• Title/Summary/Keyword: Electronic components

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Component Implementation of Electronic Dictionary (전자사전 컴포넌트의 구현)

  • Choe, Seong-Un
    • The KIPS Transactions:PartD
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    • v.8D no.5
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    • pp.587-592
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    • 2001
  • Many applications are being developed to automate office works, and the electronic dictionary(e-Dictionary) is one of the main components of the office suites. Several requirements are proposed for the efficient e-dictionaries :1) Fast searching time, 2) Data compatibility with other e-dictionaries to deal with words and obsolete word, and 3) Reusable components to develop new customized e-dictionaries with minimized development time and cost. We propose a data format with which any e-dictionary can change data with others. We also develop System Dictionary component and Customer Dictionary component to enable-and-play component reuse. Our e-dictionary achieves fast searching time by efficiently managing Trie and B-tree index structure for the dictionary components.

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Line Segment Detection Algorithm Using Improved PPHT (개선된 PPHT를 이용한 선분 인식 알고리즘)

  • Lee, Chanho;Moon, Ji-hyun;Nguyen, Duy Phuong
    • Journal of IKEEE
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    • v.20 no.1
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    • pp.82-88
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    • 2016
  • The detection rate of Progressive Probability Hough Transform(PPHT) is decreased when a lot of noise components exist due to an unclear or complex original image although it is quite a good algorithm that detects line segments accurately. In order to solve the problem, we propose an improved line detecting algorithm which is robust to noise components and recovers slightly damaged edges. The proposed algorithm is based on PPHT and traces a line segments by pixel and checks of it is straight. It increases the detection rate by reducing the effect of noise components and by recovering edge patterns within a limited pixel size. The proposed algorithm is applied to a lane detection method and the false positive detection rate is decreased by 30% and the line detection rate is increased by 15%.

Investigation of phenol phormaldehyde-based photoresist at an initial stage of destruction in $O_2$ and $N_2O$ radiofrequency discharges

  • Shutov, D.A.;Kang, Seung-Youl;Baek, Kyu-Ha;Suh, Kyung-Soo;Min, Nam-Ki;Kwon, Kwang-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.214-215
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    • 2007
  • Etch rates and surface chemistry of phenol formaldehyde-based photoresist after short time $O_2\;and\;N_2O$ radio frequency (RF) plasma treatment depending on exposure time were investigated. It was found that the etch rate of photoresist sharply increased after discharge turn on and reached a limit with increase in plasma exposure time in both gases. X-ray photoelectron spectroscopy (XPS) analysis showed that the surface chemical structure become nearly constant after the treatment of 15 sec. Concentration of surface oxygen-containing groups after processing both in oxygen and in $N_2O$ plasmas is similar.

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Properties of ZnO:Al thin films prepared by a single target sputtering

  • An, Ilsin;Ahn, You-Shin;Taeg, Lim-Won
    • Journal of Korean Vacuum Science & Technology
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    • v.2 no.2
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    • pp.78-84
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    • 1998
  • ZnO:Al films were prepared by an rf magnetron sputtering and targets for the experiments were fabricated by sintering the mixture of ZnO and Al2O3. The most conductive film was obtained from the target with 2.0∼2.2 wt.% of Al2O3. Optical properties studied with spectroscopic ellipsometry showed band gap widening, i.e., the Burstein-Moss shift, with aluminum doping as well as with the elevation of deposition temperature. And it is found that the optical and electrical properties were related to the density of states as well as the variation of donor level. when hydrogen atoms were introduced into the films, the activation energy for the generation of oxygen vacancy was smaller for the films showing higher conductivity. This indicates that the optimum deposition condition for highly conductive ZnO:Al film has strong relation to the optimum doping condition.

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Visco-Elastic Properties of Glass Fiber Manufactured by Slag Material (슬래그 원료를 사용해서 제조된 유리섬유의 점탄성 특성)

  • Lee, Ji-Sun;Kim, Sun-Woog;Ra, Yong-Ho;Lee, Youngjin;Lim, Tae-Young;Hwang, Jonghee;Jeon, Dae-Woo;Kim, Jin-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.6
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    • pp.477-482
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    • 2019
  • This study investigated the influence of the viscoelastic property of slag when producing glass fiber, MFS631 with 60% of manganese slag, 30% of steel slag, and 10% of silica stone. To fabricate the MFS631 glass bulk, slag materials were placed in an alumina crucible, melted at $1,550^{\circ}C$ for 2 h, and then annealed at $600^{\circ}C$ for 2 h. It was found that glass is non-crystalline through X-ray diffraction analysis. MFS631 fiber was produced at speed in the range of 100~300 rpm at $1,150^{\circ}C$. The loss modulus (G") and storage modulus (G') of the produced glass fiber were evaluated at high temperatures. G' and G" of MFS631 were greater than $893^{\circ}C$, and the modulus value was 136,860 pa. This is similar to the results of a general E-glass fiber graph. Therefore, it was concluded that its spinnability is similar to that of E-glass fiber; therefore, it can be commercialized.

