• 한국표면공학회지
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• 제47권3호
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• pp.128-136
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• 2014

In the present study, we successfully developed an eco-friendly chemical etching solution and proper condition for plating on ABS material. The mechanism of forming Ni plating layer on ABS substrate is known as following. In general, the etching solution used for the etching process is a solution of chromic acid and sulfuric acid. The etching solution is given to the surface resulting in elution of butadiene group, so-called anchor effect. Such a rough surface can easily adsorb catalyst resulting in the increase of adhesion between ABS substrate and Ni plating layer. However a use of chromic acid is harmful to environment. It is, therefore, essential to develop a new alternative solution. In the present study, we proposed an eco-friendly etching solution composed of potassium permanganate, sulfuric acid and phosphoric acid. This solution was testified to observe the surface microstructure and the pore size of electrical Ni plating layer, and the adhesive correlation between deposited layers fabricated by electro Ni plating was confirmed. The result of the present study, the newly developed, eco-friendly etching solution, which is a mixture of potassium permanganate 25 g/L, sulfuric acid 650ml/L and phosphoric acid 250ml/L, has a similar etching effect and adhesion property, compared with the commercially used chromium acid solution in the condition at $70^{\circ}C$ for 5 min.

• Corrosion Science and Technology
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• 제14권5호
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• pp.213-217
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• 2015

Recently, household electronic industries require environmentally-friendly and highly functional steels in order to enhance the quality of human life. Customers especially require both excellent corrosion and abrasion resistant anti-fingerprint steels for digital TV panels. Thus POSCO has developed new functional electro-galvanized steels, which have double coated layers with organic-inorganic composites on the zinc surface of the steel for usage as the bottom chassis panel of TVs. The inorganic solution for the bottom layer consists of inorganic phosphate, magnesium, and zirconium compounds with a small amount of epoxy binder, and affords both improved adhesion properties by chemical conversion reactions and corrosion resistance due to a self-healing effect. The composite solution for the top layer was prepared by fine dispersion of organic-inorganic ingredients that consist of a urethane modified polyacrylate polymer, hardener, silica sol and a titanium complex inhibitor in aqueous media. Both composite solutions were coated on the steel surface by using a roll coater and then cured through an induction furnace in the electro-galvanizing line. New anti-fingerprint steel was evaluated for quality performance through such procedures as the salt spray test for corrosion resistance, tribological test for abrasion resistance, and conductivity test for surface electric conductance regarding to both types of polymer resin and coating weight of composite solution. New composite coated anti-fingerprint steels afford both better corrosion resistance and abrasion properties compared to conventional anti-fingerprint steel that mainly consists of acrylate polymers. Detailed discussions of both composite solutions and experimental results suggest that urethane modifications of acrylate polymers of composite solutions play a key role in enhanced quality performances.

• 한국진공학회지
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• 제8권4A호
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• pp.425-431
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• 1999

$Pb(Zr_{0.52}, Ti_{0.48})O_3$ (PZT) thick films as an actuating material with conducting oxides, $(La_{0.5}Sr_{0.5}) CoO_3$ (LSCO), have been fabricated by sol-gel method for Optical Micro-Electro-Mechanical System (MEMS) devices, in which PZT/LSCO/SiO2 structures were used. In order to improve the adhesion to LSCO solution in order to enhance the wetting behavior of a water-based LSCO precursor solution and further to improve the adhesion between LSCO and $SiO_2$ layers. PZT films were made using 1-3 propanediol based precursor solution which has a high viscosity and a boiling point appropriate for thick film fabrication. In the precursor solution, Ti-propoxied and Zr-propoxied are partially substituted with acetylacetone to achieve the solution stability while maintaining reactivity. Crack free PZT films (0.8~1$\mu\textrm{m}$) have been successfully fabricated at crystallization temperatures above $700^{\circ}C$. Dielectric constants and dielectric losses of the PZT films were 900~1200and 2~5%, respectively. Piezoelectric constant $d_{33}$ of the PZT films constrained by a substrate were 200pm/V at 100kV/cm.

• Macromolecular Research
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• 제15권5호
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• pp.424-429
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• 2007

A procedure for the surface hydrolysis of an electrospun poly(${\epsilon}$-caprolactone) (PCL) fibrous scaffold was developed to enhance the adhesion and proliferation of osteoblasts. The surface hydrolysis of fibrous scaffolds was performed using NaOH treatment for the formation of carboxyl groups on the fiber surfaces. The hydrolysis process did not induce deformation of the fibers, and the fibers retained their diameter. The cell seeding density on the NaOH-treated PCL fibrous scaffolds was more pronounced than on the non-treated PCL fibers used as a control. The alkaline phosphatase activity, osteocalcin and a mineralization assay strongly supported that the surface-hydrolyzed PCL fibrous scaffolds provided more favorable environments for the proliferation and functions of osteoblasts compared to the non-treated PCL fibrous scaffolds use as a control.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.444-445
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• 2009

The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

• 접착 및 계면
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• 제9권3호
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• pp.20-26
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• 2008

