• 상하수도학회지
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• 제23권5호
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• pp.669-678
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• 2009

The reduction of excess activated sludge from petrochemical plant was investigated by the electro fenton (E-Fenton) process using electrogenerated hydroxyl radicals which lead to mineralization of activated sludge to $CO_2$, water and inorganic ions. Factors affecting the disintegration efficiency of excess activated sludge in E-Fenton process were examined in terms of five criteria: pH, $H_2O_2/Fe^{2+}$ molar ratio, current density, initial MLSS (mixed liquid suspended solids) concentration, $H_2O_2$ feeding mode. TSS total suspended solid and $TCOD_{cr}$ reduction rate increased with the increasing $H_2O_2/Fe^{2+}$ molar ratio and current density until 42 and $6.7 mA/cm^2$, respectively but further increase of $H_2O_2/Fe^{2+}$ molar ratio and current density would reduce the reduction rate. On the other hand, as expected, increasing pH and initial MLSS concentration of activated sludge decreas TSS and $TCOD_{cr}$ reduction rate. The E-Fenton process was gradually increased during first 30 minutes and then linearly proceed till 120 minutes. The optimal E-Fenton condition showed TSS reduction rate of 62~63% and $TCOD_{cr}$ (total chemical oxygen demand) reduction rate of 55~56%. Molar ratio $H_2O_2/Fe^{2+} = 42$ was determined as optimal E-Fenton condition with initial $Fe^{2+}$ dose of 5.4 mM and current density of $6.7{\sim}13.3 mA/cm^2$, initial MLSS of 7,600 mg/L and pH 2 were chosen as the most efficient E-Fenton condition.

• 대한환경공학회지
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• 제33권10호
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• pp.709-716
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• 2011

전해질 농도가 낮은 병원폐수를 전기화학적으로 처리할 경우 무기응집제 주입 효과에 대해 고찰한 결과, 무기응집제 주입으로 전해질 농도가 높아져 병원폐수 내 유리염소의 농도의 증가로 유기물질의 간접산화효과가 증가하여 전류밀도 $1.76A/dm^2$, 반응시간 120분에서 무기응집제를 주입하지 않은 경우보다 COD 제거효율이 약 2배 향상되었다. 또한, 무기응집제에 의한 전해질의 증가로 HOCl과 같은 유리 잔류염소의 증가로 병원폐수 내의 클로라민이 질소로 전환되는 속도가 증가함에 따라 전류밀도 $1.76A/dm^2$, 반응시간 120분 및 응집제 주입량 700 ppm에서 T-N 제거율을 약 2배 향상시킬 수 있었다. 동일 조건에서 90% 이상의 높은 T-P 제거율을 얻을 수 있었는데, 이는 무기응집제에 의한 전해질의 증가로 양전극에서의 발생되는 용존산소에 의해 생성된 불용성 금속 화합물과 인산염의 화학적 흡착반응 속도가 증가하였기 때문인 것으로 판단된다. 이상의 실험에서 전해질이 부족한 병원폐수의 전기화학적 처리시 무기응집제를 전해질로 첨가할 경우 유기물질 및 영양염 제거에 모두 매우 효과적임을 알 수 있었다.

• Journal of Korean Vacuum Science & Technology
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• 제3권1호
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• pp.79-84
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• 1999

the photolithographic patterning on an indium-tin oxide (ITO) glass and the electro-phoretic deposition were combined for preparing the screen of the full-color field emission display(FED). the patterns with a pixel of 400$\mu\textrm{m}$ on the ITO-glass were made by etching the ITO with well-prepared etchant consisting of HCL, H2O, and HNO3. Electrophoretic method was carried out in order to deposit each spherical red (R), green(G), and blue (B) phosphor on the patterned ITO-glass. The process parameters such as bias voltage, salt concentration, and deposition time were optimized to achieve clear boundaries. It was found that the etching process of ITO combined with electrophoretic method was cost-effective, provided distinct pattern, and even reduced process steps compared with conventional processes. The application of reverse bias to the dormant electrodes while depositing the phosphors on the stripe pattern was found to be very critical for preventing the cross-contamination of each phosphor in a pixel.

• Tribology and Lubricants
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• 제33권6호
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• pp.282-287
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• 2017

SU-8 is an epoxy-type photoresist widely used for the fabrication of high-aspect-ratio (HAR) micro-structures in micro-electro-mechanical systems (MEMS). To fabricate highly integrated structures, chemical mechanical polishing (CMP) has emerged as the preferred manufacturing process for planarizing the MEMS structure. In SU-8 CMP, an oxidizer decomposes organic impurities and particles in the CMP slurry remove the chemically reacted surface of SU-8. To fabricate HAR microstructures using the CMP process, the adhesion between SU-8 and substrate material is important to avoid the delamination of the SU-8 film caused by the mechanical-dominant material removal characteristic. In this study, the friction force during the CMP process is measured with a CMP monitoring system to detect the delamination phenomenon and investigate the delamination of the SU-8 film from the silicon substrate under various pressure conditions. The increase in applied pressure causes an increase in the frictional force and wafer-edge stress concentration. The frictional force measurement shows that the friction force changes according to the delamination phenomenon of the SU-8 film, and that it is possible to monitor the delamination phenomenon during the SU-8 CMP process. The delamination at a high applied pressure is explained by the effect of stress distribution and pad deformation. Consequently, it is necessary to control the pressure of polishing, which can avoid the delamination in SU-8 CMP.

