• The Transactions of the Korean Institute of Electrical Engineers P
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• v.60 no.1
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• pp.45-47
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• 2011

Recently, research works for electrical properties on the elastic epoxy have been also progressing to diagnose insulation materials by development of measure technology. The epoxy which specially applied for high voltage instruments have required for the electrical, mechanical and thermal properties. Nanocomposites were made from insulating material epoxy resin using for power transformer as varying g amount of addition of SiO2, we found the change of physical characteristics of nanocomposites by using SEM and XRD. To investigate the electrical properties according to the amount of addition and temperature, tested insulting breakdown in silicon oil. As the result of insulting breakdown testing, the insulting breakdown strength increased according to change of the amount of addition.

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.298-303
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• 2000

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive- and supercondcuting-joint methods. For the resistive-joint, filler materials of wood metal, Pb/Sn, In, and silver paste were used, whereas, for the superconductive-joint, the lap joint method were used. In the resistive-joint tape, it was observed that the electrical properties such as current transport property, n-value, and contact resistance of the tape were significantly related to the resistivity of filler materials. On the other hand, in the superconducting-joint tape, the current transport property was dependent on the uniaxial pressure. Specifically, the current transport property varied 50 to 80% with uniaxial pressure, probably due to the irregular microstructure in the transition region.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.35 no.2
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• pp.52-57
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• 2003

The charcoal is known to have gas adsorption capability and electrical properties. Some practical applications of carbon materials for the purpose of limited electrical conduction were made in these days. In this paper, we applied the several different kinds of charcoal to the papers in three different ways to investigate if charcoal application method affects its electrical conduction capability. Wet end addition, making multiply, and coating method were tested. The area electrical resistivity of charcoal containing paper was measured. The strength properties of charcoal containing paper were compared to those of the control, which had no charcoal in it. Experimental results showed that manufacturing conditions of the charcoal itself changed its electrical and strength properties of charcoal containing paper. The electrical properties of charcoal containing paper can be used for the removal of electrostatic problem in packaging system. The strength property of the charcoal containing paper should be kept, at least, over the minimum requirement for the packaging system. By using coating method on paper or making multiply, strength loss of paper by inclusion of charcoal could be overcome.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.