. The high-power amplifier is physically composed of a transmitter, a receiver, a mechanical part, and a cable assembly, and is designed to meet temperature characteristics and electrical characteristics such as maximum transmission distance and reception sensitivity. Modeling and simulator were used to satisfy the requirement of high power amplifier. The transmit power and the noise figure were measured at 50.02dBm and 2.682dB, respectively. It was confirmed that all the required specifications were satisfied in the electrical characteristics test and the environmental characteristic test.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.8
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• pp.759-769
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• 2013

Electronic equipment has been applied to virtually every area associated with commercial, industrial, and military applications. Specifically, electronics have been incorporated into avionics components installed in aircraft. This equipment is exposed to dynamic loads such as vibration, shock, and acceleration. Especially, avionics components installed in a helicopter are subjected to simultaneous sine and random base excitations. These are denoted as sine on random vibrations according to MIL-STD-810F, Method 514.5. In the past, isolators have been applied to avionics components to reduce vibration and shock. However, an isolator applied to an avionics component installed in a helicopter can amplify the vibration magnitude, and damage the chassis, circuit card assembly, and the isolator itself via resonance at low-frequency sinusoidal vibrations. The objective of this study is to investigate the dynamic characteristics of an avionics component installed in a helicopter and the structural dynamic modification of its tray plate without an isolator using both a finite element analysis and experiments. The structure is optimized by dynamic loads that are selected by comparing the vibration, shock, and acceleration loads using vibration and shock response spectra. A finite element model(FEM) was constructed using a simplified geometry and valid element types that reflect the dynamic characteristics. The FEM was verified by an experimental modal analysis. Design parameters were extracted and selected to modify the structural dynamics using topology optimization, and design of experiments(DOE). A prototype of a modified model was constructed and its feasibility was evaluated using an FEM and a performance test.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.5
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• pp.230-238
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• 2023

Small and medium-sized food manufacturing enterprises are largely reliant on manual labor, from inputting raw materials to palletizing the final product. Recently, there has been a trend toward smartness and digitization through the implementation of robotics and sensor data technology. In this study, we examined the effectiveness of improvement through 3D simulation on two repetitive work processes within a food manufacturing company. These processes involve workers whose speed cannot match the capacity of the applied equipment. Two manual processes were selected: the weighing and packing process performed by workers after skewer assembly, and the manual batch process of counting randomly delivered frozen foods, packing (both internal and external), and palletizing. The production volume, utilization rate, and number of workers were chosen as verification indicators. As a result of the simulation for improving the 3D process, production increased by 13.5% and 56.8% compared to the existing process, respectively. This was particularly evident in the process of applying palletizing robots. In both processes, as the utilization rate and number of input workers decreased, robots could replace tasks with high worker fatigue, thereby reducing work overload. This study demonstrates the potential to visually compare the process flow improvement using 3D simulations and confirms the possibility of pre-validation for improvement.