• Title/Summary/Keyword: Electrode shape

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Fused Deposition Modeling 3D Printing-based Flexible Bending Sensor (FDM 3D프린팅 기반 유연굽힘센서)

  • Lee, Sun Kon;Oh, Young Chan;Kim, Joo Hyung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.1
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    • pp.63-71
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    • 2020
  • Recently, to improve convenience, flexible electronics are quickly being developed for a number of application areas. Flexible electronic devices comprise characters such as being bendable, stretchable, foldable, and wearable. Effectively manufacturing flexible electronic devices requires high efficiency, low costs, and simple processes for manufacturing technology. Through this study, we enabled the rapid production of multifunctional flexible bending sensors using a simple, low-cost Fused Deposition Modeling (FDM) 3D printer. Furthermore, we demonstrated the possibility of the rapid production of a range of functional flexible bending sensors using a simple, low-cost FDM 3D printer. Accurate and reproducible functional materials made by FDM 3D printers are an effective tool for the fabrication of flexible sensor electronic devices. The 3D-printed flexible bending sensor consisted of polyurethane and a conductive filament. Two patterns of electrodes (straight and Hilbert curve) for the 3D printing flexible sensor were fabricated and analyzed for the characteristics of bending displacement. The experimental results showed that the straight curve electrode sensor sensing ability was superior to the Hilbert curve electrode sensor, and the electrical conductivity of the Hilbert curve electrode sensor is better than the straight curve electrode sensor. The results of this study will be very useful for the fabrication of various 3D-printed flexible sensor devices with multiple degrees of freedom that are not limited by size and shape.

Electroplating process for the chip component external electrode

  • Lee, Jun-Ho
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2000.11a
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    • pp.1-2
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    • 2000
  • In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

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A Study on the Optimal Generation Conditions of Micro-Droplet in Electrostatic Spray Indirect Charging Method (정전 분무 간접 하전 방식에서 미세액적 최적 발생 조건에 관한 연구)

  • Jihee Lee;Sunghwan Kim;Haiyoung Jung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.1
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    • pp.79-87
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    • 2024
  • This paper is a study on the optimal microdroplet generation conditions in indirect charging electrostatic spraying. Unlike the direct charging method, which applies power to the nozzle, the indirect charging method applies power to the discharge electrode between the nozzle and the collection electrode. Therefore, an electrically simplified system can be obtained by minimizing the insulation part a stable spray pattern can be obtained with a wide spray angle, and a stable spray pattern can be obtained with a wide spray angle. To conduct the study, an indirect charging type electrostatic spray visualization system was constructed and the static characteristics of the microdroplets were analyzed through image processing of the spray shape of the microdroplets. The total number of microdroplets and the number of microdroplets per power consumption are confirmed according to the changes in the distance between the discharge electrode and the collection electrode, the flow rate, and the applied voltage, which affect the generation of microdroplets, and using this, the optimal generation conditions are derived and the corresponding microdroplet size distribution was analyzed. As a result of the experiment, it was confirmed that the optimal generation condition was at a flow rate of 15 to 20 mL/min and a voltage of -22.5 to -25 kV in terms of the number of microdroplets, and at a flow rate of 15 to 20 mL/min and a voltage of -20 kV in terms of energy consumption efficiency.

NOVEL SURFACE PROFILER SYTSTEM FOR INSPECTION OF FLAT PANEL DISPLAY

  • Kimura, Munehiro;Akahane, Tadashi;Iwata, Tetsuya
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.325-327
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    • 2004
  • Novel surface profiler system for inspection of the display components is demonstrated In the case of the liquid crystal display, for example, not only the flatness of the alignment film but also the quality of rubbing can be inspected. Furthermore, the shape of the component such as the color filter, electrode and mirror can be inspected without removing each component.

