• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.153-158
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• 2007

Recently nano imprint lithography to fabricate photonic crystal on polymer is preferred because of its simplicity and short process time and ease of precise manufacturing. But, the technique requires the precise mold as an imprinting tool for good replication. These molds are made of the silicon, nickel and quartz. But this is not desirable due to complex fabrication process, high cost. So, we describe a simple, precise and low cost method of fabricating PDMS stamp to make the photonic crystals. In order to fabricate the PDMS mold, we make the original pattern with designed hole array by finding the optimal electron beam writing condition. And then, we have tried to fabricate PDMS mold by the replica molding with ultrasonic vibration and pressure system. We have used the cleaning process to solve the detaching problem on the interface. Using these methods, we acquired the PDMS mold for photonic crystals with characteristics of a good replication. And the accuracy of replication shows below 1% in 440nm at diameter and in 610nm at lattice constant by dimensional analysis by SEM and AFM.

• Nuclear Engineering and Technology
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• v.38 no.8
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• pp.779-784
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• 2006

The design, manufacturing process, and first operating test of a high power RF source for a proton accelerator are described. A klystron amplifier system has been developed for operation at 700 MHz, 1 MW and is composed of a triode type electron gun, six cavities, an RF output window, a beam collector, and an electromagnet. The prototype klystron was constructed and tested at a reduced duty to produce the designed output RF power.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1998.04a
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• pp.302-307
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• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.24-29
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• 2005

Fm (Focused ion beam) system is one of the most important equipments for the nano-scale machining. Various researches have been performed, since it can etch the material and deposit 3-D structure with high-aspect-ratio in the nanometer scale. In spite of those researches, the definite method for the reliability of FIB system has not been reported. In this paper, we proposed the reliability assessment method through nano-pattern fabrication. In the fabricated nano-pattern, the characteristics of FIB system are included. Using this effect, we tried to assess the FIB reliability. First, we suggested reliability assessment items and nano-patterns. And, to know the suitableness of the proposed method, we fabricated several nano-patterns using Nova200(FEI Company) and SMI2050(SEIKO) which are FIB apparatuses. The fabricated nano-patterns are measured with SEM (Scanning Electron Microscope) and compared with designed dimensions. And the compared results showed that the proposed method is suitable for the assessment of FIB system reliability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.699-702
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• 2004

Next generation lithography technologies, such as EBL(Electron Beam Lithography), X-ray lithography, SPL(Scanning Probe Lithography), have been studied widely for getting over line width limitation of photolithography. Among the next generation lithography technologies, SPL has been highlighted because of its high resolution advantage. But is also has problem which are slow processing time and sample size limitation. The purpose of this study is complement of present SPL system. Brand new SPL system was made. SPL test was performed with the system in ultra thin PMMA(polymethlymethacrylate) film.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.466-471
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• 2004

In focused-ion-beam (FIB) application of micromachining and device transplantation, four kinds of FIB processes, namely FIB sputtering, FIB-induced etching, redeposition, and FIB-induced deposition, are well utilized. As with FIB systems, scanning electron microscopes(SEMs) were extensively used in the semiconductor industry. They are the tools of choice for defect review and providing the image resolution needed for process monitoring. The enhanced capabilities of a dual-column on one chamber system are quickly becoming realized by the nano industry for performing a wide range of application.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.247-247
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• 2012

Plasmon subwavelength nanostructures enable the structurally modulated color due to the resonance conditions for the specific wavelength range of light with the nanoscale hole arrays on a metal layer. While the unique properties offered from a single layer of metal may open up the potential applications of integrated devices to displays and sensors, fabrication requirements in nanoscale, typically on the order of or smaller than the wavelength of light in a corresponding medium can limit the cost-effective implementation of the plasmonic nanostructures. Simpler nanoscale replication technologies based on the soft lithography or roll-to-roll nanoimprinting can introduce economically feasible manufacturing process for these devices. Such replication requires an optimal design of a master template to produce a stamp that can be applied for a roll-to-roll nanoimprinting. In this paper, a master mold with subwavelength nanostructures is fabricated and optimized using focused ion beam for the applications to nanoimprinting process. Au thin film layer is deposited by sputtering on a glass that serves as a dielectric substrate. Focused ion beam milling (FIB, JEOL JIB-4601F) is used to fabricate surface plasmon subwavelength nanostructures made of periodic hole arrays. The light spectrum of the fabricated nanostructures is characterized by using UV-Vis-NIR spectrophotometer (Agilent, Cary 5000) and the surface morphology is measured by using atomic force microscope (AFM, Park System XE-100) and scanning electron microscope (SEM, JEOL JSM-7100F). Relationship between the parameters of the hole arrays and the corresponding spectral characteristics and their potential applications are also discussed.

• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.24-29
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• 1995

The magnetic amd magneto-optical(MO)properties of Co-based multilayered(ML)films are known to vary sensitively according to the manufacturing methods and the film microstructures. Co/Pd and Co/Pt ML films with ultrathin layers of Co were prepared by alternating deposition in an ultrahigh-vacuum physical-vapor-deposition system. The individual layer thicknesses of the samples were estimated making use of the angular positions of x-ray diffraction peaks. The magnetic and MO properties were investigated, and correlated systematically to the structural parameters of the films. A Kerr spectrometer was self-manufactured to measure the MO properties such as Kerr rotation angle, ellipticity and reflectivity. The rms surface roughness was also measured using atomic force microscopy. Some of the samples showed good properties for MO medium, such as large perpendicular magnetic anisotropy and Kerr rotation, and perfect squareness of the magnetic hysteresis loop.

• Journal of the Korean Vacuum Society
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• v.18 no.5
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• pp.352-357
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• 2009

The InAs multi-quantum dots (MQDs) solar cell and InGaAs multi-quantum wells (MQWs) solar cell to cover 1.1 eV and 1.3 eV were designed by 1D poisson, respectively. The MQDs and MQWs of 5, 10, 15 layers were grown by molecular beam epitaxy. The photo luminescence results showed that the 5 period stacked MQDs have the highest intensity at around 1.1 eV with 57.6 meV full width at half maximum (FWHM). Also we can observe 10 period stacked MQWs peak position which has highest intensity at 1.31 eV with 12.37 meV FWHM. The density and size of QDs were observed by reflection high energy electron diffraction pattern and atomic force microscope. Futhermore, AlGaAs/GaAs sandwiched tunnel junctions were modified according to the width of GaAs layer on p-type GaAs substrates. The structures with GaAs width of 30 nm and 50 nm have backward diode characteristics. In contrast, tunnel diode characteristics were observed in the 20 nm of that of sample.

• Design & Manufacturing
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• v.16 no.1
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• pp.43-49
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• 2022

As technologies in various industrial fields develop, high-quality parts are required. In the past, precision parts were produced by the contact machining method, but the contact machining method has clear limitations. In order to solve this problem, research on a non-contact processing method has been conducted, and laser processing and electric discharge processing are representative. However, the non-contact method has a problem in that productivity is insufficient, and there is a problem that it takes a lot of time to continuously process microholes. Researchers have developed an electron beam drilling equipment for continuous processing of fine holes, and a vaporization amplification sheet to increase the processing efficiency of the equipment. In this study, a cylindrical vaporization amplification sheet using room temperature curing type silicon was fabricated, and the metal distribution and thickness uniformity of the produced sheet were analyzed. In order to manufacture a cylindrical vaporization amplification sheet, an equipment capable of using centrifugal force was developed, and a sample in which metal powder was evenly distributed and a constant thickness was produced.