• 한국생산제조학회지
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• 제20권1호
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• pp.108-113
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• 2011

There are a lot of PDP TV for a plasma discharge pulse voltage generated by the use of electromagnetic waves. EMI mesh film is near Infrared ray caused by malfunction of the remote control intended to prevent this phenomenon. In this study, the formation of fine pattern by making the mold is imprinted on the film sheet. EMI mesh film has been granted by filling in the conductive material region imprinted with electroforming in the manufacture of resistance. The fine patterns fabricated with electroforming facility thickness of homogenization process technology were established to optimize the working conditions.

• 소성∙가공
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• 제14권2호
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• pp.121-125
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• 2005

Electroforming is a process that employs technology similar to that used for electroplating but which is used for manufacturing metallic articles, rather than as a means of producing surface coatings. Electroforming provides a cost-effective means of producing alloys and fully dense nanocrystalline metals as foils, sheets and complex shapes. Fe-Ni nanocrystalline alloy foils with composition in the $36\~80wt\%$ Ni range were fabricated by electroforming. The thickness of electroformed foils was in the range of $5\~30{\mu}m$. TEM and XRD analysis was applied for measuring the grain size. Very fine grain size$(\~10nm)$ was obtained in alloy foils. The yield and tensile strength of electroformed Fe-Ni alloy were 2000-2800 MPa and 2500-3300 MPa respectively. The magnetic permeability at high frequency of electroformed Fe-Ni foil was higher than that of thicker foils.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.276-279
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• 2004

The factors affecting Ni-Co alloy electroforming were investigated to determine the optimum bath composition and electroplating parameters, like pH, temperature, and current density, suitable for high speed fabrication of a micro mold with longer lifetime. To obtain alloy deposits having uniform thickness and composition, electroplating parameters were finely tuned with home-made electroforming apparatus. Ni-Co alloy deposits had linearly increased Co with $Co^{2+}$ ion concentration in electroplating bath, and showing $412H_v$ of Victors hardness at $23wt\%$ of Co content. For Ni-Co alloy, sulfonate and diol related organic additives were very effective to alleviate its residual stress and surface roughness. The maximum deposition rate was $106{\mu}m/hr$ at 10ASD and the tensile strength of alloy deposit was 2 times larger than that of Ni only case.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 춘계학술대회 논문집
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• pp.94-97
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• 2002

Micromolding methods are most suitable for mass production of plastic microlens and lens array with low cost. Among the procedures related with micromolding of microlens array, fabrication of mold insect which contains micro cavity of lens shape is the most important stage. In this study, nickel mold inserts for 45 $\mu\textrm{m}$ and 95 $\mu\textrm{m}$ diameters lens way were fabricated using electroforming process. The mother for metal mold inset was made using reflow method. A micro compression molding with polymer powders was used to test the qualities of the metal mold insets. Micro lens profile and surface roughness was measured by interferometric technique and AFM, respectively. The final molded lens replicated the mother well, and had good surface quality.

• 한국표면공학회지
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• 제37권1호
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• pp.22-27
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• 2004

Copper electroforming process has been applied to duplicate Koryo Tripitaka (Taejang'kyong), wooden printing block. Thin copper replica printing plates of 1 mm thickness was successfully manufactured from the printing face (54.5${\times}$25.5 cm) of wooden printing plate. Major processes are (1) silicon rubber replication of the master (2) silvering on silicon rubber (3) copper electroforming (4) separation of copper from the silicon mandrel (5) final coloring by brass plating and trimming. This process has various Potential applications in making thin metallic objects such as plaques, statues, bust and hollow metal objects for jewelry.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.449-453
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• 2005

Electrochemical systems find widespread technical application. Industrial electrolytic process include electroplating, electroforming, and electropolishing. Electroforming and electroplating is widely used in the manufacture of metal parts. This paper based on the basic equations of electrics and electrochemical kinetics, was employed for a theoretical explanation of the current density distribution on electroforming process. We calculated current density distribution and potential distribution on cathode. Also, calculated current density distribution of vertical direction. It was shown that current density is related with distance of between anode and cathode and mass transfer process. And make an experiment on its relation and electroformed thickness. It shows that it is useful method using FEM with multi-physics to estimate electroformed thickness.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.537-538
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• 2012

• 사물인터넷융복합논문지
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• 제9권3호
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• pp.61-67
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• 2023

구리의 전기주조 공정을 최적화하기 위하여 이중 비밀 다층구조의 역전파 뉴럴 네트워크가 구성된다. 샘플 학습을 통하여, 구리 전기주조 공정 조건과 목표 특성 간의 함수관계가 정확히 성취되고, 구리 전기주조 공정 내에서 다층구조의 미세강도와 장력에 대한 예측이 이루어진다. 예측된 결과는 펄스 전원공급기를 장착한 구리 피로인산염 솔루션 시스템 내에서 구리의 전해석출 시험에 의하여 증명된다. 그 결과는 다음과 같이 나타난다. "3-4-3-2" 구조의 이중비밀 다층구조 뉴럴 네트워크에 의하여 예측된 구리 다층구조의 미세강도와 장력은 실험값에 매우 근접하며 그 상대적 오차는 2.32%보다 작다. 주어진 파라미터의 범위 내에서, 구리의 미세강도는 100.3~205.6MPa이며, 장력은 112~485MPa 정도로 측정된다. 미세강도와 장력이 최적인 조건에서 그에 대응하는 공정 조건은 다음과 같다: 전류밀도는 2A·dm-2, 펄스 주파수는 2KHz, 펄스의 듀티싸이클은 10%이다.

• 대한치과보철학회지
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• 제45권3호
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• pp.303-309
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• 2007

Statement of problem. The effect of gold electroforming on gold alloy was not studied. Purpose. This in vitro study investigate the effect of gold electroforming on gold-silver-palladium alloy. Material and methods. Three pieces of gold strips had undergone the electroforming procedures on one side and then half of the side again electroformed. The set mode for this study was program 1 ($200{\mu}m$). And the processing time was 15min (1/20 time to form $200{\mu}m$ coping). The confocal laser scanning microscope (PASCAL 5, Carl Zeiss, Bernried, Germany) was used to measure the thickness of the pure gold layer electroformed on the gold strips. Half of the gold strip was coated two times with electroformed gold, and the other half one time. The data from the cone focal laser system was processed to get the vertical profile of the strips and the difference of the vertical height between the double coated and single coated layer was regarded as the thickness of the gold coating. The layer thickness value to built 3D image of the cone-focal laser was set $0.5{\mu}m$. Next to the measurement of the thickness of the coating, the Vicker's hardness test was done. It was performed on the double coated surface, single coated surface and non-coated surface (back side) three times each. Results. The mean thickness value gained from gold electroforming technique was measured to be $22{\mu}m$ for sample 1, $23{\mu}m$ for sample 2, $21{\mu}m$ for sample 3. In the same condition of time, power and the amount of electrolyte, the data showed no difference between samples. According to the results of variance analysis, the differences among the variations in number of coating were statistically insignificant (p>0.05), meaning that the two times of gold electroforming coating did not change the hardness of gold-silver-palladium alloy. Conclusion. The test of thickness of gold coating proved the coherency of the gold electroforming procedure, in other words, when the power, the exposed surface area, processing time and the amount of electrolytes were set same, the same thickness of gold would be coated on. The hardness test showed that the electroformed gold coating did not change the hardness of the gold-silver-palladium alloy when it is coated not more than $45{\mu}m$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.211-212
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• 2009