• 제목/요약/키워드: Electroless nickel plating

검색결과 159건 처리시간 0.028초

무전해 도금을 이용한 금속 코팅된 탄소나노섬유의 제조 및 미세조직 (Fabrication and Microstructure of Metal-Coated Carbon Nanofibers using Electroless Plating)

  • 박기연;이상복;김진봉;이진우;이상관;한재흥
    • Composites Research
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    • 제20권5호
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    • pp.43-48
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    • 2007
  • 전자기파의 흡수와 간섭 문제는 상업적, 군사적 용도에서 중요한 문제로 다루어져 왔다. 스텔스 기술은 전자기파 흡수 기술의 가장 전형적인 적용 방법 중에 하나이다. 본 연구는 유전성 및 자성 손실을 함유한 복합성의 필러를 개발하고자 시작되었다. 전도성 나노 소재인 탄소나노섬유 (CNFs)에 자성을 부여하기 위해 두 가지의 니켈-인과 니켈-철을 무전해 도금을 적용하여 각각 코팅하는 실험에 성공하였다. 제작된 복합 소재의 미세 구조를 SEM/TEM을 통해 관찰하였고, 이들의 성분 분석(EDS/ELLS)을 수행하였다. 코팅 층의 평균 두께는 약 $50\;{\sim}\;100\;nm$의 결과를 나타내었으며, 코팅 층의 성분은 Ni-6wt%P와 Ni-70wt%Fe의 결과를 각각 나타내었다.

DMAB에 의한 P형 실리콘 기판 무전해 니켈-붕소 도금 (Electroless Nickel-Boron Plating on p-type Si Wafer by DMAB)

  • 김영기;박종환;이원해
    • 한국표면공학회지
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    • 제24권4호
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    • pp.206-214
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    • 1991
  • In the basic study of selective electroless Ni plating of Si wafers, plating rate and physical properties are investigated to obtain optimum conditions of contact hole filling. Si wafers are excellently activated in the concentration of 0.5M IF, 1mM PdCl2, 2mM EDTA at $70^{\circ}C$, 90sec. The optimum condition of Ni-B deposition on p-type Si wafers is 0.1M NiSO4, 0.11M Citrate, $70^{\circ}C$, pH6.8, 8mM DMAB. The main factor in the sheet resistences variation of films is amorphous and on heat treating matrix was transformed into a stable phase (Ni+Ni3B) at $300-400^{\circ}C$. But pH or DMAB concentration in the plating solution doesn't play role of heat-affected phase change.

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Improvement of Plating Characteristics Between Nickel and PEEK by Plasma Treatment and Chemical Etching

  • Lee, Hye W.;Lee, Jong K.;Park, Ki Y.
    • Corrosion Science and Technology
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    • 제8권1호
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    • pp.15-20
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    • 2009
  • Surface of PEEK(poly-ether-ether-ketone) was modified by chemical etching, plasma treatment and mechanical grinding to improve the plating adhesion. The plating characteristics of these samples were studied by the contact angle, plating thickness, gloss and adhesion. Chemical etching and plasma treatment increased wettability, adhesion and gloss. The contact angle of as-received PEEK was $61^{\circ}$. The contact angles of chemical etched, plasma treated or both were improved to the range of $15{\sim}33^{\circ}$. In the case of electroless plating, the thickest layer without blister was $1.6{\mu}m$. The adhesion strengths by chemical etching, plasma treatment or both chemical etching and plasma treatment were $75kgf/cm^2$, $102kgf/cm^2$, $113kgf/cm^2$, respectively, comparing to the $24kgf/cm^2$ of as-received. In the case of mechanically ground PEEKs, the adhesion strengths were higher than those unground, with the sacrifice of surface gloss. The gloss of untreated PEEK were greater than mechanically ground PEEKs. Plating thickness increased linearly with the plating times.