Preparation of Low-Temperature Fired PZT Thick Films on Si by Screen Printing

  • Cheon, Chae-Il;Lee, Bong-Yeon;Kim, Jeong-Seog;Bang, Kyu-Seok;Kim, Jun-Chul;Lee, Hyeung-Gyu
    • Transactions on Electrical and Electronic Materials
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    • v.4 no.2
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    • pp.20-23
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    • 2003
  • Piezoelectric powder with the composition of PbTiO$_3$-PbZrO$_3$-Pb(Mn$\_$1/3/Nb$\_$2/3/)O$_3$ and small particle size of 0.3 $\mu\textrm{m}$ was investigated for low-temperature firing of PZT thick films. PbTiO$_3$-PbZrO$_3$-Pb(Mn$\_$1/3/Nb$\_$2/3)O$_3$ ceramics showed dense microstructure and superior piezoelectric properties, electromechanical coupling factor (k$\_$p/) of 0.501 and piezoelectric constant (d$\_$33/) of 224. The PZT paste was made of the powder and organic vehicles, and screen-printed on Pt(450nm)/YSZ(110nm)/SiO$_2$(300nm)/Si substrates and fired at 800∼900$^{\circ}C$. Any interface reaction between the PZT thick film and the bottom electrode was not observed in the PZT thick films. The PZT thick film fired at 800$^{\circ}C$ showed moderate electrical properties, the remanent polarization(p$\_$r/) of 16.0 ${\mu}$C/$\textrm{cm}^2$, the coercive field(E$\_$c/) of 36.7 ㎸/cm, and dielectric constant ($\varepsilon$$\_$r/) of 531. Low-temperature sinterable piezoelectric composition and high activity of fine particles reduced the sintering temperature of the thick film. This PZT thick film could be utilized for piezoelectric microactuators or microsensors that require Si micromachining technology.

Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications

  • Sharma, Ashutosh;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.1-5
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    • 2015
  • In high temperature aircraft electronics, aluminium based brazing filler is the prime choice today. Aluminium and its alloys have compatible properties like weight minimization, thermal conductivity, heat dissipation, high temperature precipitation hardening etc. suitable for the aerospace industry. However, the selection of brazing filler for high temperature electronics requires high temperature joint strength properties which is crucial for the aerospace. Thus the selection of proper brazing alloy material, the composition and brazing method play an important role in deciding the final reliability of aircraft electronic components. The composition of these aluminium alloys dependent on the addition of the various elements in the aluminium matrix. The complex shapes of aluminium structures like enclosures, heat dissipaters, chassis for electronic circuitry, in avionics are designed from numerous individual components and joined thereafter. In various aircraft applications, the poor strength caused by the casting and shrinkage defects is undesirable. In this report the effect of various additional elements on Al based alloys and brazing fillers have been discussed.

A Study on the Creep Characteristics of Solder of 63 Sn-37Pb (63Sn-37Pb 땜납의 크리프 특성에 관한 연구)

  • 이억섭;김의상
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.2
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    • pp.138-144
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    • 2004
  • The initiation and the propagation of solder joint crack depend on its environmental conditions, such as high temperature creep and thermal fatigue. Creep is known to be the most important factor for the mechanical failure of solder joints in micro-electronic components and micro-systems. This is mainly caused by the different thermal expansion coefficients of the materials used in the micro-electronic packages. To determine the reliability of solder joints and consequently the electronic components, the characterization of the creep behavior of this group of materials is crucial. This paper is to apply the theory of creep into solder joints and to provide related technical information needed for evaluation of reliability of solder joint to failure. 63Sn-37Pb solder was used in this study. This paper experimentally shows a way to enhance the reliability of solder joints.

Experimental study on the cooling characteristics of thermosyphon for the high power electronic components (고발열 전자부품 냉각용 써모사이폰의 냉각특성에 관한 연구)

  • 김광수;김원태;송규섭;이기백
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.10 no.2
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    • pp.137-146
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    • 1998
  • The experimental study is concerned with two-phase closed thermosyphons, (i.e., wickless heat pipes) for the cooling of high power electronic components in telecommunication system. The thermosyphon which can deal with a high heat flux of up to $4.9W/cm^2$ is developed, and the cooling characteristics of thermosyphon is analyzed according to design parameters which are the types of and quantity of working fluid, number of pipes, wire insertion in pipe, inclination angle of thermosyphon, and cooling air velocity. Using water as working fluid is superior cooling performance compared to using acetone, and cooling performance is improved as the number of thermosyphon becomes larger, inserting wires in the pipes, and inclination of $30~60^{\circ}$.

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Reliability analysis for fatigue damage of railway welded bogies using Bayesian update based inspection

  • Zuo, Fang-Jun;Li, Yan-Feng;Huang, Hong-Zhong
    • Smart Structures and Systems
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    • v.22 no.2
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    • pp.193-200
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    • 2018
  • From the viewpoint of engineering applications, the prediction of the failure of bogies plays an important role in preventing the occurrence of fatigue. Fatigue is a complex phenomenon affected by many uncertainties (such as load, environment, geometrical and material properties, and so on). The key to predict fatigue damage accurately is how to quantify these uncertainties. A Bayesian model is used to account for the uncertainty of various sources when predicting fatigue damage of structural components. In spite of improvements in the design of fatigue-sensitive structures, periodic non-destructive inspections are required for components. With the help of modern nondestructive inspection techniques, the fatigue flaws can be detected for bogie structures, and fatigue reliability can be updated by using Bayesian theorem with inspection data. A practical fatigue analysis of welded bogies is utilized to testify the effectiveness of the proposed methods.