• Title/Summary/Keyword: Electro-chemical process

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Effect of Sulfurization on CIGS Thin Films by RF Magnetron Sputtering Using a Cu(In1-xGax)Se2 Single Target

  • Jung, Sung Hee;Chung, Chee Won
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.675-675
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    • 2013
  • CIGS thin films have received a great attention as a promising material for solar cells due to their high absorption coefficient, appropriate bandgap, long-term stability, and low cost production. CIGS thin films have been deposited by various methods such as co-evaporation, sputtering, spray pyrolysis and electro-deposition. In this study, Cu(In,Ga)Se2(CIGS) thin films were prepared using a single quaternary target by rf magnetron sputtering. The effect of sulfurization on the structural, compositional and electrical properties of the films was examined in order to develop the deposition process. An optimal sulfurization process will be selected for the preparation of CIGS thin films with good structural, optical and electrical properties by applying various sulfurization processes. In addition, the electrical properties of CIGS thin films were investigated by post-deposition annealing process. The carrier concentration of CIG(SSe) thin films after sulfurization was increased from $10^{14}cm^{-3}$ to $10^{16}cm^{-3}$ and the resistivity was increased from 10 ${\Omega}cm$ to $10^3$ ${\Omega}cm$. It is confirmed that CIG(SSe) thin films prepared at optimal deposition condition have similar atomic ratio to the target value after sulfurization.

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Review of Micro Electro-Chemical Machining (미세 전해가공 기술 동향)

  • Shin, HongShik
    • Journal of Institute of Convergence Technology
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    • v.2 no.2
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    • pp.25-29
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    • 2012
  • Micro machining technologies have been required to satisfy various conditions in a high-technology industry. Micro electrochemical process is one of the most precision machining methods. Micro electrochemical process has been divided into electrochemical etching through protective layer and electrochemical machining using ultrashort voltage pulses. Micro shaft can be fabricated by electrochemical etching. The various protective layers such as photo-resist, oxide layer and oxidized recast layer have been used to protect metal surface during electrochemical etching. Micro patterning on metal surface can be machined by electrochemical etching through protective layer. Micro hole, groove and structures can be easily machined by electrochemical machining using ultrashort voltage pulses. Recently, the groove with subnanometer was machined using AFM.

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Experiment on Cutting the SUS and Zircaloy Tubes by Cutter Blade (Cutter blade에 의한 SUS 및 지르칼로이 튜브 절단 실험)

  • 정재후;윤지섭;홍동희;김영환;박기용
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.651-654
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    • 2001
  • In the dismantling process of nuclear spent fuels, the spent fuel rod cutting process, followed immediately by the decladding process, performs the cutting the spent fuel rods to a proper length for fast decladding operation. In this paper, we analyzed the chemical compositions, mechanical properties, and physical characteristics for SUS and zircaloy tubes in order to identify the feasibility of cutter-blade type in cutting SUS and zircaloy tubes. It is considered that material, shape and angle, and heat treatment for fabricating the highly durable cutter blade and also it is investigated that the round-shape sustenance of cross-section, amount of debris production, and fire occurrence for measuring the cutting performance on SUS and zircaloy tubes, spent fuel rod cutting device is designed to be operated automatically through the remote control system for use in Hot Cell(radioactive) area and the electro-driven mechanical parts are modularized for easy maintenance. Results from various experiments confirm the efficiency of this device.

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Recycling of chelating agents after extraction of heavy metals contaminated in soil

  • Jung, Oh-Jin
    • Environmental Sciences Bulletin of The Korean Environmental Sciences Society
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    • v.10 no.S_3
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    • pp.139-148
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    • 2001
  • Heavy metals such as Cu, Ni, Cd, and Pb were chemically extract from the contaminated soils using the chelating agents, EDTA and DTPA. These chemical extraction have been focused on its applicability to a wide range of soils. Results of extractive efficiency for heavy metal follow the order : Cu-EDTA $\geq$ Ni-EDTA > Pb-EDTA > Cd-EDTA > Cu-DTPA> Pb-DTPA. This result is coincided with order of conditional formation constants(Kr) of metal-chelate agent. The second study involved the recovery of the metals and EDTA from complex solutions by an electromembrane process. The overall processes of regeneration, recovery, and reuse were evaluated. The electrochemical studies showed that copper could be chosen as an electrode to plate Cd, Cu, and Pb. At least 95% of 75 of EDTA and associated Cu or Pb could be recovered by the electromembrane process. Recovery of Cd by electodeposition was not possible with the copper electrode. The percent EDTA recovery is equal to the percentage of metal electroplated from the chelates.

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Improvement of Geometric Accuracy using Powder Mixed Electro-chemical Discharge Machining Process (전해액 내 혼합된 미세 전도성 입자를 이용한 전해 방전 가공의 형상 정밀도 향상)

  • Han M.S.;Min B.K.;Lee S.J.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.366-369
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    • 2005
  • Electrochemical discharge machining (ECDM) has been found to be potential fur the micro-machining of non-conductive materials such as ceramics or glass. However this machining process has its own inherent problem that the reproducibility is too low to get the available geometric accuracy fur micromachining applications. One main challenge in reaching this goal is the control of the hydrogen built around the tool-electrode in which happen the discharges. This paper proposes the methods to improve the geometric accuracy using powder-mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy by averaging and decreasing the concentration of spark energy.