형상기억합금(SMA)의 구조는 부가된 온도 혹은 응력에 의해 마텐자이트로부터 오스테나이트로의 변화가 가능하다는 것은 잘 알려져 있다. 형상기억합금섬유의 자체 형상회복력으로 인해 응력과 온도가 적용되는 동안에 응력이나 경화 모니터링 센서 또는 작동기로서 사용되었다. 초탄성 현상은 연속적인 기계적 하중 하에서나 온도변화 중에 응력-변형률 곡선에서 확인되었다. 반복하중 실험을 통해 응력-변형률 곡선에서 나타난 초탄성 현상 구간이 나타나는 응력 이력현상이 발생함을 확인하였다. 이것은 형상기억합금섬유 혹은 에폭시에 함침된 형상기억합금섬유 복합재료가 반복하중으로 계면물성 저하로 인한 형상기억 회복 성능의 저하를 의미한다. 강성도가 큰 에폭시 사용과 형상기억합금섬유의 표면처리 이후 형상기억합금섬유와 에폭시 사이의 계면결합력의 증대에도 불구하고 유사한 불완전한 초탄성을 보여 주었다. 단-형상기억합금섬유/에폭시 복합재료 내부에 남은 잔류 열과 이에 따른 잔류 응력으로 인해 에폭시에 함침된 단-형상기억합금섬유에서는 경화과정에서 불완전한 회복을 나타났다.

• 접착 및 계면
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• 제9권1호
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• pp.3-8
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• 2008

두 형상비가 다른 탄소나노섬유(CNF) 에폭시 복합재료의 자체 감지능과 계면특성을 전기-미세역학적 시험법을 이용하여 조사하였다. CNF/에폭시 복합재료의 부피 저항은 CNF 부피분율이 증가될수록 전기적 접촉의 증가로 인해 감소하였다. CNF/에폭시 복합재료의 분산도는 부피저항의 변동계수(COV) 값을 계산하여 간접적으로 평가하였다. 형상비가 큰 A타입에서는 B타입에 비해 좋은 자체 감지능을 확인하였으며, 형상비가 작은 B타입에서는 부피분율 2% 이상에서는 자체 감지능을 거의 보여주지 못하였다. 이것은 두 타입의 분산정도와 형상비의 차이에 의한 결과를 나타내었다. 형상비가 작은 B타입의 겉보기 강성도는 배양을 하면서 큰 표면적을 가지기 때문에 A타입보다 크게 나타났다. 열역학적 접착일은 겉보기 강성도와 상호 일치하는 결과를 보여주었다.

• 접착 및 계면
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• 제10권4호
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• pp.155-161
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• 2009

최근 자동차용 도료의 가장 큰 관심 중에 한 가지는 도장공정을 줄여 생산성 및 환경친화성을 높이는 "compact coating process"이다. 그 중에서 pre-primed 도료는 기존의 전착도료와 primer 도료를 대체하는 도료로서 각광받고 있는 기술이다. 용접이 가능한 weldable pre-primed 도료에서 가장 중요한 물성은 유연성, 내식성, 용접성 등이다. 본 연구에서는 부착성과 유연성이 우수한 polyester resin, 이를 개량하여 유연성을 극대화한 elastomeric polyester resin을 합성하였고, 내구성과 물리적 성질이 우수한 polyvinyliedene fluoride resin을 합성한 후 경화거동 및 인장물성 등을 평가하였다. elastomeric polyester resin을 사용한 도료시스템이 유연성 및 부착성 측면을 고려했을 때, pre-primed 도료시스템에 적용하기에 가장 적합하였다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.377-377
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• 2012

Microprocessor technology now relies on copper for most of its electrical interconnections. Because of the high diffusivity of copper, Atomic layer deposition (ALD) $TaN_x$ is used as a diffusion barrier to prevent copper diffusion into the Si or $SiO_2$. Another problem with copper is that it has weak adhesion to most materials. Strong adhesion to copper is an essential characteristic for the new barrier layer because copper films prepared by electroplating peel off easily in the damascene process. Thus adhesion-enhancing layer of cobalt is placed between the $TaN_x$ and the copper. Because, cobalt has strong adhesion to the copper layer and possible seedless electro-plating of copper. Until now, metal film has generally been deposited by physical vapor deposition. However, one draw-back of this method is poor step coverage in applications of ultralarge-scale integration metallization technology. Metal organic chemical vapor deposition (MOCVD) is a good approach to address this problem. In addition, the MOCVD method has several advantages, such as conformal coverage, uniform deposition over large substrate areas and less substrate damage. For this reasons, cobalt films have been studied using MOCVD and various metal-organic precursors. In this study, we used $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) as a cobalt precursor because of its high vapor pressure and volatility, a liquid state and its excellent thermal stability under normal conditions. Furthermore, the cobalt film was also deposited at various $H_2/NH_3$ gas ratio(1, 1:1,2,6,8) producing pure cobalt thin films with excellent conformality. Compared to MOCVD cobalt using $H_2$ gas as a reactant, the cobalt thin film deposited by MOCVD using $H_2$ with $NH_3$ showed a low roughness, a low resistivity, and a low carbon impurity. It was found that Co/$TaN_x$ film can achieve a low resistivity of $90{\mu}{\Omega}-cm$, a low root-mean-square roughness of 0.97 nm at a growth temperature of $150^{\circ}C$ and a low carbon impurity of 4~6% carbon concentration.