• 제목/요약/키워드: Electrode Fabrication Condition

검색결과 73건 처리시간 0.033초

Uniformity Improvement of Micromirror Array for Reliable Working Performance as an Optical Modulator in the Maskless Photolithography System

  • Lee, Kook-Nyung;Kim, Yong-Kweon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제1권2호
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    • pp.132-139
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    • 2001
  • We considered the uniformity of fabricated micromirror arrays by characterizing the fabrication process and calculating the appropriate driving voltages of micromirrors used as virtual photomask in maskless photolithography. The uniformity of the micromirror array in terms of driving voltage and optical characteristics is adversely affected by factors, such as the air gap between the bottom electrode and the mirror plate, the spring shape and the deformation of the mirror plate or torsion spring. The thickness deviation of the photoresist sacrificial layer, the misalignment between mirror plate and bottom electrode, the aluminum deposition condition used to produce the spring and the mirror plate, and initial mirror deflection were identified as key factors. Their importance lies in the fact that they are related to air gap deviations under the mirror plate, asymmetric driving voltages in left and right mirror directions, and the deformation of the Al sring or mirror plate after removal of the sacrificial layer. The plasma ashing conditions used for removing the sacrificial layer also contributed to the deformation of the mirror plate and spring. Driving voltages were calculated for the pixel operation of the micromirror array, and the non-uniform characteristics of fabricated micromirrors were taken into consideration to improve driving performance reliability.

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은 나노 와이어 전극의 대면적 전사를 위한 롤 투 롤 공정 (Roll-to-roll process for large-area transfer of Ag nanowire electrode)

  • 박양규;김재필;김완호;정강;정호중
    • 한국표면공학회지
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    • 제55권3호
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    • pp.173-179
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    • 2022
  • This study presents a roll-to-roll process which is capable of Ag nanowire (AgNW) transfer from polyethylene terephthalate (PET) film to polycarbonate (PC) film. We developed a roll-to-roll machine that consists of two film suppliers, a coater of photo-curable resin, a film laminator, an ultraviolet (UV) exposure unit, and a film winder to facilitate large-area electrode transfer between different flexible substates. Using the process, optimal fabrication condition was investigated by parametric experiments in terms of the UV exposure time, number of thermal cycling, and exposure time of high temperature and humidity. A fabricated AgNW on PC film showed sheet resistance of 52 Ω/sq and optical transmittance of approximately 80 % over a range of visible light.

Template 방법을 이용한 Hybrid Supercapacitor 전극용 알루미늄 분말 디스크 제조와 에칭 조건 연구 (Fabrication of Aluminum Powder Disk by a Template Method and Its Etching Condition for an Electrode of Hybrid Supercapacitor)

  • 진창수;이용성;신경희;김종휘;윤수길
    • 전기화학회지
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    • 제6권2호
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    • pp.145-152
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    • 2003
  • 전해 캐패시터와 supercapacitor의 특성을 함께 가지는 하이브리드 캐패시터의 용량은 표면이 산화물로 피복된 양극에 의해서 좌우된다 본 연구에서는 고전압 하이브리드 슈퍼캐패시터의 제조를 위해 양극의 용량 최적화를 수행하였다. $40{\mu}m$의 입자경을 갖는 알루미늄 분말과 NaCl분말을 4:1의 무게비로 혼합하여 디스크 형태의 전극을 만들고 열처리를 하였다. 열처리 후 $50^{\circ}C$의 증류수에서 NaCl을 용해시켜 열처리 온도에 따른 용량과 저항을 비교하였다. 최적의 열처리 과정을 거친 후 electropolishing 및 화학처리, 1차 및 2차 에칭을 단계별로 행하였고 각각의 단계에서 최적의 조건을 조사하였다 각각의 단계에서의 용량과 저항은 ac impedance analyzer를 사용하여 측정하였으며 전극의 표면은 SEM을 이용하여 관찰하였다. 2차 에칭 후 내전압이 300V급인 전극으로 만들기 위하여 365V로 양극산화 시켰으며, 산화된 알루미늄 디스크 전극을 사용하여 단위 셀을 제조하여 주파수에 따른 용량과 저항 특성을 기존의 300V급 알루미늄 전해 캐패시터와 비교하였다.

Effect of Kinetically Processing Conditions on Ink Transfer Ratio for Transfer Printing

  • Park, Sung-Ryool;Kim, Se-Min;Ryu, Gi-Seong;Lee, Chang-Bin;Song, Chung-Kun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.910-913
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    • 2009
  • This paper examines attaching speed, detaching speed and contact time which affected in the ink transfer ratio and presents the best conditions for fabrication process of electrodes with Ag-ink using microcontact printing method. In conclusion, it shows the best printing characteristic by two conditions. One of condition is the attaching speed have to within less than 1mm/s and the detaching speed is high velocity as 1000mm/s and the contact time is taken about the minimum time when inking process. Another condition is the attaching speed have to within more than 100mm/s and the detaching speed have to within less than 1mm/s and the contact time is longer than 30second when the printing process. As using these condition and the stamp sized 5cm${\times}$5cm, it was possible for printing equally until $30{\mu}m$ of width. The printed thickness of a electrode was about 300 to 500 nm, the surface roughness was about dozens nm under 50 nm.