무전해 Ni-W-P 도금에서 착화제의 종류가 피막특성에 미치는 영향 (The Effect of Complexing Agents on the Deposit Characteristics in the Electroless Nickel-Tungsten-Phosphorus Plating)

  • 조진기;박상욱;강성군;손성호
    • 대한금속재료학회지
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    • 제46권11호
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    • pp.725-729
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    • 2008
  • Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.

니켈도금기술을 이용만 알칼리형 연료전지용 Ni-PTFE전극의 개발 (Preparation of Ni-PTFE Electrode using Nickel Plating for Alkaline Fuel Cell)

  • 김재호;이영석
    • 한국수소및신에너지학회논문집
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    • 제20권4호
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    • pp.291-299
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    • 2009
  • Ni-plated polytetrafluoroethylene(Ni-PTFE) particles($25{\mu}m$, $500{\mu}m$) were prepared by using nickel electroless plating. The Ni content in Ni-PTFE particles increased with increasing the amount of reduction agent. At about 53 wt% Ni content, $25{\mu}m$ Ni-PTFE particles showed conductivity of 320S/m. The Ni-PTFE particles were formed into the Ni-PTFE plate using heat treatment at $350^{\circ}C$ under $10{\sim}1000kg/cm^2$. The Ni-PTFE plate displayed the high conductivity of 5100S/m due to the formation of 3-dimentional Ni network. The plate was used as an electrode in an alkaline fuel cell(AFC). In terms of the current density, the Ni-PTFE electrode having higher Ni content(53 wt%) showed improved performance.

니켈이 코팅된 FBG 센서의 잔류 변형률 특성 (Residual Strain Characteristics of Nickel-coated FBG Sensors)

  • 조원재;황아름;김상우
    • 대한기계학회논문집A
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    • 제41권7호
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    • pp.613-620
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    • 2017
  • 금속이 코팅된 FBG(fiber Bragg grating) 센서는 구조물이 과거에 겪은 최대 변형률을 기억하는 기억효과(memory effect)를 가진다. 본 연구에서는 무전해 도금법과 전해 도금법을 이용하여 약 $43{\mu}m$의 두께를 가지는 니켈(nickel)이 코팅된 FBG 센서를 제작하였다. 니켈 코팅된 FBG 센서의 잔류 변형률 생성 성능, 즉, 기억효과를 검증하기 위해 반복하중 실험(잔류 변형률 생성실험)을 수행하였다. 인가한 최대 변형률의 크기가 증가함에 따라 잔류 변형률이 증가함을 확인함으로써 기억효과를 검증하였다. 본 연구에서 수행한 니켈이 코팅된 FBG 센서의 제작 기법과 센서에 대한 반복하중 실험결과는 향후 광섬유 센서를 이용한 구조물 건전성 감시(SHM, structural health monitoring)기법 개발에 기본 데이터로서 활용될 것이다.

Feasible waste liquid treatment from electroless nickel-plating by intense magnetic field of HTS bulk magnets

  • Oka, T.;Furusawa, M.;Sudo, K.;Dadiel, L.;Sakai, N.;Seki, H.;Miryala, M.;Murakami, M.;Nakano, T.;Ooizumi, M.;Yokoyama, K.;Tsujimura, M.
    • 한국초전도ㆍ저온공학회논문지
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    • 제23권3호
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    • pp.37-40
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    • 2021
  • Nickel (Ni) is a kind of the rare earth resources. Since Ni-containing waste is drained after several plating operations in the factories, the effective recycling technique has been expected to be introduced. An actual magnetic separation technique using HTS bulk magnet generating the strong magnetic field has succeeded in collecting the paramagnetic slurry containing Ni-sulphate coarse crystals which were fabricated from the Ni-plating waste. The Ni compound in the collected slurry was identified as NiSO4/6H2O, showing slight differences in the particle size and magnetic susceptibility between the samples attracted and not-attract to the magnetic pole. This preferential extraction suggests us a novel recycling method of Ni resource because the compound is capable of recycling back to the plating processes as a raw material.