• KEPCO Journal on Electric Power and Energy
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• v.1 no.1
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• pp.135-140
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• 2015

Decomposition of carbon dioxide is studied using $Ar/CO_2$ mixture inductively coupled plasmas (ICP). Argon gas was added to generate plasma which has high electron density. To measure decomposition rate of $CO_2$, optical emission actinometry is used. Changing input power, pressure and mixture ratio, the plasma parameters and the spectrum intensity were measured using single Langmuir probe and spectroscope. The source characteristic of Carbon dioxide ICP observed from the obtained plasma parameters. The decomposition rate is evolved depending on the reaction and discharge mode. This result is analyzed with both the measurement of the plasma parameters and the dissociation mechanism of $CO_2$.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1649-1650
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• 2006

반도체 소자의 선폭이 나노미터 스케일로 진입함에 따라 소자의 물리적 특성을 나노미터 스케일에서 정밀하게 측정하고자 하는 요구가 증대되고 있다. Atomic Force Microscopy (AFM)은 나노미터 이하의 해상도를 가지고 물질 표면의 기하하적, 전기적 특성 등을 측정할 수 있으므로 나노소자 연구에 필수적인 도구가 되었다. 그러나 AFM은 낮은 측정속도와 탐침의 기하학적 형상에 의한 AFM 영상의 왜곡 등과 같은 치명적인 단점도 가지고 있다. AFM의 낮은 측정 속도를 개선하기 위해서 진보된 마이크로머시닝기술을 이용하여 캔틸레버의 크기를 줄이거나 캔틸레버 위에 박막 구동기를 집적시키는 등의 노력이 진행되고 있으나, 이 경우 전통적인 식각 공정을 이용하여 캔틸레버 위에 tip을 형성하는 것이 매우 어렵다. 본 연구에서는 이미 제작된 캔틸레버 위에 전자빔 조사법을 이용하여 탄소상 tip을 직접 성장시킴으로써 전통적인 식각 공정에 비해 매우 간단하고 값싸며, 활용도가 높은 공정을 개발하였다. 탄소상 tip 성장에 필요한 탄소 소스는 dipping 방법을 이용하여 공급하였고, 시분할법을 사용하여 캔틸레버의 원하는 위치에 tip을 성장시킬 수 있었다. 이렇게 제작된 tip은 최대 $5{\mu}m$ 높이까지 가능했으며, 종횡비는 10:1 이상이어서 tip의 형상에 의한 AFM 영상 왜곡 현상을 최소화할 수 있을 것으로 기대된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.9
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• pp.755-759
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• 2011

$Cu(In_{1-x},Ga_x)Se_2$ thin films have been considered as an effective absorber material for high efficient solar cells. In this paper, the CIGS thin films with varied Ga content were prepared using a co-evaporation process of three stage. We carry out structure and electrical optical property on the thin film in varied Ga content. CIGS thin films have been characterized by X-ray diffraction(XRD), scanning electron microscopy(SEM), energy-dispersive spectroscopy(EDS), four-point probe measurement, and the Hall measurement. To optimize Ga contents, Ga/(In+Ga) ratio were changed from 0.13 to 0.72. At this time the carrier concentrations were varied from $1.22{\times}10^{11}\;cm^{-3}$ to $5.07{\times}10^{16}\;cm^{-3}$, and electrical resistivity were varied from $1.11{\times}10^0\;{\Omega}-cm$ to $1.08{\times}10^2\;{\Omega}-cm$. A strong <220/204> orientation and a lager grain size were obtained at a Ga/(In+Ga) of 0.3. We were able to achieve conversion efficiency as high as 15.95% with a Ga/(In+Ga) of 0.3.

• Journal of Conservation Science
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• v.6 no.1 s.7
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• pp.3-14
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• 1997

Twelve Punchong sherds collected in Hakbongni, Kongju where the well known iron-painted on white slip were manufactured from late 15C to early 16C were analyzed for their composition and microstructure. The composition of the body was analyzed by X-ray fluorescence and that of glaze by electron probe micro-analyzer. Microstructure was observed by optical microscope, polarizing microscope, EPMA, and X-ray diffractometer. The results of composition of body and glaze of Hakbongni were compared with those of Punchong from Yongsuri, Boryong which was close to Hakbongni. The composition of body and glaze of these two areas were compared by principal component analysis using SPSS program. Hakbongni bodies have higher silica and flux materials but lower alumina and their glaze have higher silica, soda, iron oxide but lower alumina, calcia. Hakbongni punchong itself is divided into two groups. Their glaze is lime type. There are many remnant minerals, such as quartz, large feldspar mass with partially melted surrounding area, albite, biotite, and iron-oxide. From such a microstructure we can assume that preparation of raw material was rather crude and firing temperature quite low. Iron-painted material is identified as Mg/Fe/Al spinel by composition analysis and XRD pattern.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.9
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• pp.5756-5762
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• 2015

