• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1507-1510
• /
• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.2
• /
• pp.13-21
• /
• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.8 s.185
• /
• pp.171-177
• /
• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2013.05a
• /
• pp.137-137
• /
• 2013

본 연구에서는 반도체 검사 장비인 프로브 카드의 핵심 부품인 프로브 니들의 팁 부분의 내마모성을 향상시키기 위하여 무전해 Ni-B-W 합금 도금 실험을 실시하였다. 무전해 Ni-B-W 합금 도금 실험에서 여러 가지 제어인자 중 도금욕의 pH와 온도 그리고 환원제의 농도 등을 변수로 하였다. 도금욕 pH와 온도에 따른 전착속도 및 물성 변화를 관찰하였으며, 환원제 농도 변화에 의한 open circuit potential의 변화를 측정하였다.

• Proceedings of the Korean Magnestics Society Conference
• /
• 2008.12a
• /
• pp.163.2-163.2
• /
• 2008

• Journal of Surface Science and Engineering
• /
• v.44 no.6
• /
• pp.246-249
• /
• 2011

Surface modification before coating nickel by coupling agents and/or etchant of glass did not provide enough adhesive strength of electroless nickel deposits on glass. Effect of heat treatments on hardness as well as adhesion of nickel deposits was studied by using tape test for adhesion, nanoindenter for hardness and glancing angle x-ray diffractometer (GAXRD) for phase characterization. Heat treatment improved hardness as well as adhesion. XRD results give that the improvements of adhesion and hardness are due to the formation of $NiSiO_4$ around the interface between the nickel deposits and the glass and the precipitation of $Ni_3P$ causing precipitation hardening, respectively. The details in effects of heat treatment on adhesion and hardness are described here.

• Journal of the Optical Society of Korea
• /
• v.19 no.3
• /
• pp.217-221
• /
• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.05a
• /
• pp.154-154
• /
• 2015

현재 액체로켓 엔진 연소기 내벽은 bonding layer NiCrAlY과 Top layer $ZrO_2$가 플라즈마 용사 방식으로 형성 된다. 이는 뛰어난 열 차폐 특성과 작업시간이 짧은 장점이 있지만, bonding layer와 Top layer 사이의 열팽창 계수 차이로 인한 균열 발생 가능성이 내재 되어 있고, 연소실 내벽에 균일한 두께의 코팅층을 형성하기 어렵고 설비가 비싸다는 단점으로 인하여 세라믹 코팅 층을 금속 코팅 층으로 대체 하고자 한다. 금속 코팅층은 모재와의 밀착성이 높고, 우수한 산화 및 부식방지 기능을 가지며 저렴하다는 장점이 있다. 또한 코팅 후 연마 작업이 가능해 연소실 내부형상을 설계조건 대로 유지 할 수 있는 특징이 있다. 따라서 본 연구에서는 연소실 내벽에 적용할 모재, 무전해 Ni-P 도금과 전해 Cr 도금층 사이의 밀착력 향상을 위한 방법에 대한 연구를 하였다. 밀착력 향상을 위한 요소로 전처리 용액과 열처리 시간에 따른 영향을 알아보고자 하였으며, 이를 위해서 5가지의 산세 용액으로 각 시편을 산세 한 후, 6시간, 12시간, 18시간 열처리 하여 단면을 비교하여 열처리에 영향을 알아보고자 하였다. 연구 결과 산세 용액의 영향은 크게 나타나지 않았으며, 열처리 시간이 길수록 Ni-P/Cr의 확산이 더 잘 일어나 확산층이 더 넓어지면서 밀착력이 더 좋아 진 것으로 판단되어 진다.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.5 no.5
• /
• pp.433-437
• /
• 2004

The MmSH is a process of injecting ABS to produce innovated physical properties compared to the conventional injection process. Physical properties such as thickness and adhesion strength of Ni plate electrolessly coated on a conventional and a MmSH injected ABS have been studied in the pH range 4~8. Thickness of the plate on the MmSH and the conventionally injected ABS appeared to be directly proportional to pH. The ABS processed by the conventional injection showed adhesion strength corresponded to ASTM 4B above pH 5. On the other hand, the ABS processed by the MmSH injection showed a superior adhesion strength corresponded to ASTM 5B above pH 6. It was calculated the shielding effectiveness of above 50 dB in all conditions.

• Journal of environmental and Sanitary engineering
• /
• v.18 no.3 s.49
• /
• pp.35-42
• /
• 2003

The electric resistance and constant current were investigated on the nickel-thallium-phosphorus alloy deposits by electroless-plating. The Ni-Tl-P alloy deposits were achieved with a bath using sodium hypophosphit as the reducing agent and sodium citrate as the comlexing agent. The basic plating solution is composed of 0.1M NiSO$_4$, 0.005${\sim}$0.0IM Tl$_2$S0$_4$, 0.1${\sim}$O.2M sodium hypophosphite and 0.02${\sim}$O.IM sodium citrate and the plating condition were pH 5${\sim}$6, temperrature 80$_4$90${\circ}$C. The results obtained are summarized as follows: 1) The crystal structure of deposit was amorphous structure as deposited state, became microcrystallized centering on Ni(111) plane by heat treatment at 200${\circ}$C, and grew as polycrystalline Ni, Ni$_3$P, Ni$_5$p$_2$,Tl, etc. by heat treatment higher than 350${\circ}$C. The grain size of plated deposits was grown up to 28.3~42.0nm by heat treatment for 1hour at 500${\circ}$C. 2) The electrical resistivity showed a comparatively high value of 192.5$_4$208.3 ${\mu}$${\Omega}$Cm and its thermal stability was great with resistivity value less than 0.22% in the thermal surroundings of 200${\circ}$C. 3) Ni-Tl-P alloy deposit showed such good constant current-making-effect in the variation of electric voltage, heat treatment temperature, and the composition of the deposit that it can be put to practical use as the matter of constant current device.