• Title/Summary/Keyword: Electro-chemical process

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A study on reduction of excess sludge in activated sludge system from a petrochemical plant using electro fenton process (전기펜톤공정을 이용한 석유화학공장 폐활성슬러지의 감량화 가능성 평가)

  • Chung, Chong Min;Kim, Kyung Il;Shim, Natalia;Park, Chul Hee;Lee, Sang Hyup
    • Journal of Korean Society of Water and Wastewater
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    • v.23 no.5
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    • pp.669-678
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    • 2009
  • The reduction of excess activated sludge from petrochemical plant was investigated by the electro fenton (E-Fenton) process using electrogenerated hydroxyl radicals which lead to mineralization of activated sludge to $CO_2$, water and inorganic ions. Factors affecting the disintegration efficiency of excess activated sludge in E-Fenton process were examined in terms of five criteria: pH, $H_2O_2/Fe^{2+}$ molar ratio, current density, initial MLSS (mixed liquid suspended solids) concentration, $H_2O_2$ feeding mode. TSS total suspended solid and $TCOD_{cr}$ reduction rate increased with the increasing $H_2O_2/Fe^{2+}$ molar ratio and current density until 42 and $6.7 mA/cm^2$, respectively but further increase of $H_2O_2/Fe^{2+}$ molar ratio and current density would reduce the reduction rate. On the other hand, as expected, increasing pH and initial MLSS concentration of activated sludge decreas TSS and $TCOD_{cr}$ reduction rate. The E-Fenton process was gradually increased during first 30 minutes and then linearly proceed till 120 minutes. The optimal E-Fenton condition showed TSS reduction rate of 62~63% and $TCOD_{cr}$ (total chemical oxygen demand) reduction rate of 55~56%. Molar ratio $H_2O_2/Fe^{2+} = 42$ was determined as optimal E-Fenton condition with initial $Fe^{2+}$ dose of 5.4 mM and current density of $6.7{\sim}13.3 mA/cm^2$, initial MLSS of 7,600 mg/L and pH 2 were chosen as the most efficient E-Fenton condition.

Effect of Inorganic Coagulants on the Performance of Electro-Chemical Treatment Process Treating Hospital Wastewater (병원폐수의 전기화학적 처리시 무기응집제 주입 효과에 관한 연구)

  • Jeong, Seung-Hyun;Jeong, Byung-Gon
    • Journal of Korean Society of Environmental Engineers
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    • v.33 no.10
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    • pp.709-716
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    • 2011
  • Effect of inorganic coagulants dosing on the performance of electro-chemical process was studied when treating hospital wastewater having low electrolyte concentration. It is thought that adding inorganic coagulants caused increase in concentration of electrolyte and this caused increase in free chloride concentration and consequently, caused increase in indirect oxidation effect. Thus, COD removal efficiencies more than doubled in percentage terms at the 2 hrs of reaction time and current density of $1.76A/dm^2$ compared with the results obtained from the parallel experiments without adding inorganic coagulants. T-N removal efficiencies approximately doubled in percentage terms at the 2 hrs of reaction time and 700 ppm of coagulants addition and applied current density of $1.76A/dm^2$ due to the increase of free residual chlorine such as HOCl caused by increase of electrolyte concentration through the addition of inorganic coagulants. Under the same experimental condition, more than 90% of T-P removal efficiencies was obtained. The reason can be explained that increase of chemical adsorption rate between phosphate and insoluble metal compounds caused by dissolved oxygen generated from anode by the increased electrolyte concentration through inorganic coagulants addition make a major role in improving T-P removal efficiencies. It can be concluded that inorganic coagulants addition as the supplemental agent of electrolyte is effective way in improving organic and nutrient salt removal efficiency when treating hospital wastewater having low electrolyte concentration.