This paper has studied the lotus effect of the biomimetic engineering that is inspired from the nature. The biomimetic engineering has been improved with the nanotechnology. This paper has observed the hydrophobic property of the surface of the lotus leaf by using the scanning electron microscope (SEM) and atomic force microscope (AFM). The nano-scale of the hydrophobic lotus leaves are maximized the surface tension of water. The general grass leaf has been compared with the lotus leaf through the SEM and AFM - in the viewpoint of the 2D and 3D morphology. Also, The pre-existing of the hydrophobic theory was investigated and compared with the experimental observations for the lotus leaf.

• Journal of Surface Science and Engineering
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• v.49 no.1
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• Restorative Dentistry and Endodontics
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• v.18 no.1
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• pp.27-37
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• 1993

The purpose of this study was to determine the fluroide release levels of new fluoride-containing liner/base cements and the fluoride uptake by dentin surfaces. Ten specimens of each brand (Fuji ionomer Type III, Fuji Lining LC, Timeline, Vitrebond and XR ionomer) were made, polymerized and placed in fluoride-free distilled water at $37^{\circ}C$, 100% relative humidity for 24 hours. The extracting solution of specimen was exchanged and fluoride release was measured daily for the 30 days. For fluoride uptake study, twenty-five extracted human lower molars were sectioned longitudinally in the mesiodistal direction with a diamond disc. Five teeth were filled with each material and then stored at $37^{\circ}C$, 100% humidity for 4 weeks. Fluoride uptake by dentin from the test materials was evaluated using electron probe micro X-ray analyzer. The following results were obtained : 1. The amounts of fluoride release showed no significant difference between Fuji ionomer Type III and Fuji Lining LC, but showed significant difference between other groups. XR ionomer released significantly greater fluoride than any other group(P<.001). 2. All the materials have a burst effect which more fluoride released in then first 3 day and showed significant decrease over the test period (P<0.001). 3. XR ionomer group showed fluoride penetration to approximately $50{\mu}m$ deep in dentin. But other material groups showed very little fluoride uptake by dentin.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.1
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• pp.37-42
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• 2000

Copper thin films have been prepared by a metal organic chemical vapor deposition (MOCVD) technology on polyimide and TiN substrates. The Cu-MOCVD technology has advantages of the high deposition rate and the good step coverage compared with the conventional physical vapor deposition (PVD) technology in several industrial applications. The Cu films have been deposited with varying the experimental conditions of substrate temperatures and copper source vapor pressures. The films were annealed in a vacuum condition after the deposition, and the annealing effect on the electrical properties of the films was measured. The crystallinity and the microstructures of the films were observed by scanning electron microscopy (SEM), and the electrical resistivity was measured by 4-point probe. In the case of the Cu deposition on TiN substrate, the best electrical property of the films was measured for the samples prepared at 18$0^{\circ}C$. Very high deposition rate of the Cu film up to 250 nm/min was obtained on the polyimide substrate when the mixture of liquid and vapour precursor was used.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.381-382
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• 2007

IZO/Ag/IZO (IAI) anode films for flexible organic light emitting diodes (OLEDs) were grown on PC (polycarbonate) substrate using DC sputter (IZO) and thermal evaporator (Ag) systems as a function of Ag thickness. To investigate electrical and optical properties of IAI stacked films, 4-point probe and UV/Vis spectrometer were used, respectively. From a IAI stacked film with 12nm-thick Ag, sheet resistance of $6.9\;{\Omega}/{\square}$ and transmittance of above 82 % at a range of 500-550 nm wavelength were obtained. In addition, structural and surface properties of IAI stacked films were analyzed by XRD (X-ray diffraction) and SEM (scanning electron microscopy), respectively. Moreover, IAI stacked films showed dramatically improved mechanical properties when subjected to bending both as a function of number of cycles to a fixed radius. Finally, OLEDs fabricated on both flexible IAI stacked anode and conventional ITO/Glass were fabricated and, J-V-L characteristics of those OLEDs were compared by Keithley 2400.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.7
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• pp.571-574
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• 2010

Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).