• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.5
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• pp.193-198
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• 2015

In the study, electroless Ni-plating on flexible ethylene-propylene-diene-monomer (EPDM) rubber sheets for the application of an insert block for shielding electromagnetic interference of multi cable transit (MCT) systems was investigated. Ni crystallinity and adhesion have been found to vary with processing parameters such as pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity and optimum electric conductivity were obtained on EPDM rubber sheets under pH 7 and 8 at $60{\sim}70^{\circ}C$. The conductive Ni-plated EPDM rubber prepared at pH 7 at $70^{\circ}C$ showed the enhanced adhesion and electric conductivity, and the high electromagnetic interference shielding effect in the 400 MHz~1 GHz range.

• Composites Research
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• v.20 no.5
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• pp.43-48
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• 2007

The absorption and the interference shielding of electromagnetic wave have been very important issues for commercial and military purposes. The stealth technique is one of the most typical applications of electromagnetic wave absorption technology. This study has started for the development of composite fillers containing dielectric and magnetic lossy materials. To improve the electromagnetic characteristics of conductive nano fillers, carbon nanofibers (CNFs) with nickel-phosphorous (Ni-P) or nickel-iron (Ni-Fe) have been fabricated by the electroless plating process. Observations by the electron microscopy (SEM/TEM) and element analyzer (EDS/ELLS) showed the uniform Ni-P and Ni-Fe coated CNFs. The compositions of the plating layers were about Ni-6wt%P and Ni-70wt%Fe, respectively. The average thicknesses of the plating layers were about $50\;{\sim}\;100\;nm$.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.55-60
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• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.80-82
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.27-36
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• 2007

In this study, we investigated the interfacial reactions between various Sn-Ag-Cu(SAC) solder alloys and ENIG(Electroless Ni Immersion Gold) and Cu-OSP(Organic Solderability Preservative) pad finish. In the case of the interfacial reaction between Sb added SAC solder and ENlf thinner P-rich Ni layer was formed at the interface. In the case of the interfacial reaction between Ni added SAC solder and Cu-OSP, the uniform $Cu_6Sn_5$, intermetallic compounds(IMCs) were formed and $Cu_6Sn_5$ grain did not grow after multiple reflows. Thinner $Cu_3Sn$ IMCs were farmed at the interface between $Cu_6Sn_5$ and Cu-OSP after $150^{\circ}C$ thermal aging.

• Polymer(Korea)
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• v.37 no.4
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• pp.449-454
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• 2013

In this work, the effect of electroless Ni-plating of multi-walled carbon nanotubes (MWCNTs) on thermal conductivity and fracture toughness properties of MWCNTs/$Al_2O_3$/epoxy composites was investigated. The surface properties of the Ni-plated MWCNTs were determined by scanning electron microscopy (SEM), X-ray photoelectron spectrometry (XPS), and X-ray diffraction (XRD) analyses. Thermal conductivity was tested using a thermal conductivity measuring system. The fracture toughness of the composites was carried out through the critical stress intensity factor ($K_{IC}$) measurement. As a result, the electroless Ni-plated MWCNTs led to a significant change of surface characteristics of the MWCNTs. Thermal conductivity and fracture toughness of the MWCNTs/$Al_2O_3$/epoxy composites were greater than those of non-treated ones. These results were probably due to the improvement of intermolecular interaction between the Ni-MWCNTs and the matrix resins.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.853-863
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• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.41-46
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• 2005

A systematic investigation of shear testing was conducted to find a relationship between Ni-Sn intermetallic spatting and the brittle fracture observed in electroless Ni(P)/solder interconnection. Brittle fracture was found in the solder joints made of Sn-3.5Ag, while only ductile fracture was observed in a Cu-containing solder (Sn-3.0Ag-0.5Cu). For Sn-3.0Ag-0.5Cu joints, $(Ni,Cu)_3Sn_4$ and/or $(Cu,Ni)_6Sn_5$ compound were formed at the interface without spatting from the Ni(P) film. For Sn-3.5Ag, $Ni_3Sn_4$ compound was formed and brittle fracture occurred in solder pads where $Ni_3Sn_4$ had spalled. From the analysis of fractured surfaces, it was found that the brittle fracture occurs through the $Ni_3SnP$ layer formed between $Ni_3Sn_4$ intermetallic layer and the Ni(P) film. Since the $Ni_3SnP$ layer is getting thicker during/ after $Ni_3Sn_4$ spatting, suppression of $Ni_3Sn_4$ spatting is crucial to ensure the reliability of Ni(P)/solder system.

• Journal of the Korean institute of surface engineering
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• v.28 no.2
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• pp.83-91
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• 1995

A new method for preparation of thin nickel foam for Ni-MH battery was investigated. In this method, fine graphite powders of $1\mu\textrm{m}$～$2\mu\textrm{m}$ diameter were pasted into pores of thin polyurethane foam film in order to supply electric conducting seeds for nickel deposition by electroless plating reaction. After electroless plating, remaining polyurethane foam was removed chemically by organic solvent treatment and graphite particles also removed by ultrasonic cleaning. Porosity of formed nickel foam was about 85% During electroplating, porosity of the nickel foam decreased less than 5% up to $30\mu\textrm{m}$ coating thickness. And then it was electroplated and heat-treated to improve mechanical strength and ductility. Finally, thin nickel foam for Ni electrode of Ni-MH battery with 80% porosity and $350\mu\textrm{m}$～X$400\mu\textrm{m}$ thickness was obtained.

• Journal of the Korean institute of surface engineering
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• v.22 no.2
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• pp.101-108
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• 1989

Effects of Na+ ion on zeta potential of SiC and Al2O3 particles suspended in nikel sufate and nickel chloride solutions were investigated. various complexing agents for Ni2+ ion were added to electroless Ni composite bath and the effects of the complexing agents on zeta potential and codeposition of the particles from the baths were studied. It was confirmed that Na+ ion was absorbed on the particles bringing about the positive surface charge and thus they promoted the entrapment of the particles into the nickel deposit. On the basis of these results it was possible to deposit SiCc particle in nickel chloride electrolyte containing complex agent such as trisodium citrate+sodium succinate.