• 제목/요약/키워드: Electronic Speckle Pattern Interferometry

검색결과 125건 처리시간 0.026초

전자 스페클 간섭계에 의한 스피커 진동 해석 (Vibration Analysis of Loudspeaker by Using Electronic Speckle Pattern interferometry)

  • 강영준
    • 한국생산제조학회지
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    • 제6권1호
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    • pp.92-99
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    • 1997
  • Nowadays, Electronic Speckle Pattern Interferometry is a well-established measuring technique with a wide range of industrial applications, particularly in the fields of deformation measurement and vibration analysis. Comparing with holographic interferometry, it has some attractive features, which are rapid recording and reconstruction, satisfiable automation etc. The Time-Average ESPI is used to provide vibration mode shape of an object whose vibration amplitude is given as a fringe pattern. Its merit is rapid and simple measurement for vibrating object. However, it is not possible to determine the direction of motions of a point on the object at any given time, because it does not give any information about the phase of vibration. But, Stroboscopic ESPI can measure the amplitude and phase of vibrating surface. In this paper, loudspeakers were tested by these two methods. As a result, we can assume that these techniques will be applied directly in the loudspeaker industry.

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전자 스페클 패턴 간섭법을 이용한 형상 측정에 관한 연구 (A Study on Shape Measurement by Using Electronic Speckle Pattern Interferometry)

  • 강영준;김계성
    • 한국정밀공학회지
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    • 제15권10호
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    • pp.156-164
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    • 1998
  • Electronic Speckle Pattern Interferometry(ESPI) has been used to measure surface deformations of engineering components and materials in industrial areas. ESPI, a non-contact and non-destructive technique, is capable of providing full-field results with high spatial resolution and high speed. One of the important application using electronic speckle pattern interferometry is electronic speckle contouring of a diffused object for 3-D shape analysis and topography measurement. Generally the electronic speckle contouring is suitable for providing measurement range from millimeters to several centimeters. In this study, we introduce the contouring method by modified dual-beam speckle pattern interferometer and the shift of the two illumination beams through optical fiber in order to obtain the contour fringe patterns. We also describe formation process of depth contour fringes and grid contour fringes by shifting direction of the two illumination beams. Before the experiments, we performed the geometric analysis for dual-beam-shifted ESPI contouring, and then, the electronic speckle contouring experiment with various specimens. For quantitative analysis of the contour fringes, we used 4-frame phase shifting method with PZT Finally, good agreement between the geometric analysis and experimetal results is obtained.

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전자 스페클 패턴 간섭계를 이용한 형상 측정 (Surface contouring using Electronic Speckle Pattern Interferometry)

  • 김계성;유원재;강영준
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.397-401
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    • 1995
  • ESPI(Electronic Speckle Pattern Interfermetry) is an optical technique to measure surface deforamtion of engineering components and materials in industrial ares. This optical method is capable of providing full-field results with high spatial resolution, high speed and is the non-contact technique. One of important application aspects using electronic speckle pattern interferometry is to generate contours of a diffuse object in order to provide data for 3-D shape analysis and topography measurement. The contouring method by modified dual-beam speckle pattern interferometry is proposed. We introduce a shift of the illumination beams through optical fiber in order to obtain the contour fringe patterns. The speckle pattern correlation technique is suitable for providing measurement range from millimeters to several centimeters. The complete geometric analysis of the contoretical and experimental results are obtained.

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전자처리 스페클 패턴 간섭법(ESPI)을 이용한 복합재료의 진동 특성 해석에 관한 연구 (A Study on the Vibration Characteristics Analysis of Composite Materials by Using Electronic Speckle Pattern Interferometry Method)

  • 김경석;정성균;정현철;양승필;김형택;김동일;이승환
    • 한국정밀공학회지
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    • 제15권9호
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    • pp.68-74
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    • 1998
  • The ESPI(Electronic Speckle Pattern Interferometry) is a real time, full-field, non-destructive optical measurement technique that allows static and dynamic deformation analysis and surface shape measurements of engineering structures. e .g. turbine blades. vehicle engine components, body panels, etc. This technique is very similar to holographic interferometry, but uses a solid static camera and an image processing board for recording and digital processing of speckle patterns. In this paper it is presented that FEM results for the free vibration of symmetrically laminated composite as [30/-30/90]s. The natural frequencies of laminated composite rectangular plates having the particular boundary condition are experimentally obtained. In order to demonstrate the validity of the experiment, FEM analysis using ANSYS was performed and natural frequencies experimentally obtained is compared with calculation by FEM analysis. The results obtained from both experiment and FEM analysis show a good agreement.

