• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.03a
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• pp.124-131
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• 1996

The use of small hemispherical high-speed precision bearing has increased drastically these days in the field of computer disk driver, highteech devices as well as communication and electronic device drivers. It was suggested that the new polishing process adopting the diamond grinding wheel and polishing tool instead of multi stage lapping processes, which enables the mass production of the bearing by reduction of polishing time. Polishing mechanism was analysed and the results were applied to the design and manufacturing of the polishing system. Experiments for selection of optimal polishing conditions were carried out using the polishing system.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.16 no.28
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• pp.1-8
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• 1993

Electrical or electronic products have been becoming smaller and high integrated recently, with printed circuit boards(PCB's) being the key components for these products. The introduction of new technology of surface mounted devices(SMD) opens new ways towards high integration on the PCB. Many plants in eletronical industry which produce high variety of PCB's to meet the demands of customer orders require flexibility in PCB's production lines. This survey paper describes the related optimization problems and solution methods to the automated surface mount technology(SMT) assembly lines, and provides with the research direction for improving flexibility.

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.40-41
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• 2002

Synthesis of the ferroelectromagnetic material exhibiting ferromagnetism and ferroelectricity simultaneously has been an interesting subject due to not only for a possible application in electronic devices but also from the view point of solid state physics. In this study bulk ceramics and thin films of xBiFeO$_3$-yPrFeO$_3$-zPbTiO$_3$(x+y+z=1) and (1-w)BiFeO$_3$-wPbTiO$_3$ have been explored for finding ferroelectromagnetic material, in which ferroelectricity and ferromagnetism coexist simultaneously. (omitted)

• Journal of Applied Reliability
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• v.5 no.4
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• pp.465-486
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• 2005

A unreliable network system results in unsatisfied performance. A performance criterion of a network is throughput and availability. One of the most compelling technological advances of this decade has been the advent of deploying wireless networks of heterogeneous smart sensor nodes for complex information gathering tasks, The advancement and popularization of wireless communication technologies make more efficiency to network devices with wireless technology than with wired technology. Recently, the research of wireless sensor network has been drawing much attentions. In this paper, We evaluate throughput and availability of wireless sensor network, which have hierarchical structure based on clustering and estimate the maximum hroughput, average throughput and availability of the network considering several link failure patterns likely to happen at a cluster consisted of sensor nodes. Also increasing a number of sensor nodes in a cluster, We analysis the average throughput and availability of the network.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.53-57
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• 2012

This paper is for accurately simulating the breakdown of MHEMTs with an InP-etchstop layer. 2D-Hydrodynamic simulation parameters are investigated and calibrated for the InP-epitaxy layer. With these calibrated parameters, simulations are performed and analyzed for the breakdown of devices with an InP-etchstop layer. In the paper, the impact-ionization coefficients, the mobility degradation due to doping concentration, and the saturation velocity for InP-epitaxy layer are newly calibrated for more accurate breakdown simulation.

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.84-85
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• 2002

Recently doped perovskite manganites have renewed interest because they exhibit a variety of unique magnetic and electronic behaviors such as colossal magnetoresistance (CMR), percolative phase separation, spin/charge/orbital ordering, and so on. For this reason, fabrication of thin films with the best surface morphology and controlling their magneto transport properties is essential for making magneto-resistive devices. (omitted)

• Journal of Institute of Control, Robotics and Systems
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• v.11 no.8
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• pp.733-739
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• 2005

Device Description that is described as C-based DDL(Device Description Language) should be provided for the control system to use the progressive function of field device in the distributed control system. DD expresses field device function itself and parameter. DD is used to set a necessary function far a control strategy in the central control system. DD technology which was adopted as international standard IEC 61804-Part 2 is being used in PROFIBUS, Foundation Fieldbus and HART. However, the DD is dependent to the fieldbus and it doesn't have a suitable form in the industrial Ethernet. This paper presents the possibility of a change from EDD(Electronic Device Description) and GSD(General Slave Data) used for integrating field devices to XDD(XML for Device Description) and verifies it's effectiveness. Also, this paper presents research assignment on the XML application in the distributional system from now on by examining the possibility of Ethernet`s development in the industrial area.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.1
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• pp.29-33
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• 2014

In this paper, we report our numerical simulation on the electronic-optical properties of the phosphorescent organic light emitting diodes (PHOLEDs) devices. In order to calculate the electrical and optical characteristics such as the transport behavior of carriers, recombination kinetics, and emission property, we undertake the finite element method (FEM). Our model includes Poisson's equation, continuity equation to account for behavior of electrons and holes and the exciton continuity/transfer equation. We demonstrate that the refractive indexes of each material affect the emission property and the barrier height of the interface influences the behavior of charges and the generation of exciton.

• IEMEK Journal of Embedded Systems and Applications
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• v.5 no.1
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• pp.23-28
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• 2010

The automotive industry tries to provide infotainment systems to emerging automobiles. Since the infotainment systems require various peripheral devices and network connectivity, legacy operating systems such as Linux and Windows can be much preferred due to its plentiful device drivers and multimedia applications while the operating systems following OSEK standard are used for automotive electronic control units. Thus it is highly desired that the system software supporting infotainment applications can be portable over different legacy operating systems providing unified programming interfaces. The majority of legacy operating systems support POSIX interfaces for application development. MOST is an automotive network standard for infotainment systems. Network Service defines the protocol stacks for MOST control data, which is essential to implement infotainment applications over MOST. In this paper, we suggest a POSIX-based Network Service so that we can utilize legacy device drivers and applications for automotive infotainment systems. We measure the performance of the POSIX-based Network Service and show that its overhead is not significant.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.