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Research on the Multi-electrode Plasma Discharge for the Large Area PECVD Processing

  • Lee, Yun-Seong;You, Dae-Ho;Seol, You-Bin
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.478-478
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    • 2012
  • Recently, there are many researches in order to increase the deposition rate (D/R) and improve film uniformity and quality in the deposition of microcrystalline silicon thin film. These two factors are the most important issues in the fabrication of the thin film solar cell, and for the purpose of that, several process conditions, including the large area electrode (more than 1.1 X 1.3 (m2)), higher pressure (1 ~ 10 (Torr)), and very high frequency regime (VHF, 40 ~ 100 (MHz)), have been needed. But, in the case of large-area capacitively coupled discharges (CCP) driven at frequencies higher than the usual RF (13.56 (MHz)) frequency, the standing wave and skin effects should be the critical problems for obtaining the good plasma uniformity, and the ion damage on the thin film layer due to the high voltage between the substrate and the bulk plasma might cause the defects which degrade the film quality. In this study, we will propose the new concept of the large-area multi-electrode (a new multi-electrode concept for the large-area plasma source), which consists of a series of electrodes and grounds arranged by turns. The experimental results with this new electrode showed the processing performances of high D/R (1 ~ 2 (nm/sec)), controllable crystallinity (~70% and controllable), and good uniformity (less than 10%) at the conditions of the relatively high frequency of 40 MHz in the large-area electrode of 280 X 540 mm2. And, we also observed the SEM images of the deposited thin film at the conditions of peeling, normal microcrystalline, and powder formation, and discussed the mechanisms of the crystal formation and voids generation in the film in order to try the enhancement of the film quality compared to the cases of normal VHF capacitive discharges. Also, we will discuss the relation between the processing parameters (including gap length between electrode and substrate, operating pressure) and the processing results (D/R and crystallinity) with the process condition map for ${\mu}c$-Si:H formation at a fixed input power and gas flow rate. Finally, we will discuss the potential of the multi-electrode of the 3.5G-class large-area plasma processing (650 X 550 (mm2) to the possibility of the expansion of the new electrode concept to 8G class large-area plasma processing and the additional issues in order to improve the process efficiency.

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압전층의 2단 증착법을 이용한 체적 음향파 박막형 공진기의 제작과 성능향상에 관한 연구 (A Study of the Fabrication and Enhancement of Film Bulk Acoustic Wave Resonator using Two-Step Deposition Method of Piezoelectric Layer)

  • 박성현;추순남;이능헌
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제54권7호
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    • pp.308-314
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    • 2005
  • The 2 GHz film bulk acoustic wave resonator(FBAR), one of the most necessary device of the next generation mobile communication system, consisted of solidly mounted resonator(SMR) structure using Brags reflector, was researched in this paper The FBAR applied SiO$_{2}$ and W had large difference of the acoustic impedance to reflector Al to electrode and ZnO to piezoelectric layer. Specially, the FBAR applied the two-step deposition method to improve the c-axis orientation and increase reproducibility of the fabrication device had good performance. The electrical properties of plasma such as impedance, resistance, reactance, $V_{pp},\;I{pp}$, VSWR and phase difference of voltage and current, was analyzed and measured by RF sensor with the variable experiment process factors such as gas ratio, RF power and base vacuum level about concerning the thickness, c-axis orientation, adhesion and roughness. The FBAR device about the optimum condition resulted reflection loss(S$_{11}$) of -17 dB, resonance frequency of 1.93 GHz, electric-mechanical coefficient(k$_{eff}$) of 2.38 $\%$ and Qualify factor of 580. It was seen better qualify than the common dielectric filter at present and expected on business to the filter device of 2 GHz bandwidth with the MMIC technology.