• 한국세라믹학회지
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• 제40권6호
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• pp.553-559
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• 2003

PDP(Plasma Display Panel) rib은 고정세의 패턴 설계 및 복잡, 다양한 공정으로 제조되고 있다. Rib은 PDP제조 공정 및 역할상 매우 중요한 부분의 하나이며 rib의 소결 정도는 cross-talk와 같은 현상을 방지하는 데에 중요한 역할을 한다. 저렴하고 높은 양산성을 가진 rib은 주로 스크린 프린팅법에 의해 제작되지만, 인쇄, 소성 등 일련의 제조 공정을 거친 후 얻어진 수백 $\mu\textrm{m}$ 미세규격의 격벽 소결체의 소결도를 정확히 평가하기는 쉽지 않다. 본 연구에서는 rib의 소결도를 직접적 판단할 수 있는 방법에 대한 연구의 일환으로서 주로 소결 말기에 나타나는 기공의 응집, 성장을 potentiostat로 기공에서의 절연 파괴, 전계 집중의 원리를 이용함으로서 소결도를 측정했다 이 측정값은 각 온도에서 열처리한 시편에 대한 밀도값과 유사한 경향성이 나타남을 확인할 수 있었다 개기공, 폐기공의 분포에 따라 예상될 수 있는 측정오차는 온도에 따른 미세구조의 변화를 수차례의 전자 현미경 관찰을 통해 확인, 검증하여 미세규격 rib 소결도의 판단을 전기화학적 방법으로 예측 가능하다는 것을 알 수 있었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집A
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• pp.87-92
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• 2001

In this paper, high strength pressure vessel steels having the same chemical compositions were manufactured by the two different steel-making processes, such as vacuum degassing(VD) and electro-slag remelting(ESR) methods. After the steel-making process, they were normalized at $955^{\circ}C$, quenched at $843^{\circ}C$, and finally tempered at $550^{\circ}C$ or $450^{\circ}C$, resulting in tempered martensitic microstructures with different yielding strengths depending on the tempering conditions. Low-cycle fatigue(LCF) tests, fatigue crack growth rate(FCGR) tests, and fracture toughness tests were performed to investigate the fatigue and fracture behaviors of the pressure vessel steels. In contrast to very similar monotonic, LCF, and FCGR behaviors between VD and ESR steels, a quite difference was noticed in the fracture toughness. Fracture toughness of ESR steel was higher than that of VD steel, being attributed to the removal of impurities in steel-making process.

• Macromolecular Research
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• 제14권4호
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• pp.430-437
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• 2006

The ultra-drawing process of an ultra high molecular weight polyethylene (UHMWPE) gel film was examined by incorporating linear low-density polyethylene (LLDPE) and $BaTiO_3$ nanoparticles. The effects of LLDPE and the draw ratios on the morphological development and mechanical properties of the nanocomposite membrane systems were investigated. By incorporating $BaTiO_3$ nanoparticles in the UHMWPE/LLDPE blend systems, the ultra-drawing process provided a highly extended, fibril structure of UHMWPE chains to form highly porous, composite membranes with well-dispersed nanoparticles. The ultra-drawing process of UHMWPE/LLDPE dry-gel films desirably dispersed the highly loaded $BaTiO_3$ nanoparticles in the porous membrane, which could be used to form multi-layered structures for electronic applications in various embedded, printed circuit board (PCB) systems.

• Tribology and Lubricants
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• 제36권1호
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• pp.1-10
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• 2020

Large-area two-dimensional (2D) materials synthesized by chemical vapor deposition on donor substrates are promising functional materials for conductors, semiconductors, and insulators in flexible and transparent devices. In most cases, 2D materials should be transferred from a donor substrate to a target substrate; however, 2D materials are prone to damage during the transfer process. The damages to 2D materials during transfer are caused by contamination, tearing, and chemical doping. For the commercialization of 2D materials, a damage-free, large-area, and productive transfer process is needed. However, a transfer process that meets all three requirements has yet to be developed. In this paper, we review the recent progress in the development of transfer processes for 2D materials, and discuss the principles, advantages, and limitations of each process. The future prospects of transfer processes are also discussed. To simplify the discussion, the transfer processes are classified into four categories: wet transfer, dry transfer, mechanical transfer, and electro-chemical transfer. Finally, the "roll-to-roll" and "roll-to-plate" dry transfer process is proposed as the most promising method for the commercialization of 2D materials. Moreover, for successful dry transfer of 2D materials, it is necessary to clearly understand the adhesion properties, viscoelastic behaviors, and mechanical deformation of the transfer film used as a medium in the transfer process.

• 한국공작기계학회논문집
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• 제11권4호
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• pp.97-101
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• 2002

Recently, the need for transporting and manipulating minute amount of fluids in microscale channels (so-called micro-fluidics) has been increasing, especially in biotechnology and biochemical processing. This work demonstrates that the so-called mechano-chemical process which consists of mechanical abrasive action combined with chemical process can be used to f뮤ricate micro-fluidic channels more rapidly and cost effectively than other methods. In this work, capillary filling of fluids in micro-channels was investigated by theoretical approaches and experiments. From the experimental results, it is expected that a complex micro-fluidic system can be fabricated using the micro-fabrication technique and microsystem packaging method described in this work.

• 한국자원리싸이클링학회:학술대회논문집
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• 한국자원리싸이클링학회 2003년도 추계정기총회 및 국제심포지엄
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• pp.185-189
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• 2003

The effect of surface roughness of the substrate on HF-CVD diamond coating was researched. The surface roughness was changed variously by electro-chemical etching conditions. The etching process acted to remove the metallic cobalt from the WC-Co. Diamond nucleation density was higher in etched the substrate. Therefore, the etching process was effective in both Co-removal and higher surface roughness, leading to the improving the diamond nucleation and deposition.