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TECHNOLOGIES FOR REDUCING POWER CONSUMPTION OF PDPS IN PIONEER

  • Uchidoi, Masataka
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.159-163
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    • 2004
  • We have introduced fourth generation PDPs last year. The performance of these PDPs is the highest level among TV displays. At the same time the power consumption of them has reached to the lowest level among FPDs (Flat Panel Displays). High panel luminous efficacy and low address power are necessary for the reduction of total power consumption. Following technologies have been developed and applied to the fourth generation PDPs. High panel luminous efficacy: T-shape electrode, waffle rib structure, high Xe content gas Low address power; CLEAR driving method, etc.

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A study on the weldability of galvannealed steel in spot welding process (Galvannealed Steel의 点溶接의 溶接性에 관한 硏究)

  • 류병길;강춘식
    • Journal of Welding and Joining
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    • v.5 no.1
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    • pp.64-72
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    • 1987
  • The Weldability of gavannealed steel using spot welder has been studied. The Results obtained are a follows; 1) Welds size and strength were increased depending on the welding time and welding current. But, the increasing rate has been decreased. 2) Deposited zinc has affected on the wear of welding tips and growth of welds but has not affected the weld's structures. 3) On shear testing of the specimen, button fracture has been observed and the value was approximately 540Kg (welds dia. approximately .phi.4mm)

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Development of Micro-EDM Machine for Microshaft and Microhole Machining (미소 축.구멍 가공용 미세 방전 가공기의 개발)

  • 김규만;김보현;주종남
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.1075-1079
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    • 1995
  • It is difficult to machine microparts, such as microshaft and microholes, by conventional machining. Such micropart can be easily machined by EDM because it's machining force is very low. In micro-EDM, the precise electrode movement and discharge energy control are important. Therefore, high precision motion stage and EDM device with high performance is necessary. In this research, a new EDM machine was developed and microshaft and microhole, with various shape and size, was machined.

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3-dimensional shape of $TiO_2$-nanobranch electrode using Dye-sensitized Solar Cells (3차원 형태의 $TiO_2$-nanobranch 전극을 이용한 염료감응형 태양전지)

  • Oh, Jae-Kyung;Lee, Jin-Kyu;Kim, Hyun-Su;Park, Kyung-Won
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.06a
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    • pp.150-152
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    • 2009
  • 본 연구는 염료감응형 태양전지에 적용되는 TiO2 나노입자를 개선하여 3차원적인 nanobranch를 수열법으로 합성하여 전자의 이동을 향상시키며, 비표면적을 늘려 효율향상을 위하여 전극 구조를 제어하였다. nanobranch의 seed인 nanowire를 XRDd, FE-TEM과 solar simulator를 이용하여 비교 분석하였다.

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Micro Groove Machining for Electrochemical Micro-Machining (전기화학 가공을 이용한 마이크로 홈 가공)

  • 김영민;이은상
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1844-1847
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    • 2003
  • Electrochemical micro-machining(EMM) is used to achieve a desired workpiece surface by dissolving the metal workpiece with an electrochemical reaction. This machining method can be applied to metal that is difficult to machining using other methods. The workpiece dissolves when it is positioned close to the tool electrode in electrolyte and current is applied. This aim of this work is to develop electrochemical micro-machining(EMM) technique for micro groove shape by establishing appropriate electrochemical parameters of machining

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C-V Characteristics of Porous Silicon Alcohol Sensors with the Semi-transparent Electrode (반투명 전극으로 된 다공질 실리콘 알코올 가스 센서의 C-V 특성)

  • 김성진;이상훈
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.1085-1088
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    • 2003
  • In this work, we fabricated a gas-sensing device based on porous silicon(PS), and its I-V and C-V properties were investigated for sensing alcohol vapor. The structure of the sensor consists of thin Au/Oxidized porous silicon/porous silicon/Silicon/Al, where the silicon substrate is etched anisotropically to be prepared into a membrane shape. As the result, I-V curves showed typical tunneling property, and C-V curves were shaped like those of a MIS (metal-insulator- semiconductor) capacitor, where the capacitance in accumulation was increased with alcohol vapor concentration.

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