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전자 스페클 간섭계에 의한 스피커 진동 해석 (Vibration Analysis of Loudspeaker by Using Electronic Speckle Pattern Interferometry)

  • 김정규;노경완;강영준;김동우
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 추계학술대회 논문집
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    • pp.356-361
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    • 1996
  • Nowadays, Electronic Speckle Pattern Interferometry is a well established measuring technique with a wide range of industrial applications, particularly in the fields of deformation measurement and vibration analysis. Comparing with holographic inteferometry, it has some attractive features, which are rapid recording and reconstruction, satisfiable automation etc. Time-average ESPI was used to provide vibration mode shape of an object whose vibration amplitude is given as a fringe pattern. However, it is not possible to determine the direction of motions of a point on the object at any given time, because time-average method does not give any information about the phase of vibration. A better technique is stroboscopic method which can measure the amplitude and phase of vibrating surface. In this paper, loudspeakers were tested by these two methods and the mode shape and amplitude of vibration were visualized. As measured results, we can assume that these techniques will be applied directly in the loudspeaker industry.

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스페클 패턴 간섭계의 원리 및 응용 (Principles and Applications of Speckle Pattern Interferometry)

  • 강영준
    • 한국정밀공학회지
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    • 제17권6호
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    • pp.32-39
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    • 2000
  • 간섭성 광원인 레이저를 이용한 계측 몇 검사기법 중 대표적인 것이 홀로그래피를 이용한 간섭법(Holographic Interferometry, HI)이다. HI는 레이저파장을 단위로 하기 때문에 물체변형에 대해 측정감도가 좋고 비파괴 비접촉의 계측이 가능하다. 또한 삼차원 정보 추출이 가능해서 주어진 간섭무늬로부터 전 영역의 변형을 구할 수 있다는 커다란 장점을 가지고 있다.(중략)

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스페클 간섭계의 원리와 전망 (Principles and Prospect of Speckle Pattern Interferometry)

  • 강영준
    • 한국정밀공학회지
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    • 제21권5호
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    • pp.7-13
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    • 2004
  • 간섭성 광원인 레이저를 이용한 계측 및 검사기법 중 대표적인 것이 홀로그래피를 이용한 간섭법(Holographic Interferometry, HI)이다. HI는 레이저 파장을 단위로 하기 때문에 물체변형에 대해 측정감도가 좋고 비파괴 비접촉의 계측이 가능하다. 또한 삼차원 정보 추출이 가능해서 주어진 간섭무늬로부터 전 영역의 변형을 구할 수 있다는 커다란 장점을 가지고 있다. 그러나 일반적으로 홀로그래피용 필름은 기록 및 현상방법이 성가시고 그 속도 또한 느릴 뿐만 아니라 간섭무늬 패턴도 매우 복잡해서 산업현장 등 실제의 응용에는 현실적인 어려움이 있다.(중략)

레이저 스페클 간섭법을 이용한 면내 변형 측정 및 해석에 대한 연구 (II) (A Study on Measurement and Analysis of In-Plane Deformations by Using Laser Speckle Interferometry (II))

  • 강영준;노경완;나의균
    • 한국정밀공학회지
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    • 제15권12호
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    • pp.113-119
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    • 1998
  • Recently Electronic Speckle Pattern Interferometry(ESPI) has been studied because it has the advantages to be able to measure the whole-field surface deformations of engineering components and materials in industrial areas with noncontact. The speckle patterns to be formed with interference phenomena of scattering light from rough surfaces illuminated by laser light have phase informations of surface deformations. In this study we used this interference phenomena and the phase shifting method to measure the inplane deformations, together with the use of digital image equipment to process the informations contained in the speckle pattern and to display consequent interferograms on TV monitor. FEA was performed before experiments and we obtained good agreement between the experimental results and FEA.

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전자처리스페클패턴 간섭법을 이용한 평판 용접시험편의 잔류응력 측정 (Residual Stress Measurement of Flat Welded Specimen by Electronic Speckle Pattern Interferometry)

  • 장호섭;김동수;정현철;김경석
    • 비파괴검사학회지
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    • 제32권2호
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    • pp.149-154
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    • 2012
  • 용접구조물에는 외력이 부가되기 이전에 잔류응력이 걸려 있으므로 용접잔류응력 크기 및 분포 상태는 취성파괴, 피로강도, 응력부식균열, 좌굴, 시효변형과 같은 다양한 형태의 손상에 직접적으로 영향을 끼쳐 잔류응력을 정량적으로 해석하기 위한 지속적인 연구가 필요한 실정이다. 본 논문은 비파괴적인 기법 중 레이저를 이용한 전자처리스페클패턴 간섭법을 이용하여 평판 용접시험편의 외부하중에 따른 전체 거동에 잔류응력의 측정 기법을 제시하고자 한다. 용접시험편에 인장 하중을 가하였을 때, 이를 전자처리패턴스페클 기법을 이용하여 측정하였다. 측정된 결과로부터 용접시험편의 모재부와 용접부의 변형률을 측정하고, 이를 이용하여 탄성계수를 측정하였다. 본 논문은 전자처리스페클패턴 간섭법으로 용접시험편의 용접부와 모재부의 변형률의 차이를 이용하여 잔류응력 값을 산출하는 식을 제시하였고, 이를 수치적으로 계산하여 잔류응력 값을 산출하였으며 측정 결과, 모재부에 비해 용접부의 탄성계수가 약 3.7배 높은 약 8.46 MPa로 측정되었다.