• Applied Microscopy
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• v.36 no.spc1
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• pp.25-33
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• 2006

Nanofabrication with finely focused ion and electron beams is reviewed, and position and size controlled fabrication of nano-metals and -semiconductors is demonstrated. A focused ion beam (FIB) interface attached to a column of 200keV transmission electron microscope (TEM) was developed. Parallel lines and dots arrays were patterned on GaAs, Si and $SiO_2$ substrates with a 25keV $Ga^+-FIB$ of 200nm beam diameter at room temperature. FIB nanofabrication to semiconductor specimens caused amorphization and Ga injection. For the electron beam induced chemical vapor deposition (EBI-CVD), we have discovered that nano-metal dots are formed depending upon the beam diameter and the exposure time when decomposable gases such as $W(CO)_6$ were introduced at the beam irradiated areas. The diameter of the dots was reduced to less than 2.0nm with the UHV-FE-TEM, while those were limited to about 15nm in diameter with the FE-SEM. Self-standing 3D nanostructures were also successfully fabricated.

• Design & Manufacturing
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• v.14 no.2
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• pp.62-68
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• 2020

Recently, research on precise parts required in aerospace, ship, and automobile industries has been actively conducted. In this paper, electron beam drilling machining parameters were selected and experiments were conducted to compare processing characteristics analysis according to machining parameters through machining experiments of a vaporization amplification sheet to which STS 304 was applied. Also, as a result of measuring the machining. As the thickness gradually increased, it was confirmed that the electron beam could not reach the vaporization amplification sheet and thus melted on the surface of the material. As a result of the experimental analysis, it was analyzed that the vaporization explosion reaction of the vaporization amplification sheet was not normally performed due to the working distance (WD) according to the material thickness.

• Design & Manufacturing
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• v.14 no.1
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• pp.56-62
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• 2020

An electron beam was used to mainly utilize for polishing, finishing, welding, a lithography process, etc. Due to the high technical level of difficulty of high-power density electron beam, it is difficult to secure related technologies. In this study, research was carried out to improve the machinability by developing the vaporized amplification sheets to realize the electron beam drilling technology. Their vaporized amplification sheets were analyzed by using the measurement of chemical and composition, which is such as TGA, SEM. We analyzed micro-hole processing using a microscope. Also, the thermal characteristics of vaporized amplification sheets are highly significant for applying to high-power density electron beam technique. So, we finished the vaporized amplification sheets according to the process conditions and analyzed it according to the machining conditions of the electron beam. It was confirmed that the effect on the experimental results differs depending on the influence of the metal powder contained in the developed material.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.78-78
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• 1999

Experimental studies of laser micromachining on Mo metal using piezo Q-switched Nd:YAG laser have been performed. Miniaturized microcolumn electron gun arrays as a potential electron beam lithography or portable mini-scanning electron microscope application have recently extensively examined. For these purpose, the electro-static electron lens and deflector system called microcolumn has to be assembled. The conventional microcolumn fabrication technique would gave a limitation on the minimization of aberration. The current technique of a 1 $\mu$m misalignment would lead to ~1.3 nm coma. In order to reduce aberration, assembling the microcolumn component followed by laser drilling should be very beneficial. In this report, we will address the preliminary report of laser micromachining on Mo substrate using piezo Q-switched Nd:YAG laser. The geometrical figures, such as the diameter and the depth of the frilled aperture are dependent upon the total energy of the laser pulse train, laser pulsewidth, and the diameter of laser beam in addition to the materials-dependent parameters.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.187-187
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• 2012

In this report, the plasmonic nanopores of less than 5 nm diameter were fabricated on the apex of the pyramidal cavity array. The metallic pyramidal pit cavity can also utilized as the plasmonic bioreactor, and the fabricated Au or Al metallic nanopore can provide the controllable translocation speed down using the plasmonic optical force. Initially, the SiO2 nanopore on the pyramidal pit cavity were fabricated using conventional microfabrication techniques. Then, the metallic thin film was sputter-deposited, followed by surface modification of the nanometer thick membrane using FESEM, TEM and EPMA. The huge electron intensity of FESEM with ~microsecond scan speed can provide the rapid solid phase surface transformation. However, the moderate electron beam intensity from the normal TEM without high speed scanning can only provide the liquid phase surface modification. After metal deposition, the 100 nm diameter aperture using FIB beam drilling was obtained in order to obtain the uniform nano-aperture. Then, the nanometer size aperture was reduced down to ~50 nm using electron beam surface modification using high speed scanning FESEM. The followed EPMA electron beam exposure without high speed scanning presents the reduction of the nanosize aperture down to 10 nm. During these processes, the widening or the shrinking of the nanometer pore was observed depending upon the electron beam intensity. Finally, using 200 keV TEM, the diameter of the nanopore was successively down from 10 nm down to 1.5 nm.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.253-261
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• 2004

The machining technology for the brittle materials such as ceramics are applied to the fields of MEMS(micro electromechanical system) by the progress of new machining technologies such as Etching, Diamond machining, Micro drilling, EDM(Electro discharge machining), ECDM(Electro discharge machining), USM(Ultrasonic machining), LBM(Laser beam machining), EBM(Electron beam machining). Especially, the USM technology can be applied to the dieletric brittle materials such as silicon, borosilicate glass, silicon nitride, quartz and ceramics with high aspect ratio. The micro machining system with machining force controlled position servo is developed in this paper and the optimized ultrasonic machining algorithm is constructed by the force controlled position servo control. The load cell is adapted in the force measuring and the servo control algorithm, suit for the ultrasonic machining characteristics, is estabilished with using the PID auto-tunning functions at the PMAC system which is generally adapted in the field of robot industries. The precision force signal amplifier is constructed with high precision operational amplifier AD524. The vacuum adsorption chuck which is made of titanum and internal flow line is engraved, is used in the workpiece fixing. The mahining results by USM shows that there are some deviation between the force command and the actual machining force that the servo control algorithm should be applied in the machining procedures. Therefore, the constant force controlled position servo system is developed for the micro USM system and by the examination machining process in USM, the stable USM system is realized by tracking the average value of machining force.

• Design & Manufacturing
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• v.16 no.1
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• pp.43-49
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• 2022

As technologies in various industrial fields develop, high-quality parts are required. In the past, precision parts were produced by the contact machining method, but the contact machining method has clear limitations. In order to solve this problem, research on a non-contact processing method has been conducted, and laser processing and electric discharge processing are representative. However, the non-contact method has a problem in that productivity is insufficient, and there is a problem that it takes a lot of time to continuously process microholes. Researchers have developed an electron beam drilling equipment for continuous processing of fine holes, and a vaporization amplification sheet to increase the processing efficiency of the equipment. In this study, a cylindrical vaporization amplification sheet using room temperature curing type silicon was fabricated, and the metal distribution and thickness uniformity of the produced sheet were analyzed. In order to manufacture a cylindrical vaporization amplification sheet, an equipment capable of using centrifugal force was developed, and a sample in which metal powder was evenly distributed and a constant thickness was produced.