• Journal of Powder Materials
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• v.17 no.3
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• pp.216-222
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• 2010

Self-standing $TiO_2$ nanotube arrays were fabricated by potentiostatic anodic oxidation method using pure Ti foil as a working electrode and ethylene glycol solution as electrolytes with small addition of $NH_4F$ and $H_2O$. The influences of anodization temperature and time on the morphology and formation of $TiO_2$ nanotube arrays were investigated. The fabricated $TiO_2$ nanotube arrays were applied as a photoelectrode to dye-sensitized solar cells. Regardless of anodizing temperature and time, the average diameter and wall thickness of $TiO_2$ nanotube show a similar value, whereas the thickness show a different trend with reaction temperature. The thickness of $TiO_2$ nanotube arrays anodized at $20^{\circ}C$ and $30^{\circ}C$ was time-dependent, but on the other hand its at $10^{\circ}C$ are independent of anodization time. The conversion efficiency is low, which is due to a morphology breaking of the $TiO_2$ nanotube arrays in manufacturing process of photoelectrode.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.55-60
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• 2007

The codeposition behavior of submicron sized diamond with nickel from nickel electrolytes has been investigated. Electroplating of diamond dispersed nickel composites was carried out on a rotating disk electrode (RDE). The effects of current type and current density on the electrodeposited Ni-diamond composite coating were investigated. The effects of surfactants on the composite coating were also investigated. The hardness of coating was measured with varying electroplating conditions using Micro Vickers. As diamond was incorporated into the coating, the hardness of coating as well as the wear resistance was improved. The hardness of the coating was increased as much as 100% and the wear resistance was improved as much as 27%. The hardness of composite coating layer increased slightly at the diamond content of above 20 gpl.

• Journal of the Korea Institute of Military Science and Technology
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• v.6 no.3
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• pp.54-61
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• 2003

$SnO_2$ gas sensor for the detection DMMP, simulant of nerve gas was fabricated and its characteristics were examined. Sensing materials were $SnO_2$ added by TEX>$\alpha$-$Al_{2}O_{3}$ with 0∼20wt.% and $In_{2}O_{3}$ with 0∼3wt.% and were physically mixed each material. They were deposited by screen printing method on alumina substrate. The sensor was consisted of sensing electrode with interdigit(IDT) type in front and a heater in back side. Its dimension was 7$\times$10$\times$0.6$\textrm{mm}^2$. Crystallite size 8t phase identification, specific surface area and morphology of fabricated $SnO_2$ powders were analyzed by X-ray diffraction(XRD), surface area analyzer(BET) and by a scanning electron microscope(SEM), respectively. Sensor was measured as flow type and sensor resistance change was monitored as real time using LabVIEW program. The best sensitivities were 75% at adding 4wt.% TEX>$\alpha$-$Al_{2}O_{3}$, operating temperature $300^{\circ}C$ and 87% at adding 2wt.% $In_{2}O_{3}$, operating temperature $350^{\circ}C$ to DMMP 0.5ppm. Response and recovery times were about 1 and 3 min., respectively. Repetition measurement was very good with $\pm$3% in full scale. As a result, operating temperature was lower TEX>$\alpha$-$Al_{2}O_{3}$ than $In_{2}O_{3}$, but sensitivity was higher $In_{2}O_{3}$ than $\alpha$-$Al_{2}O_{3}$.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2518-2520
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• 1998

Silicon can be reactive ion etched (RIE) either isotropically or anisotropically. In this paper, a new micromachining technology combining these two etching characteristics is proposed. In the proposed method, the fabrication steps are as follows. First. a polysilicon layer, which is used as the bottom electrode, is deposited on the silicon wafer and patterned. Then the silicon substrate is etched anisotropically to a few micrometer depth that forms a cavity. Then an PECVD oxide layer is deposited to passivate the cavity side walls. The oxide layers at the top and bottom faces are removed while the passivation layers of the side walls are left. Then the substrate is etched again but in an isotropic etch condition to form a round trench with a larger radius than the anisotropic cavity. Then a sacrificial PECVD oxide layer is deposited and patterned. Then a polysilicon structural layer is deposited and patterned. This polysilicon layer forms a pivot structure of a rocker-arm. Finally, oxide sacrificial layers are etched away. This new micromachining technology is quite simpler than conventional method to fabricate joint structures, and the devices that are fabricated using this technology do not require a flexing structure for motion.