Screening of spherical phosphors by electrophoretic deposition for full-color field emission display application

  • Kwon, Seung-Ho;Cho, sung-Hee;Yoo, Jae-Soo;Lee, Jong-Duk
    • Journal of Korean Vacuum Science & Technology
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    • v.3 no.1
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    • pp.79-84
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    • 1999
  • the photolithographic patterning on an indium-tin oxide (ITO) glass and the electro-phoretic deposition were combined for preparing the screen of the full-color field emission display(FED). the patterns with a pixel of 400$\mu\textrm{m}$ on the ITO-glass were made by etching the ITO with well-prepared etchant consisting of HCL, H2O, and HNO3. Electrophoretic method was carried out in order to deposit each spherical red (R), green(G), and blue (B) phosphor on the patterned ITO-glass. The process parameters such as bias voltage, salt concentration, and deposition time were optimized to achieve clear boundaries. It was found that the etching process of ITO combined with electrophoretic method was cost-effective, provided distinct pattern, and even reduced process steps compared with conventional processes. The application of reverse bias to the dormant electrodes while depositing the phosphors on the stripe pattern was found to be very critical for preventing the cross-contamination of each phosphor in a pixel.

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Effect of Pressure on Edge Delamination in Chemical Mechanical Polishing of SU-8 Film on Silicon Wafer

  • Park, Sunjoon;Im, Seokyeon;Lee, Hyunseop
    • Tribology and Lubricants
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    • v.33 no.6
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    • pp.282-287
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    • 2017
  • SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

Measurement of Glass Sintering Degree by Electro-chemical Method (전기 화학적 방법을 이용한 소결도의 측정)

  • 차재민;김웅식;이병철;류봉기
    • Journal of the Korean Ceramic Society
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    • v.40 no.6
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    • pp.553-559
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    • 2003
  • PDP rib is one of the important parts of manufacturing process and the sintering degree of rib plays an important role to prevent some problems such as cross talk. Nowadays, the screen-printing method, which is a low price and high production, is used to make a rib. However, it is hard to judge and value the sintering ratio of sintered body itself. In this study, we measured the sintering degree by the dielectric breakdown of pores with the potentiostat. We conformed that this has similar tendency to density of sintered samples and an error being expected by open and closed pores was inspected by change of the microstructure to scanning electron microscope. This result showed that the sintering degree of PDP rib could be analyzed into the electro-chemical method.

Influence of Steel-making Process and Heat-treatment Temperature on the Fatigue and Fracture Properties of Pressure Vessel Steels (제강 및 열처리 조건이 압력용기강의 피로 및 파괴특성에 미치는 영향)

  • Koh, S.K.;Na, E.G.;Baek, T.H.;Park, S.J.;Won, S.Y.;Lee, S.W.
    • Proceedings of the KSME Conference
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    • 2001.11a
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    • pp.87-92
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    • 2001
  • In this paper, high strength pressure vessel steels having the same chemical compositions were manufactured by the two different steel-making processes, such as vacuum degassing(VD) and electro-slag remelting(ESR) methods. After the steel-making process, they were normalized at $955^{\circ}C$, quenched at $843^{\circ}C$, and finally tempered at $550^{\circ}C$ or $450^{\circ}C$, resulting in tempered martensitic microstructures with different yielding strengths depending on the tempering conditions. Low-cycle fatigue(LCF) tests, fatigue crack growth rate(FCGR) tests, and fracture toughness tests were performed to investigate the fatigue and fracture behaviors of the pressure vessel steels. In contrast to very similar monotonic, LCF, and FCGR behaviors between VD and ESR steels, a quite difference was noticed in the fracture toughness. Fracture toughness of ESR steel was higher than that of VD steel, being attributed to the removal of impurities in steel-making process.

