• Proceedings of the KIEE Conference
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• summer
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• pp.923-925
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• 2004

A lot of conventional automotive components driven by mechanical power source are being replaced with electrical ones to comply with the demands of market and customer, therefore the amount of electric energy used in a vehicle will be increased continuously. The increment of electric power demand causes interest on new higher power system such as 42V Power Net, and furthermore necessity for development of energy storage device is highlighted recently. This paper present the design of the BLDC motor for electric air-conditioner in 42V system and compare with the characteristics of several type BLDC motor.

• Journal of the Korean Society of Safety
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• v.26 no.5
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• pp.13-16
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• 2011

The vibration and shock of the opto-electronic protective device was induced mechanical failure or fail to work correctly. In order to identify the exciting frequency components of vibration and shock, vibration signals are measured and analyzed from the mechanical power press. In addition, the modal test for the opto-electronic protective device was performed to investigate the dynamic characteristics. Some FEM simulations were carried out and then anti vibration mount was made for opto-electronic protective device. Based on the results of simulations, some kind of rubber mounts were tested to demonstrate the reduction of vibration and shock. It was verified by the test that a considerable amount of vibration and shock were reduced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.211-212
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• 2005

Semiconductor fabrication technique has been increasingly developed virtue of greater demands, and supplies and applied semiconductor components in respective processes under development for minuteness. Now semiconductor having a line-width of 75nm was commercialized, and it is possible to scale down to 25nm. Accordingly, to cover with limitations, alternatives are actively investigated. In this paper, we overview the trend and applications of carbon nano tube (CNT) and present the future and technology based on existed theories.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.179-186
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• 2009

Electronic components in an enclosure have been investigated to prevent undesired thermal problems. The electronic devices, such as ECUs of automotive engines, are operated under the contaminated environments, so that they rely on the passive cooling without any fluid-driving methods. Therefore the radiation heat dissipation plays more important role than the conduction and convection heat transfer. Hence their combined heat dissipation phenomena have been simulated by a numerical model to reveal the effects of supplied heat flux, emissivity of material, geometry of enclosure, charging gas and pressure. The result showed that the radiation had a significant effect on the heat dissipation of module in an enclosure, and some space above the module should be reserved to prevent its thermal problem. In addition, the higher thermal conductivity and pressure of gas in an enclosure could be necessary to improve the thermal dissipation from the electronic devices.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.55-60
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• 2002

The recent trend in electronic devices has been towards light weight, low cost, high performance and improved reliability. Passive components are very important parts of microelectronic devices. The number of passive components used in hand held devices and computers continue to increase. To achieve improvements in costs, component density, performance, and reliability, embedding of these passive components into the printed circuit boards (PCBs) is required. This paper introduces the embedding of passive components, and discusses the remained challenges in the commercialization of this technique.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.485-486
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.51-69
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• 2001

Japan Jisso Technology Roadmap 2001 (JJTR2001) was published by JEITA in April 2001. Future electronic products request further higher assembly technology (ex. Finer pitch packages & components, 3D assembly, etc.) to reduce size and improve performance of the electric products. For LSI Packages, finer ball pitch technology and finer chip connection technology will be developed. For electric components, further size reduction will be developed. For Jisso (assembly) machine, finer pitch assembly and short tact time technology will be developed. Mr. Utsunomiya will present PCB roadmap next.

• Journal of the Korea Institute of Military Science and Technology
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• v.21 no.5
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• pp.697-703
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• 2018

In this paper, we analyzed the operation of the ignition circuit for electronic arm and fire device(EAFD), and investigated the sensitive elements of the circuit system. For reliability analysis, the EAFD ignition circuit was modeled using the PSpice simulation tool, and the output results of the circuit were examined by changing the tolerance of each circuit element. Monte Carlo simulation was used by maintaining the values of the observed sensitive elements at ${\pm}10%$ of the original values and adjusting the values of the other components according to a random distribution. The histogram results of the output peak currents and pulse widths were represented by Weibull and Burr type XII function fittings in three cases(element values are +10 %, 0 %, -10 % of original). For the output peak currents, mean values were 1.0028, 1.0034, and 1.0050, where the variance values were calculated as 0.0398, 0.0396, and 0.0290 using the Weibull function fitting, respectively. For pulse widths, the mean values of 0.9475, 0.9907, and 1.0293 with the variance values of 0.0260, 0.0251, and 0.0238 were obtained using the Burr Type XII function fittings.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.6
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• pp.33-41
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• 2004

In this paper, a polarimetric fiber optic current sensor(P-FOCS) is experimented and fabricated, and then a possibility to the commercial utilization of the P-FOCS is also investigated. The P-FOCS measures an applied current by a Faraday rotation linearly proportional to a magnetic field generated by the applied current. The bending-induced linear birefringence in the sensing fiber is minimized by using the low birefringent fiber. Also, all fiber-optic components are used to avoid optical losses coming from the use of bulk components. A signal processing circuit is constructed and used to eliminate the effects of intensity variations in the output signal due to losses coming from misalignments of components such as fiber connectors. Using the optical source of 632.8nm wavelength, Faraday rotation is measured by passing through the sensing fiber within the solenoid of about 1500 turns which is equivalent to a current source of about 7500A. In the range of 1000A to 7500A, the measurement error for linearity is within about 1.5%.

• Journal of Environmental Impact Assessment
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• v.22 no.6
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• pp.667-676
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• 2013

This study analyzed the energy demand, greenhouse gas emission and greenhouse gas reduction potential of Electronic Electrical components company. The LEAP model targeting long term energy plan was used to establish the most efficient plan for the companies by examining the climate change policy of government and the countermeasures by companies. A scenario was created by having 11 greenhouse gases reduction plans to be introduced from 2011 as the basic plan. Regarding input data, energy consumption by business place and by use, number of employee from 2009 to 2012, land area and change in number of business places were utilized. The study result suggested that approximately 13,800 TJ of energy will be spent in 2020, which is more than 2 times of 2012 energy consumption. When the integrated scenario based on the reduction plan of companies would be enforced, approximately 3,000 TJ will be reduced in 2020. The emission of greenhouse gases until 2020 was forecasted as approximately 760,000 ton $CO_2eq$. When the integrated scenario would be enforced, the emission will be approximately 610,000 ton $CO_2eq$, which is decrease by approximately 150,000 ton $CO_2eq$. This study will help the efficient responding of eElectronic Electrical components company in preparing detail report on objective management system and enforcement plan. It will also contribute in their image as environment-friendly companies by properly responding to the regulation reinforcement of government and greenhouse gases emission target based on environment policy.