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Studies on Enhanced Oxidation of Estrone and Its Voltammetric Determination at Carbon Paste Electrode in the Presence of Cetyltrimethylammonium Bromide

  • Yang, Chunhai;Xie, Pingping
    • Bulletin of the Korean Chemical Society
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    • v.28 no.10
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    • pp.1729-1734
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    • 2007
  • The electrochemical behaviors of estrone in the presence of various surfactants were examined with great details. It is found that a cationic surfactant, cetyltrimethylammonium bromide (CTAB), obviously facilitates the electro-oxidation of estrone at carbon paste electrode (CPE) from the significant peak current enhancement and the negative shift of peak potential. Additionally, chronocoulometry and electrochemical impedance spectroscopy (EIS) were also used for further investigation of the electrode process of estrone, indicating that low concentration of CTAB exhibits excellent enhancement effects on the electrochemical oxidation of estrone, greatly enhances the diffusion coefficient and the electron transfer rate. Based on this, an electrochemical method was proposed for the determination of estrone. The oxidation peak current is proportional to the concentration of estrone in the ranges over 9.0 × 10?8 - 8.0 × 10?6 mol/L, and a low detection limit of 4.0 × 10?8 mol/L was obtained for 180s accumulation at open circuit (S/N = 3). Finally, this proposed method was demonstrated using estrone tablets with good satisfaction.

Measurement of Cohesion Force between Diamond and Matrix in CMP Pad Conditioner

  • Kang, Seung-Koo;Song, Min-Seok;Jee, Won-Ho
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1128-1129
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    • 2006
  • Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond cohesion. Strong cohesion between diamond and metal matrix prevents macro scratch on the wafer during CMP Process. Typically the diamond tool has been manufactured by sintered, brazed and electro-plated methods. In this paper, some results will be reported of cohesion between diamond and metal matrix of the diamond tools prepared by three different manufacturing methods. The cohesion force of brazed diamond tool is found stronger than the others. This cohesion force is increased in reverse proportion to the contact area of diamond and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of Cr in metal matrix and C in diamond, which enhance the interfacial cohesion strength between diamonds and metal matrix.

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Two-step polyimide curing technique for flexible plastic liquid crystal devices

  • Kim, Ki-Seo;Kim, Hyun-Jin;Kim, Min-Jeong;Kim, Hyun-Gi;Choi, Suk-Won;Kim, Sung-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.883-885
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    • 2009
  • We proposed intriguing and simple technique for fabricating flexible plastic liquid crystal (LC) devices. We made a preliminary version of a flexible LC display employing this concept, and we confirmed this technique was useful for the flexible LC display; the electro-optical reproducibility of the flexible LC device fabricated here was remarkably improved against external perturbation compared with the conventional one.

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Planarization technology of thick copper film structure for power supply (전력 소자용 후막 구리 구조물의 평탄화)

  • Joo, Suk-Bae;Jeong, Suk-Hoon;Lee, Hyun-Seop;Kim, Hyoung-Jae;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.523-524
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    • 2007
  • This paper discusses the planarization process of thick copper film structure used for power supply device. Chemical mechanical polishing(CMP) has been used to remove a metal film and obtain a surface planarization which is essential for the semiconductor devices. For the thick metal removal, however, the long process time and other problems such as dishing, delamination and metal layer peeling are being issued, Compared to the traditional CMP process, Electro-chemical mechanical planarization(ECMP) is suggested to solve these problems. The two-step process composed of the ECMP and the conventional CMP is used for this experiment. The first step is the removal of several tens ${\mu}m$ of bulk copper on patterned wafer with ECMP process. The second step is the removal of residual copper layer aimed at a surface planarization. For more objective comparison, the traditional CMP was also performed. As an experimental result, total process time and process defects are extremely reduced by the two-step process.

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Development of templated RuO2 nanorod and nanosheet electrodes to improve the electrocatalytic activities for chlorine evolution (전기적 염소 발생 촉매활성을 위한 성형된 루테늄 산화물 나노로드와 나노시트 전극의 개발)

  • Luu, Tran Le;Kim, Choonsoo;Yoon, Jeyong
    • Journal of Korean Society of Water and Wastewater
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    • v.31 no.5
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    • pp.373-381
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    • 2017
  • $RuO_2$ is a common active component of Dimensionally Stable Anodes (DSAs) for chlorine evolution that can be used in wastewater treatment systems. The recent improvement of chlorine evolution using nanostructures of $RuO_2$ electrodes to increase the treatment efficiency and reduce the energy consumption of this process has received much attention. In this study, $RuO_2$ nanorod and nanosheet electrodes were simply fabricated using the sol-gel method with organic surfactants as the templates. The obtained $RuO_2$ nanorod and nanosheet electrodes exhibit enhanced electrocatalytic activities for chlorine evolution possibly due to the active surface areas, especially the outer active surface areas, which are attributed to the increase in mass transfers compared with a conventional nanograin electrode. The electrocatalytic activities for chlorine evolution were increased up to 20 % in the case of the nanorod electrode and 35% in the case of the nanosheet electrode compared with the nanograin electrode. The $RuO_2$ nanorod 80 nm in length and 20-30 nm in width and the $RuO_2$ nanosheet 40-60 nm in length and 40 nm in width are formed on the surface of Ti substrates. These results support that the templated $RuO_2$ nanorod and nanosheet electrodes are promising anode materials for chlorine evolution in future applications.