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Ultra-Drawing of Gel Films of Ultra High Molecular Weight Polyethylene/Low Molecular Weight Polymer Blends Containing $BaTiO_3$ Nanoparticles

  • Park Ho-Sik;Lee Jong-Hoon;Seo Soo-Jung;Lee Young-Kwan;Oh Yong-Soo;Jung Hyun-Chul;Nam Jae-Do
    • Macromolecular Research
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    • v.14 no.4
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    • pp.430-437
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    • 2006
  • The ultra-drawing process of an ultra high molecular weight polyethylene (UHMWPE) gel film was examined by incorporating linear low-density polyethylene (LLDPE) and $BaTiO_3$ nanoparticles. The effects of LLDPE and the draw ratios on the morphological development and mechanical properties of the nanocomposite membrane systems were investigated. By incorporating $BaTiO_3$ nanoparticles in the UHMWPE/LLDPE blend systems, the ultra-drawing process provided a highly extended, fibril structure of UHMWPE chains to form highly porous, composite membranes with well-dispersed nanoparticles. The ultra-drawing process of UHMWPE/LLDPE dry-gel films desirably dispersed the highly loaded $BaTiO_3$ nanoparticles in the porous membrane, which could be used to form multi-layered structures for electronic applications in various embedded, printed circuit board (PCB) systems.

A Review on Transfer Process of Two-dimensional Materials

  • Kim, Chan;Yoon, Min-Ah;Jang, Bongkyun;Kim, Jae-Hyun;Kim, Kwang-Seop
    • Tribology and Lubricants
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    • v.36 no.1
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    • pp.1-10
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    • 2020
  • Large-area two-dimensional (2D) materials synthesized by chemical vapor deposition on donor substrates are promising functional materials for conductors, semiconductors, and insulators in flexible and transparent devices. In most cases, 2D materials should be transferred from a donor substrate to a target substrate; however, 2D materials are prone to damage during the transfer process. The damages to 2D materials during transfer are caused by contamination, tearing, and chemical doping. For the commercialization of 2D materials, a damage-free, large-area, and productive transfer process is needed. However, a transfer process that meets all three requirements has yet to be developed. In this paper, we review the recent progress in the development of transfer processes for 2D materials, and discuss the principles, advantages, and limitations of each process. The future prospects of transfer processes are also discussed. To simplify the discussion, the transfer processes are classified into four categories: wet transfer, dry transfer, mechanical transfer, and electro-chemical transfer. Finally, the "roll-to-roll" and "roll-to-plate" dry transfer process is proposed as the most promising method for the commercialization of 2D materials. Moreover, for successful dry transfer of 2D materials, it is necessary to clearly understand the adhesion properties, viscoelastic behaviors, and mechanical deformation of the transfer film used as a medium in the transfer process.

Fabrication of Micro-fluidic Channels using a Flexible and Rapid Surface Micro-machining Technique (유연하고 신속한 표면미세가공기술을 이용한 Micro-fluidic Channel 제작)

  • 김진산;성인하;김대은
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.4
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    • pp.97-101
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    • 2002
  • Recently, the need for transporting and manipulating minute amount of fluids in microscale channels (so-called micro-fluidics) has been increasing, especially in biotechnology and biochemical processing. This work demonstrates that the so-called mechano-chemical process which consists of mechanical abrasive action combined with chemical process can be used to f뮤ricate micro-fluidic channels more rapidly and cost effectively than other methods. In this work, capillary filling of fluids in micro-channels was investigated by theoretical approaches and experiments. From the experimental results, it is expected that a complex micro-fluidic system can be fabricated using the micro-fabrication technique and microsystem packaging method described in this work.

The Synthesis of Diamond/WC-Co Thin Film by HE-CVD (HE-CVD법에 의한 Diamond/WC-Co 박막합성)

  • Lee, Kee-Sun;Seo, Sung-Man;Shin, Dong-Uk;Kim, Dong-Sun
    • Proceedings of the Korean Institute of Resources Recycling Conference
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    • 2003.10a
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    • pp.185-189
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    • 2003
  • The effect of surface roughness of the substrate on HF-CVD diamond coating was researched. The surface roughness was changed variously by electro-chemical etching conditions. The etching process acted to remove the metallic cobalt from the WC-Co. Diamond nucleation density was higher in etched the substrate. Therefore, the etching process was effective in both Co-removal and higher surface roughness, leading to the improving the diamond nucleation and deposition.

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