• Journal of IKEEE
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• v.19 no.4
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• pp.535-540
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• 2015

A microstrip gas chamber (MSGC), applied to digital radiography system, was designed and constructed. The microstrip electrodes were fabricated with Chrome(Cr.). by photolithography process on Silicon(Si) wafer and glass substrate. The width of anode and cathode electrodes was $10{\mu}m$, and $290{\mu}m$, respectively. The distance of the electrodes was $100{\mu}m$, and the active area was $50{\times}50mm^2$. And the number of anode was 80. The microstrip electrodes were damaged when discharges occurred over the 600 V of anode voltage. As the result of experiments. It detected the typical output signals of the pulse width, 20 ns, under the condition that the detecting gas was Ar(90%) + $CH_4$(10%), X-ray tube voltage was 42 kV, and tube current was 1 mA.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.56.1-56.1
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• 2009

The intermediate operating temperature of solid oxide fuel cells (IT-SOFCs) have achieved considerable importance in the area of power fabrication. This is because to improve materials compatibility, their long-term stability and cost saving potential. However, to conserve rational cell performance at reduced-temperature regime, cathode performance should be obtained without negotiating the internal resistance and the electrode kinetics of the cell. Recently, double perovskite structure cathodes have been studied with great attention as a potential material for IT-SOFCs. In this study, double-perovskite structured cathodes of $GdBaCoCuO_{5+\delta}$, $GdBaCo_{2/3}Cu_{2/3}Fe_{2/3}O_{5+\delta}$ compositions and $(1-x)GdBaCo_2O_{5+\delta}+xCe_{0.9}Gd_{0.1}O_{1.95}$ (x = 10, 20, 30 and 40 wt.%) composites were evaluated as the cathode for intermediate temperature solid oxide fuel cells(IT-SOFCs). Electrical conductivity of the cathodes were measured by DC 4-probe method, and the thermal expansion coefficient of each sample was measured up to $900^{\circ}C$ by a dilatometer study. Area specific resistances(ASR) of the $GdBaCo_{2/3}Cu_{2/3}Fe_{2/3}O_{5+\delta}$ cathode and 70 wt.% $GdBaCo_2O5+\delta$ + 30wt.% Ce0.9Gd0.1O1.95 composite cathode on CGO electrolyte substrate were analyzed using AC 3-probe impedance study. The obtained results demonstrate that double perovskite-based compositions are promising cathode materials for IT-SOFCs.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.63-68
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• 1999

We have fabricated $WO_3$ thick film gas sensor under various firing conditions in order to study gas sensing properties in terms of the variation of microstructure and non-stoichiometric structure of gas sensing layer. $WO_3$ paste mixed homogeneously with organic vehicle was coated by screen printing method on alumina substrate composed of Au electrode and $RuO_2$heater on each side. To change filing condition, sensing materials were fared at 600-$800^{\circ}C$ for 1 hour and refired at $700^{\circ}C$ for 1 hour in the mixtures of $_Ar/O2$gas. In the result of heat-treatment, $WO_3$ gas sensor fared at $700^{\circ}C$ showed best gas sensing properties of 210 gas sensitivity and 2 second response time and the best firing environment was 40-50% of $Ar/O_2$gas.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.4
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• pp.468-480
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• 1993

