• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.69-73
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• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. AS4/PEEK[30/-30/90]s, composite laminate plate was analyzed by ESPI to determine the vibration characteristics with tensile loading and without it. vibration mode shapes are quantitatively compared with the result of numerical analysis. The experimental results agree well with those of numerical analysis. we found that when the composite laminate plate is under the tensile loading, vibration modes can be measured with high accuracy by ESPI.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.131-137
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• 2007

Electronic Speckle Pattern Interferometry(ESPI) is a common method for measuring out-of-plane deformation and in-plane deformation and applied for vibration analysis and strain/stress analysis. However, ESPI is sensitive to environmental disturbance, which provide the limitation of industrial application. On the other hand, Shearography based on shearing interferometer which is insensitive to vibration disturbance can directly measure the first derivative of out-of-plane deformation. In this paper a technique that extract out-of-plane deformation from results of shearography by numerical processing is proposed and measurement results of ESPI and Shearoraphy are compared quantitatively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.226-230
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• 2001

Electronic Speckle Pattern Interferometry (ESPI) has been recently developed and widely used because it has advantage to be able to measure surface deformations of engineering components and materials in industrial areas with non-contact. The spekle patterns to be formed with interference phenomena of scattering phenomena measure the out-of-plane deformations, together with the use of digital image equipment to process the informations included in the speckle patterns and the display consequent interferogram on a computer monitor. In this study, the experimental results of a canti-levered plate using ESPI were compared with those obtained from the simple beam theory. The ESPI results of the canti-levered plate analyzed by 4-step phase shifting method are close to the theoretical expectation. Also, out-0of-plane displacements of a spot welded canti-levered plate were measured by ESPI with 4-step phase shifting technique. The phase map of the spot welded canti-levered plate is quite different from that of the canti-levered plate without spot welding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.323-324
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• 2006

• Proceedings of the Korean Reliability Society Conference
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• 2002.06a
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• pp.253-260
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• 2002

This paper propose Electronic Speckle Pattern Interferometry(ESPI) for reliability evaluation of electronic device. Especially, vibration problem in a fan of air conditioner, motor of washing machine and etc. is important factor to design the devices. However, it is difficult to apply previous method, accelerometer to the devices with lightweight and complex geometry. ESPI, non-contact measurement technique is applied for vibration analysis of a sirocco fan inside air conditioner. Vibration mode shapes, natural frequency and the range of the frequency are decided and compared with that of FEM analysis. In mechanical deign of new product, ESPI is able to supply effective design information.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.807-813
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• 2015

In the present study, an interferometer system, which integrates the laser sensitivity control technique based on the theory of electronic speckle pattern interferometry, one of non-contact non-destructive analysis methods, was developed. This interferometry system receives an image from CCD cameras for each reference and object, and compares the photosensitivity of the object and reference images from imagification. For the purpose of this study, the photosensitivity of object and reference light is measured with power meters, and the amount of light was controlled with an ND filter with a reference light port matching photosensitivity. Using the plate specimen as the object, 0.6, 0.9, 1.2, and $1.5{\mu}m$ of out-plane deformation was made, and images were compared according to the difference in photosensitivity. After analysis, larger object deformations showed larger numbers of stripe patterns. Images became clearer and data error was reduced when the photosensitivity of object and reference light matched.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.3
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• pp.93-100
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• 2008

Laser interferometry is widely used as a measuring system in many fields because of its high resolution and ability to measure a broad area in real-time all at once. In conventional LASER interferometry, for example Out-of-plane ESPI(Electronic Speckle Pattern Interferometry), In plane ESPI, Shearography and Holography, it uses PZT or other components as a phase shift instrumentation to extract 3D deformation data, vibration mode and others. However, in most cases PZT has some disadvantages, which include nonlinear errors and limited time of use. In the present study, a new type of LASER interferometry using a laser diode is proposed. Using LASER Diode Sinusoidal Phase Modulating (LD-SPM) interferometry, the phase modulation can be directly modulated by controlling the LASER Diode injection current thereby eliminating the need for PZT and its components. This makes the interferometry more compact. This paper reports on a new approach to the LD Modulating interferometry that involves four-buckets phase shift method. This study proposes a four-bucket phase mapping algorithm, which was developed to have a guaranteed application, to stabilize the system in the field and to be a user-friendly GUI. In this paper, the theory for LD wavelength modulation and sinusoidal phase modulation of LD modulating interferometry is shown. Four-bucket phase mapping algorithm is then introduced.

• Journal of KSNVE
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• v.9 no.3
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• pp.509-516
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• 1999

The ESPI (Electronic Speckle Pattern Interferometry) algorithm has been simulated to calculate vibrational modes of a thin right-angled STS304 plate. The phase transformation of the reference wave of the ESPI is carried out only one time during vibration in order to clarify ESPI speckle patterns. Two dimensional vibrational modes are calculated from one ESPI pattern before vibration onset and two ESPI patterns during vibrations but with and without the phase transformation. The ESPI harmonic results are compared with those derived from the finite element method (FEM), and they agree very well. Additionally a phase unwrapping algorithm has been newly developed to derive a displacement map from an ESPI phase map.

• Journal of Technologic Dentistry
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• v.35 no.1
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• pp.49-56
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• 2013

Purpose: The deformation characteristics induced by non-destructive stresses using piezoelectric transducer(PZT) were analyzed for 3-unit fixed partial dentures manufactured PFM, Everest(CAD/CAM) and Zirkonzahn(copy milling, MAD/MAM) by electron speckle pattern interferometery(ESPI). Methods: The ESPI analysis after loading the restoration with PZT by applying electric voltage of 900mV at the points of 10 mm above the base of the prostheses. Results: PFM and All-Ceramic Everest prostheses showed about 0.1 ${\mu}m$ while that of All- Ceramic Zirkonzahn prostheses showed 0.085 ${\mu}m$, demonstrating that Zirkonzahn displaced less. For PFM and All-Ceramic Zirkonzahn prostheses, the displacements were large at just below the loading point, while generalize displacement was shown over the loading point and weak connector areas for All-Ceramic Everest prostheses. Conclusion: We could find that the deformation characteristics induced by non-destructive stresses using PZT analyzed by ESPI were similar to the fracture strengths evaluated using universal testing machine.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.35-40
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• 2004

The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...