PLD를 이용한 강유전체(PZT, PST, PT)/YBCO 박막 구조의 제작과 전기적인 특성에 관한 연구 (Electrical Properties and Fabrication of Ferroelectric (PZT)

  • 김정환;이재형;문병무
    • 한국전기전자재료학회논문지
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    • 제11권7호
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    • pp.541-545
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    • 1998
  • (PZT, PST, PT)/ YBCO structured have been grown on single crystal $LaAlO_3$ using in-situ Nb:YAG pulsed laser deposition technique. The optimum conditions of fabrication for high quality films have been established under various oxygen pressure. TBCO was used as a metallic electrode for polarizing ferroelectric thin fillms. Lattice mismatch of these materials were found to be with in 3%. As a result XRD patterns and rocking curves, (PZT, PST, PT)/ YBCO multiayered thin films on $LaAlO_3$ substrates showed preferred orientation to c-axis. For invastigation on electrical properties of ferroelectric thin films, remanent polaiztion $P_r$ and coercive field $E_c$ were measured for three samples. At each optimum condition, they showed the values of P_r=60 \mu C/cm^2 and E_c=240kV/ cm for PT, 30\mu C/cm^2 and 105kV/cm for PZT, 1.5\mu C/cm^2$ and 15kV/cm for PST. Frequency dependence of dielectric properties of ferroelectric thin fillms was also investigated. As a result, it showed the frequency dependence was relatively small in the range of 10Hz~10kHz.

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폴리피롤 막으로 변성시킨 유리질 탄소 및 백금 전극에서 Cr(Ⅵ) 이온의 정량 (Determination of Cr(Ⅵ) by Glassy Carbon and Platinum Electrodes Modified With Polypyrrole Film)

  • 유광식;우상범;정지영
    • 대한화학회지
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    • 제43권4호
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    • pp.407-411
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    • 1999
  • 본 연구에서는 유리질 탄소전극과 백금 전극의 표면에 폴리피롤 막을 도포 시킨 PPy/GC 및 PPy/Pt 변성전극을 제조하고, 이들 변성 전극들을 작업전극으로 구성한 3-전극 장치를 이용하여 Cr(VI)의 정량분석을 시도하였다. 변성전극들은 +1.0V∼-1.0V를 50 mV/sec로 전위를 걸어주어 순환 전압 전류법으로 쉽게 제조할 수 있었으며, 26회 반복 주사함으로써 연구에 필요한 막의 두께를 조절하였다. PPy/GC 변성전극에서 Cr(VI)의 환원 반응은 +0.6V∼-0.5V(vs. Ag/AgCl)까지 넓은 범위에서 환원되는 경향을 보였으며,-0.25V(vs.Ag/AgCl)의 전위에서 최대 환원 봉우리를 가짐을 알 수 있었다. 이 전위에서 검량곡선을 조사한 결과, 0.1 ppm에서 60.0 ppm의 농도범위에서 기울기가 1.75 mA/ppm이고, 상관계수가 0.998인 좋은 직선관계를 가졌다. PPy/Pt 변성전극에서도 Cr(VI)의 환원 거동은 PPy/GC 변성전극과 유사하였으며, 검량곡선은 1.0 ppm∼60.0ppm의 농도범위에서 직선관계를 가졌다. 이때의 기울기와 상관계수는 각각 0.5 mA/ppm 및 0.923이었다. 그러나 선택성은 PPy/GC 변성전극이 약 3 배정도 우수하였다. PPy/GC 변성전극에서 Cu(II), As(III), pb(II) 및 Cd(II)등은 환원 경향을 보이지 않았으므로, Cr(VI)의 정량분석에는 방해하지 않았다.

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H:LiNbO$_{3}$ 광변조기에서 Parylene 버퍼층의 유용성 (Utilities of Parylene buffer layer in H:LiNbO$_{3}$ optical modulator)

  • 허현;반재경
    • 전자공학회논문지D
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    • 제34D권8호
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    • pp.80-86
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    • 1997
  • H:LiNbO$_{3}$ optical modulator buffered by parylene layer, which has a merits in the bandwidth, power consumption and fabrication as compared with conventional SiO$_{2}$ buffered optical modulator, is proposed and analyzed. The dependences of velocity matching condition, charcteristics impedance, and driving voltage on dielectric constants, thickness of buffer layer, and electrode configurations are demonstrated with finite element calculation. And we performed the physical and chemical test of parylene buffer layer deposited on LiNbO$_{3}$ and under Au electrodes.

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Effusion Cell 방식에 의한 <111> 결정구조의 Au 박막의 제작 (Au Thin Film Fabrication of <111> Crystal Structure by Effusion Cell Process)

  • 표경수;김강대;김용규;송정근
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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    • pp.383-386
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    • 2004
  • The one of important requisites for fabricating molecular electronic device is the single crystal direction of bottom substrate nowadays. [1,2]. We obtain the optimum SAM result when the Au crystal is <111> structure for Self-Assembled molecular. To get the <111> crystal Au, we generally repeat heating and cooling course after evaporating Au [3]. However, we can fabricate <111> crystal Av thin film except post treatment because we simultaneously evaporate and anneal using Effusion Cell. In this paper, we study on thin film growth of <111> crystal Au as bottom electrode which is essential for Self-Assembled molecular by Effusion Cell and analyze crystal structure, thickness, surface conductivity and so on as each process condition.

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