In this paper, at first, the characteristics of double mode SAW (DMS) resonator are analysed by applying the wave guide model and coupled mode theory to 1-port resonator. The DMS resonators (2-pole), which are arranged in a close, parallel configuration of two identical 1-port resonators on a single plate, and 4-pole DMS filters are designed and fabricated at the center frequency of 150.15 MHz with 3-dB bandwidth of 80 KHz. The empirical design characteristics are obtained from the comparison of experimental and theoretical values resulted from several fabrications, and the narrow bandpass filters are implemented on the basis of the above empirical results, which can be used to mobile communication systems. A ST-cut quartz substrate is selected for the stable temperature-frequence characteristics, and high resolution photolithography is applied to the fabrication of filter to get the fine electrode patterns.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.30-37
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• 1996

Previously, crystallization of a-Si:H films on glass substrates were limited to anneal temperature below 600.deg. C, over 10 hours to avoid glass shrinkage. Our study indicates that the crystallization is strongly influenced by anneal temperature and weakly affected by anneal duration time. Because of the high temperature process and nonconducting substrate requirements for poly-Si TFTs, the employed substrates were limited to quartz, sapphire, and oxidized Si wafer. We report on poly-Si TFT's using high temperature anneal on a Si:H/Mo structures. The metal Mo substrate was stable enough to allow 1000.deg. C anneal. A novel TFT fabrication was achieved by using part of the Mo substrate as drain and source ohmic contact electrode. The as-grown a-Si:H TFT was compared to anneal treated poly-Si TFT'S. Defect induced trap states of TFT's were examined using the thermally stimulated current (TSC) method. In some case, the poly-Si grain boundaries were passivated by hydrogen. A-SI:H and poly-Si TFT characteristics were investigated using an inverted staggered type TFT. The poly -Si films were achieved by various anneal techniques; isothermal, RTA, and excimer laser anneal. The TFT on as grown a-Si:H exhibited a low field effect mobility, transconductance, and high gate threshold voltage. Some films were annealed at temperatures from 200 to >$1000^{\circ}C$ The TFT on poly-Si showed an improved $I_on$$I_off$ ratio of $10_6$, reduced gate threshold voltage, and increased field effect mobility by three orders. Inverter operation was examined to verify logic circuit application using the poly Si TFTs.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1938-1940
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• 2003

본 연구는 요소 센서 제작을 위한 과정으로서, 전기화학적 방법을 이용한 다공질 실리콘 구조 형성과, PDV(Physical Vapor Deposition) 법에 의한 백금 박막 코팅 및 전기화학적 전도성 고분자 코팅과 urease 고정화 단계를 고찰하고 감도 특성을 제시 하였다. 전극 기질로서 B을 도우핑한 p-type 실리콘웨이퍼를 사용하였고, HF:$C_2H_5OH:H_2O$=1:2:1의 부피비를 갖는 에칭 용액에서 5분간 -7 $mA/cm^2$의 일정 전류를 가하여 폭 2 ${\mu}m$, 깊이 10 ${\mu}m$의 다공질 실리콘(PS) 충을 형성하였다. 그 위에 200 ${\AA}$의 Ti 층을 underlayer로서 증착하고, 2000 ${\AA}$의 Pt를 중착하여 PS/Pt 박막 전극을 제작하고, 전도성 고분자로서 polypyrrole (PPy), 또는 poly(3-mehylthiophene) (P3MT)을 전기화학적으로 코팅한 후, urease(EC 3.5.1.5, type III, Jack Bean, Sigma)를 고정화 하였다. 고정화 시 전해질 수용액의 pH는 7.4로 하여 urease표면이 음전하를 갖도록 하고, 전극에 0.6 V (vs. SCE(Saturated Calomel Electrode))의 일정 전압을 가함으로써 urease가 전도성 고분자 표면에 전기적으로 흡착되도록 하였다. 이상의 방법으로 제작한 요소 센서의 감도는 PPy와 P3MT를 전자 전달 매질로 사용한 경우, 각각 8.44 ${\mu}A/mM{\cdot}cm^2$와 1.55 ${\mu}A/mM{\cdot}cm^2$의 감도를 보였다.